US 8368201

US Patent 8368201: Method for Embedding a Component in a Base

Title: Method for embedding a component in a base

Assignee: Imberatek LLC (Current Assignee listed first, per provided text. Original Assignee: Imbera Electronics Oy)

Inventor: Risto TUOMINEN

Filing Date: July 18, 2011

Issue Date: February 5, 2013

Abstract: The patent describes a method for embedding semiconductor components, or at least some of them, into a base (such as a circuit board) during the base's manufacture. This involves creating through-holes for the components in the base, extending between its first and second surfaces. A polymer film is then spread over the second surface, covering these through-holes. Before or after partial hardening of the polymer film, the semiconductor components are placed into the holes from the first surface and pressed against the polymer film to adhere. The method also includes forming a conductive pattern in the base before component placement, with the component aligned relative to these patterns.

Plain-Language Overview of Independent Claim 1:

Independent Claim 1 describes an electronic module, not a method, with the following key features:

• A baseboard: This forms the foundation of the module, having a top (first) surface and a bottom (second) surface.
• A hardened insulating polymer layer: This layer is situated on the second (bottom) surface of the baseboard and is hardened to provide insulation.
• At least one component within the baseboard: One or more electronic components are embedded inside the baseboard. This component has contact areas on its first surface, and this first surface of the component is positioned directly against the hardened insulating polymer layer.
• Conductive patterns: These patterns are present on the hardened insulating polymer layer.
• Conductors within the hardened insulating polymer layer: These conductors are specifically designed to create electrical connections between at least some of the conductive patterns on the polymer layer and at least some of the contact areas of the embedded component.

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