Invalidity dossier
US 6166405
Solid-state imaging device
Current assignee: Collabo Innovations, Inc.
Added 9/16/2026, 2:49:45 PM
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Patent summary
Title, assignee, inventors, filing/issue dates, abstract, and a plain-language overview of the claims.
I'll search for this specific patent number across the requested sources.
Summary of US Patent 6,166,405 (US6166405A)
Search status: I searched for this exact number. Results were found for US6166405A itself (Google Patents, FreePatentsOnline, Sumobrain, EveryPatent), but no CAFC 2026 docket entries were found — searches for "6166405" combined with Federal Circuit / 2026 appeal terms returned zero results. I therefore cannot confirm any 2026 appellate activity, and I will not speculate. What follows is grounded in the authoritative patent text and the citing/reference hits returned by search.
Bibliographic data
| Field | Value |
|---|---|
| Patent number | US 6,166,405 A (application US09/295,061) |
| Title | Solid-state imaging device |
| Inventors | Toshihiro Kuriyama; Syouji Tanaka |
| Original assignee | Matsushita Electronics Corporation |
| Later chain of title | Matsushita Electric Industrial Co., Ltd. (merger, 2001‑07‑17) → Panasonic Corporation (name change, 2014‑01‑08) → Collabo Innovations, Inc. (assignment, 2014‑05‑26); a lien record also appears 2014‑01‑13 |
| Filing date | 1999‑04‑20 |
| Priority date | 1998‑04‑23 (JP 10‑113357); second JP priority JP 10‑235826, 1998‑08‑21 |
| Issue date | 2000‑12‑26 |
| Legal status | Expired – Lifetime (anticipated expiration 2019‑04‑20) |
| Claims | 12 total; independent claims 1 and 7 (device claims only — no method claims issued, despite the specification describing methods) |
| Related family member | JP 3103064 B2; family ID 26452346 |
Sources: https://patents.google.com/patent/US6166405/en · https://www.freepatentsonline.com/6166405.html · https://www.sumobrain.com/patents/us/Solid-state-imaging-device/6166405.html
Abstract (as issued)
A solid-state imaging device comprises a plurality of pixels, each pixel comprising a semiconductor substrate; a photo-receiving portion formed in the semiconductor substrate; a detecting region formed in the semiconductor substrate; an insulating film formed on the semiconductor substrate; a gate electrode formed on the insulating film above the region between the photo-receiving portion and the detecting region; and a read-out circuit electrically connected to the detecting portion. A reflection reducing film is formed on the insulating film above the region including at least one part of the photo-receiving portion and excluding at least one part of the detecting portion.
Independent claim 1 — plain language
A MOS/CMOS-type imaging device made of many pixels, where each pixel has:
- a semiconductor substrate;
- a photo-receiving portion (photodiode) in the substrate;
- a diffusion region in the substrate (the drain/detecting node across the gate);
- a first insulating film (gate oxide) on the substrate;
- a gate electrode on that insulating film, positioned at least between the photo-receiving portion and the diffusion region; and
- a read-out circuit electrically connected to either the photo-receiving portion or the diffusion region (i.e., covers both the 4-transistor FD-transfer architecture and the 3-transistor architecture).
The point of novelty: an anti-reflection film sits on the first insulating film over a region that includes at least part of the photo-receiving portion but excludes at least part of the diffusion region, and that film's material has a refractive index lower than silicon (~3.49) and higher than silicon oxide (~1.46) — e.g., silicon nitride. The dielectric stack (AR film + gate oxide + overlying interlayer oxide) creates an optical interference effect that cuts surface reflection (specification: ~25% reflectance without the film vs. ~10% with a 20 nm silicon nitride film on a 9 nm oxide).
Independent claim 7 — plain language
Substantively the same device and the same reflection-reducing-film limitation as claim 1, with one drafting difference: the gate electrode is recited as formed "above the semiconductor substrate" at least between the photo-receiving portion and the diffusion region, rather than "on the first insulating film." Claims 1 and 7 are otherwise parallel; the difference is a claim-differentiation/scope distinction concerning how the gate electrode's position relative to the insulating film is expressed.
Dependent claims 2–6 (mirrored by 8–12)
- 2 / 8 — AR film is not in contact with the side of the gate electrode on the diffusion side (avoids steps/curves of stressed nitride in the high-field region, reducing image-quality degradation).
- 3 / 9 — AR film is not formed over at least part of the gate electrode region (leaves access for hydrogen passivation to suppress dark current).
- 4 / 10 — AR film is at least one of: silicon nitride, silicon oxynitride, cerium oxide, titanium oxide, tantalum oxide, zirconium oxide (single or multilayer).
- 5 / 11 — AR film thickness 20–100 nm (specification prefers 40–70 nm, ~60 nm).
- 6 / 12 — a second insulating film is formed on the AR film.
Litigation / enforcement (per Google Patents annotations)
- Two US District Court, District of Delaware cases are listed in the Unified Patents litigation data: 1:15‑cv‑00608 and 1:14‑cv‑01093 (https://portal.unifiedpatents.com/litigation/Delaware%20District%20Court/case/1%3A15-cv-00608 and …/1%3A14-cv-01093). These are consistent with the 2014 Collabo Innovations acquisition and the 2019 patent expiry.
- A Darts‑ip "first worldwide family litigation" record exists (family 26452346).
- Uncertainty: I could not retrieve party names, outcomes, or any CAFC 2026 docket from my searches. The patent expired 2019‑04‑20, so any 2026 appellate activity would most plausibly be a damages/licensing remnant or an appeal in a related matter — but I have no authoritative confirmation and am not asserting one.
Corroboration from citing art
US 6,794,215 (Hyundai Electronics) lists "6166405 | Solid-state imaging device | 2000‑12‑26 | Kuriyama et al. | 257/290" as an examiner-cited reference, independently confirming the number, title, issue date, inventor surname, and US class 257/290 (https://www.freepatentsonline.com/[6794215](/patent/6794215).html). Later anti-reflection-film work, e.g. US 7,049,671 ("Solid-state imaging device with antireflection film"), cites this disclosure as background.
Note on identifiers: the number was queried literally as 6166405. It resolves to US6166405A; the comma-separated form "6,166,405" is the same patent, not a different one.
Generated 9/16/2026, 6:45:27 PM
Cases on file (3)
Group view →Specific litigation cases in our database that name US patent 6166405. The free-form analysis below may also discuss cases beyond this list.
Lawsuits filed per year
- Collabo Innovations, Inc. v. OmniVision Technologies, Inc.filed Mar 29, 20161:16-cv-00197D. Del.active
Defendants: OmniVision Technologies, Inc.
Other patents asserted: 7411180, 8592880, 7944493, 7728895, 8004026
- Collabo Innovations, Inc. v. Toshiba Corporation et al.filed Jul 16, 20151:15-cv-00608D. Del.pending
Defendants: Toshiba Corporation, Toshiba America Inc., Toshiba America Electronic Components Inc.
- Collabo Innovations, Inc. v. Aptina (U.S.) Inc.filed Aug 22, 20141:14-cv-01093D. Del.terminated Oct 19, 2015closed
Defendants: Aptina (U.S.) Inc.
Litigation summary
Past and pending lawsuits — plaintiffs, defendants, jurisdictions, outcomes, and notable rulings.
I'll research litigation involving US patent 6166405. Let me start with several searches.
Let me dig deeper into the two Delaware cases and check whether '605 was specifically asserted.
Let me check the specific patents-in-suit in those cases and search PTAB/other records for '605 specifically.
Litigation involving US 6,166,405
Bottom line / important caveat up front: The authoritative Google Patents record for US 6,166,405 ("Solid-state imaging device," Kuriyama & Tanaka, orig. assignee Matsushita Electronics Corp., priority 1998‑04‑23, granted 2000‑12‑26, now assigned to Collabo Innovations Inc.) does not list any case in which the '605 patent itself is identified by number as the asserted patent. What it lists are two U.S. cases flagged as "Family has litigation" — i.e., litigation tied to the patent's worldwide family (Darts‑ip family ID 26452346), which includes later Collabo/Panasonic continuations such as U.S. 7,411,180; 8,592,880; 7,944,493; 7,728,895; and 8,004,026 (all titled around solid‑state imaging devices). I could not confirm from the available search results that the '605 patent was specifically named as a patent‑in‑suit in either case. I flag that explicitly rather than assert it.
Cases linked to the '605 patent family on the Google Patents record
Both of the listed cases are Delaware District Court patent cases, and both are Collabo Innovations (Wi‑LAN affiliate) image‑sensor suits against Panasonic‑derived patents:
| # | Case | Plaintiff | Defendant(s) | Jurisdiction | Case No. | Filed | Status/Outcome |
|---|---|---|---|---|---|---|---|
| 1 | Collabo Innovations Inc. v. Aptina (U.S.) Inc. et al | Collabo Innovations, Inc. | Aptina (U.S.) Inc. + 3 others | D. Del. (Judge Sue L. Robinson; referred Mag. Sherry R. Fallon) | 1:14‑cv‑01093 | 2014‑08‑22 | Closed 2015‑10‑19 (~424 days); 5 patents‑in‑suit; cause of action: willful patent infringement. Termination typically reflects settlement/voluntary dismissal (not confirmed). |
| 2 | Collabo Innovations Inc. v. Toshiba Corporation et al | Collabo Innovations, Inc. | Toshiba Corporation; Toshiba America Inc.; Toshiba America Electronic Components Inc. | D. Del. (Judge Sue L. Robinson) | 1:15‑cv‑00608 | 2015‑07‑16 | Filed/ongoing as of the record; outcome not confirmed in available sources. |
Sources:
- Google Patents "Family has litigation" links:
https://portal.unifiedpatents.com/litigation/Delaware%20District%20Court/case/1%3A15-cv-00608and.../case/1%3A14-cv-01093 - RPX Insight, Collabo Innovations Inc. v. Aptina (U.S.) Inc. et al, 1:14‑cv‑01093 (filed 08/22/2014; closed 10/19/2015):
https://insight.rpxcorp.com/litigation/dedce-55624-collabo-innovations-v-aptina - UniCourt docket summary, Collabo Innovations Inc. v. Toshiba Corporation et al, 1:15‑CV‑00608 (filed 07/16/2015, D. Del., Judge Robinson):
https://unicourt.com/case/rc-db1-collabo-innovations-inc-v-toshiba-corporation-et-al-205861 - Darts‑ip worldwide family litigation record:
https://patents.darts-ip.com/?family=26452346
Closely related family litigation (same patent family / same portfolio, but NOT the '605 patent)
Because the family flag can be driven by sibling patents, the following Collabo case is worth noting for context, but the patents‑in‑suit there were U.S. 7,411,180; 8,592,880; 7,944,493; 7,728,895; 8,004,026 — not the '605 patent:
- Collabo Innovations, Inc. v. OmniVision Technologies, Inc., No. 1:16‑cv‑00197 (D. Del.), filed 2016‑03‑29, Judge Sue L. Robinson; Magistrate Fallon claim‑construction opinion (Aug. 25, 2017). Accused: OmniVision OV7740 image sensor / Nintendo Wii U Gamepad camera modules. Court denied OmniVision's motion to transfer and granted‑in‑part its motion to dismiss the indirect‑infringement claims. Source:
https://www.courtlistener.com/docket/4499525/collabo-innovations-inc-v-omnivision-technologies-inc/and the vLex opinion summary.
Other Collabo suits in the same Wi‑LAN semiconductor campaign (different patents, e.g., U.S. 5,977,613 and 7,930,575) — ASE (D. Del. 1:15‑cv‑00783), Amkor, Siliconware (E.D. Tex. 6:15‑cv‑00970), Sony (D. Del. 1:15‑cv‑01094), and Qualcomm (W.D. Tex. 6:24‑cv‑00472) — are not known to involve the '605 patent and I did not find any tying '605 to them.
Additional notes / limitations
- No PTAB proceeding against US 6,166,405 surfaced in the available search results (the IPR2025‑01015 Qualcomm v. Collabo petition concerns U.S. 7,930,575, not '605). I cannot rule out older PTAB activity, but nothing indicates it.
- The '605 patent is recorded as "Expired – Lifetime" with an anticipated expiration of 2019‑04‑20 (20 years from the 1999‑04‑20 U.S. filing date). Regardless of the family litigation, the '605 patent could not be asserted after 2019.
- What I could NOT verify: that US 6,166,405 was named as an asserted patent (patent‑in‑suit) in 1:14‑cv‑01093 or 1:15‑cv‑00608, or the specific outcome of 1:15‑cv‑00608. The available sources list the family/portfolio connection, and the Aptina case is described as having "5 Patents‑in‑Suit" without an enumeration showing '605. To confirm patent‑by‑patent assertion, one would need the actual complaints/dockets via PACER or the Unified Patents case pages for those two case IDs.
If you need certainty on which specific patent numbers were asserted, the authoritative next step is to pull the D. Del. complaints for 1:14‑cv‑01093 and 1:15‑cv‑00608 directly (PACER / CourtListener / the Unified Patents case pages cited above) and check the "patents‑in‑suit" caption.
Generated 9/16/2026, 6:45:31 PM
Proceedings on file (0)
All PTAB activity →AIA trial proceedings (IPR / PGR / CBM) filed at the USPTO Patent Trial and Appeal Board against this patent. Sourced from the USPTO Open Data Portal and refreshed every six hours; each proceeding number deep-links to the PTAB E2E docket.
Current assignee: Collabo Innovations, Inc.
No PTAB proceedings on file. This patent has not been challenged via IPR, PGR, or CBM. The absence is itself a signal — well-asserted patents eventually attract IPRs. The LLM analysis below may surface filings the ODP feed hasn’t indexed yet.
PTAB challenges
AIA trial proceedings at the USPTO Patent Trial and Appeal Board — IPR, PGR, and CBM. Petitioners, judge panels, claim-level invalidation outcomes from Final Written Decisions, and Federal Circuit appeals. The single most important defensive datapoint after litigation history.
I'll verify the ODP's "no proceedings" result against public sources before concluding.
Let me search more specifically for this patent number and its litigation family.
Let me check the specific Delaware litigations and search for any IPR naming this patent number.
PTAB Activity Report — US 6,166,405 ("Solid-state imaging device")
Prepared: 2026-09-16 · Analyst role: PTAB / AIA-trial practice
Sources: USPTO ODP structured "PTAB proceedings on file" block (canonical); full patent text at patents.google.com/patent/US6166405/en; targeted web search of PTAB/CAFC/litigation reporting.
Proceedings overview
Total AIA trial proceedings on US 6,166,405: 0 — zero active, zero with claims invalidated, zero with claims sustained, zero settled, zero with institution denied. The USPTO Open Data Portal returns no AIA trial proceedings for this patent as of the most recent ingest, and my web searches surfaced no IPR, PGR, or CBM naming this patent number; the Patent Owner (Collabo Innovations, Inc., and before it Matsushita/Panasonic) has been highly active at the PTAB and in district court, but on other patents in its portfolio (see "Adjacent proceedings" below), which is why "no activity on file" here should not be assumed to be a data gap. The defensive posture is therefore not "the patent is hardened by surviving IPRs" — it is "the patent has never been tested at the PTAB, and it expired on 2019-04-20," which means the decisive defense is a damages/expiration argument under § 286 rather than an AIA-trial record. No IPR estoppel exists on any side, so every § 102/§ 103 ground remains open.
Proceedings on this patent
No AIA trial proceeding to report
There is no proceeding number to list for US 6,166,405. Per the operating rule against inventing or transposing proceeding numbers, I am not populating the per-proceeding template with the numbers I found for other Collabo patents.
- Type: N/A
- Filed: N/A
- Status: N/A — no AIA trial on file (USPTO ODP)
- Judge panel: N/A
- Petition grounds: N/A
- Institution decision: N/A
- Final Written Decision: N/A
- Settlement / termination: N/A
- Appeal: N/A for this patent
- Defensive value: The absence of any PTAB record cuts both ways. There is no FWD to hand a judge or an adversary, and no claim has been canceled — but equally, no prior petitioner has spent the money to build an invalidity record, and no § 315(e)(2) estoppel limits what you may raise. If you are being asserted against today, your leverage comes from the calendar, not the PTAB docket: the patent is Expired – Lifetime, with an anticipated expiration of 2019-04-20 (20 years from the 1999-04-20 US filing date).
What I found instead (adjacent, does NOT cover this patent)
Flagged so that a docket-conflict check does not trip you up. Each of these is a real proceeding, but each involves a different patent number — none is US 6,166,405.
| Proceeding | Parties | Patent at issue | Outcome as reported | Confidence |
|---|---|---|---|---|
| IPR2016-00940 | Sony Corp. v. Collabo Innovations, Inc. (filed 2016-04-22) | US 8,030,724 | FWD 2017-10-20 (panel: Chagnon, Anderson, McKone; opinion by Chagnon); appealed, Fed. Cir. No. 2018-1368 | Moderate — from third-party PTAB tracker (Patexia summary); claims challenged 1–4; I could not verify the claim-level disposition from a primary document |
| IPR2019-01523 and IPR2019-01524 | Advanced Micro Devices, Inc. v. Collabo Innovations, Inc. | US 7,930,575 | Institution denied — Paper 18, 2020-03-27 and Paper 13, 2020-03-30; PO's narrow claim-scope arguments in its POPRs carried the day | Moderate — the denial decisions and papers are listed as exhibits in a later petition (ptacts.uspto.gov petition document) |
| IPR2025-01015 | Qualcomm Inc. et al. v. Collabo Innovations Inc. (filed 2025-05-20) | US 7,930,575 | Discretionary denial 2025-10-10; petitioner then moved to terminate, refund approved 2025-10-21 | Higher — case detail with paper list (ipverse tracker) |
These matter only as pattern evidence (see below). They say nothing about the validity of US 6,166,405.
Strategic summary
Claim status: every claim of US 6,166,405 is UNTESTED and stands as issued. Claims 1–12 are all apparatus claims. Claims 1–6 form one set (claim 1 recites the gate electrode "formed on the first insulating film"), and claims 7–12 are a parallel set (claim 7 recites the gate electrode "formed above the semiconductor substrate"), each set closing with the same dependent limitations — no-contact with the gate sidewall near the diffusion region, exclusion of at least part of the gate region, the material list (silicon nitride, silicon oxynitride, cerium oxide, titanium oxide, tantalum oxide, zirconium oxide), a 20–100 nm thickness, and a second insulating film on the reflection reducing film. Because no claim was ever canceled or confirmed at the PTAB, there is no narrowing amendment, no certificate, and no survival narrative to work with — the claims as published in the patent are the claims you face. Note the claim sets are near-duplicates, so an invalidity theory aimed at claim 1 will generally map onto claim 7 as well; do not treat them as independent fallback positions.
Estoppel landscape: clean. With no IPR, PGR, or CBM on this patent, § 315(e)(2) estoppel binds no one — no petitioner, no privy, no real party in interest. Every prior-art ground, including art that was in the file wrapper, is available to a defendant in district court. Two procedural doors are nonetheless shut: PGR is unavailable (the patent's 1998 priority date predates the first-inventor-to-file provisions, so it is not PGR-eligible) and CBM review is unavailable (the AIA § 18 transitional program sunset on 2020-09-16, six years ago today). Ex parte reexamination remains available with no statutory estoppel, though its practical value is limited by the patent's expiry. The live constraint is § 315(b): once you are served with a complaint alleging infringement of the '405, you have one year to petition.
Pattern signals: no defensive aggregator; a serial, but picky, litigant. I found no Unified Patents (or similar aggregator) filing against this patent — the aggregator in the Collabo story appears in other contexts, not here. Collabo's enforcement pattern is a 2015–2016 Delaware/Texas wave followed by a long dormancy and then a 2024 W.D. Tex. campaign against Qualcomm (Judge Albright; Collabo Innovations, Inc. v. Qualcomm Inc., 6:24-cv-00472), all on other patents in the former Panasonic portfolio. Collabo is also a repeat PTAB participant on both sides — it successfully fended off AMD's IPRs on the '575 patent at institution, and it litigated retroactive-application constitutional challenges up to a Supreme Court cert petition in Collabo Innovations, Inc. v. Sony Corp., No. 19-601. The '405's two listed district court cases are Collabo v. Toshiba, D. Del. 1:15-cv-00608 and D. Del. 1:14-cv-01093. I could not verify the parties' identity in the 2014 case or the disposition of either case, and I am not aware with confidence of any Toshiba IPR against the '405 — if Toshiba had filed one, it would have been time-barred by its 2015 service date in any event. Treat both case outcomes as unverified.
Recommended next steps
- Lead with expiration, not invalidity. The patent expired 2019-04-20. Any complaint served in 2026 can reach only acts within the § 286 six-year lookback (i.e., on or after roughly 2020-09-16) — a window that falls almost entirely after expiry. Confirm the maintenance-fee and term-adjustment history in Patent Center before relying on this, since a term extension or a later-issued continuation could move the date. Verify at USPTO Patent Center.
- Confirm the zero-proceeding result at the source before you certify it to a client or a court: search the patent number in PTAB E2E / the PTAB trial docket at ptacts.uspto.gov and re-query the ODP. The ODP block is my canonical source, and it may lag very recent filings; my web searches (PTAB trackers, litigation databases, CAFC/Supreme Court reporting) surfaced nothing against this patent number.
- Check CourtListener for any Federal Circuit or Supreme Court treatment of the '405 at courtlistener.com. My searches found Fed. Cir. No. 2018-1368 and Supreme Court No. 19-601 in the Collabo corpus, but both trace to other patents (US 8,030,724 and US 5,952,714 respectively). I could not confirm that any appeal involving US 6,166,405 exists — and on the record available to me, none does.
- If you nonetheless want a PTAB filing (e.g., a co-defendant insists on an invalidity judgment): remember that an expired patent can still be the subject of an IPR on its merits, that § 315(b) gives you 12 months from service, and that a first-filed IPR on this patent would face no General Plastic / follow-on problem — there is no prior petition to be a "follow-on" to. But weigh that against the fact that a trial on an expired patent likely yields no more defensive value than the § 286 argument you already have.
- Do not represent that any claim of the '405 is canceled. On the record available, no claim of US 6,166,405 has ever been canceled by the PTAB. Any demand letter asserting claims 1–12 is asserting live, never-invalidated claims — the attack has to be built from scratch.
Caveat: the claim-level and status statements about US 6,166,405 itself are grounded in the authoritative patent text and the ODP structured block. All PTAB proceeding details in the "adjacent proceedings" table come from third-party trackers rather than primary PTAB documents, and I have flagged confidence levels accordingly; do not cite those dispositions without pulling the underlying papers.
Generated 9/16/2026, 6:45:48 PM
Ownership chain (5)
Asserters network →Structured records extracted from the assignment-history narrative below. Each entity links to its full ownership-network profile.
1999-04-20 · Assignment
Toshihiro Kuriyama and Syouji TanakaMatsushita Electronics Corporation
2001-07-17 · Merger
Matsushita Electronics CorporationMATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
internal reorg
2014-01-08 · Change of Name
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.PANASONIC CORPORATION
change of name only
2014-01-13 · Lien
COLLABO INNOVATIONS, INC.PANASONIC CORPORATION
securitization
2014-05-26 · Assignment
PANASONIC CORPORATIONCOLLABO INNOVATIONS, INC.
transfer-to-asserter
Assignment history
Inventors, original assignee, and the chain of ownership recorded with the USPTO — including the correspondent attorney who recorded each assignment, since shell-LLC chains often share one repeat-player attorney even when the entity names look unrelated. Surfaces NPE / patent-troll patterns: shell-entity transfers, known asserters in the chain, repeat correspondent fingerprints, pre-litigation assignments, and bankruptcy fire-sales.
I'll research the assignment chain and the entities involved before writing up the analysis.
Ownership & Assignment Analysis — US 6166405 A ("Solid-state imaging device")
Sources used: Google Patents legal-events data (authoritative full text supplied), RPX Insight / RPX Empower, GlobeNewswire (WiLAN corporate releases), Stanford NPE Litigation Database, UniCourt and Justia docket records, CourtListener (Qualcomm answer/counterclaim).
Not retrievable in this session: USPTO Assignment Center reel/frame numbers and the recorded correspondent field. Live queries to the Assignment Center index returned no usable payload, and Google Patents' legal-events feed does not expose reel/frame or correspondent data. I have therefore not fabricated reel/frame numbers or a correspondent name — see the explicit gaps flagged below.
Inventors
| Inventor | Employer at filing | Evidence |
|---|---|---|
| Toshihiro Kuriyama | Matsushita Electronics Corporation | Named as assignor on the 1999-04-20 assignment to Matsushita Electronics Corporation |
| Syouji Tanaka | Matsushita Electronics Corporation | Same 1999-04-20 assignment record |
Both inventors assigned to the same corporate employer on the filing date — a standard, unremarkable employment assignment. Pattern note: there is no evidence of the "all inventors depart within 12 months of filing" precursor. Neither the Google Patents record nor any secondary source I could retrieve shows inventor departures, separate inventor-held assignments, or inventor-initiated reversion. The inventors are Japanese nationals working for a Japanese semiconductor manufacturer, and the record is a single clean employer assignment.
The patent claims priority to two Japanese applications: JP 10-113357 (1998-04-23) and JP 10-235826 (1998-08-21); the JP family member is JP3103064B2. US filing 1999-04-20; issued 2000-12-26.
Original assignee
Matsushita Electronics Corporation (Google Patents also renders the successor's name as "MATUSHITA ELECTRIC INDUSTRIAL CO., LTD." — a probable transliteration inconsistency in the source record, not a separate entity).
- Line of business: Japanese semiconductor manufacturer within the Matsushita group; the patent's own specification is squarely directed to MOS/CMOS image sensors for small PC cameras and portable imaging devices, which was a real Matsushita product line.
- Shipped product? The claims disclose a structural pixel/fab improvement (reflection-reducing film over the photodiode with the drain/detecting region deliberately excluded). Matsushita was a volume manufacturer of CCD and MOS image sensors in this era, so an embodying product is highly likely — but I have no product-level documentary confirmation linking US 6166405 specifically to a shipped part number. Treat "practiced the claims" as probable, not proven.
- Current status: No longer independent. 2001 — merged into Matsushita Electric Industrial Co., Ltd. (USPTO merger record 2001-07-17). That entity changed its name to Panasonic Corporation (USPTO change-of-name recorded 2014-01-08, executed 2014-01-08). Panasonic remains an operating company; its semiconductor unit was later divested (reported transfer to Nuvoton Technology, completed 2020 — secondary-source, moderate confidence, not confirmed from an SEC filing in this session).
Assignment timeline
Reel/frame gap: the USPTO Assignment Center exposes reel/frame, execution date, recording date and correspondent for each of the four records below. The live index did not return payloads to this session and Google Patents' legal-event feed omits reel/frame entirely. The four records below are corroborated by Google Patents legal events (dates and parties are reliable); treat reel/frame and correspondent as "to be captured directly from Assignment Center" rather than confirmed.
1999-04-20 (executed) / recorded 1999-04-20 — Reel not retrieved
- Conveyance: Assignment of interest
- Assignor: Toshihiro Kuriyama and Syouji Tanaka (joint inventors)
- Assignee: Matsushita Electronics Corporation
- Correspondent: not retrieved — no firm or attorney identifiable from available sources.
- Context: Routine inventor-to-employer assignment of the original filing; not a commercial transfer.
2001-07-17 (executed) / recorded 2001-07-17 — Reel not retrieved
- Conveyance: Merger
- Assignor: Matsushita Electronics Corporation
- Assignee: Matsushita Electric Industrial Co., Ltd.
- Correspondent: not retrieved — typically in-house or a Japanese IP firm for this era of Matsushita merger recordings; unverified.
- Context: Internal corporate reorganisation — the operating subsidiary absorbed into the parent by statutory merger.
2014-01-08 (executed) / recorded 2014-01-08 — Reel not retrieved
- Conveyance: Change of name
- Assignor: Matsushita Electric Industrial Co., Ltd.
- Assignee: Panasonic Corporation
- Correspondent: not retrieved.
- Context: Name change only — no change in beneficial ownership. (The 2008 corporate rename was recorded at USPTO in 2014.)
2014-01-13 (executed) / recorded 2014-01-13 — Reel not retrieved
- Conveyance: Lien
- Assignor: Collabo Innovations, Inc.
- Assignee: Panasonic Corporation
- Correspondent: not retrieved.
- Context: Securitization / seller financing. Collabo Innovations is the grantor of a lien in favour of Panasonic — i.e. Panasonic appears to have retained a security interest in the transferred portfolio. Anomaly worth flagging: the lien is recorded before the assignment that conveys the patents to Collabo (2014-05-26), which is consistent with a staged closing on the WiLAN–Panasonic deal announced 2013-12-16, with a tranche of recordings in January 2014 and the remainder in May 2014. The direction of this record should be verified against the actual reel/frame instrument, since mislabelled conveyance types are common in aggregated feeds.
2014-05-26 (executed) / recorded 2014-05-26 — Reel not retrieved
- Conveyance: Assignment of interest
- Assignor: Panasonic Corporation
- Assignee: Collabo Innovations, Inc.
- Correspondent: not retrieved — this is the single most important field to capture on a re-query, because WiLAN's many subsidiary acquisitions were recorded repeatedly, and a recurring filing attorney here is the cleanest link across the whole Panasonic-to-WiLAN tranche.
- Context: Transfer to asserter / privateering-adjacent divestiture. WiLAN announced on 2013-12-16 a patent assignment agreement with Panasonic covering over 900 semiconductor patents and applications including CMOS image sensors, semiconductor packaging and LEDs, held through newly created subsidiary Collabo Innovations Inc. The 2014-05-26 record is Panasonic's conveyance of this patent into that vehicle.
Related-party data point (not an assignment record): in Collabo's Delaware campaign, plaintiff's counsel of record on Collabo Innovations Inc. v. Toshiba Corp., 1:15-cv-00608 (D. Del.) were Brian E. Farnan and Michael J. Farnan (Farnan LLP) and Monte M. Bond, Nicholas C. Kliewer, Patrick J. Conroy and Jeffrey R. Bragalone (Bragalone Conroy PC, Dallas). This is litigation counsel, not the assignment correspondent, and must not be conflated with the reel/frame correspondent field.
Timeline diagram
timeline
title Ownership of US 6166405
1998 : JP priority filings
: Inventors at Matsushita Electronics
1999 : US application filed
: Assigned to Matsushita Electronics
2000 : Patent issued 6166405
2001 : Merger into Matsushita Electric Industrial
2013 : WiLAN Panasonic deal announced 16 December
2014 : Renamed Panasonic Corporation
: Lien recorded Collabo as grantor to Panasonic
: Assigned to Collabo Innovations Inc
: Collabo sues Aptina in Delaware
2015 : Collabo sues Toshiba ASE Amkor and others
2019 : Patent term expires
2024 : Collabo sues Qualcomm in Western District Texas
NPE / troll-pattern signals
1. Shell-entity transfer — PRESENT.
Panasonic Corporation (large operating electronics manufacturer) conveyed this patent to Collabo Innovations, Inc., an entity created by Wi-LAN Inc. specifically to hold an acquired semiconductor portfolio. RPX reports the December 2013 WiLAN–Panasonic agreement covering over 900 semiconductor patents assigned to "a new WiLAN subsidiary, Collabo Innovations Inc." Collabo's principal place of business is Plano, Texas per Qualcomm's counterclaim in 6:24-cv-00472, and it has no products in commerce — only licence agreements (e.g. the STATS ChipPAC licence announced 2015-09-09). The 2014-05-26 recording is the operative shell-transfer link.
2. Known asserter in the chain — PRESENT.
Collabo Innovations, Inc. is a wholly owned subsidiary of Wi-LAN Inc. (now Quarterhill Inc.), a publicly traded patent assertion entity. Corroboration: RPX's November-2015 round-up lists "Collabo Innovations, Inc. (a subsidiary of Wi-Lan Inc.)" among PAE subsidiaries filing cases; the Stanford NPE Litigation Database categorises Collabo as an "Acquired patents" asserter; RPX Empower describes Collabo as "a Wi-LAN Inc. (WiLAN) subsidiary… litigating a portfolio of patents received in 2013 from Panasonic." This is the strongest single signal in the record.
3. Repeat correspondent across the chain — UNCLEAR / NOT VERIFIABLE.
I could not retrieve the correspondent of record for any of the four recordings, so I cannot test for recurrency across the chain or against Unified Patents / RPX asserter lists. This is a data gap, not a negative finding. It is the highest-value field to pull on a direct Assignment Center re-query: if one attorney or firm appears as correspondent on the 2014-01-13 lien and the 2014-05-26 assignment (and on the parallel recordings for the other ~900 Panasonic patents), that is a textbook repeat-player signal.
4. Cascading transfers — NOT PRESENT (marginal).
The chain is a single commercial divestiture, not a cascade of chained LLC-to-LLC flips. The only clustering is the two 2014 recordings five months apart (2014-01-13 lien, 2014-05-26 assignment), both tied to the same Panasonic–WiLAN transaction and both naming Collabo/Panasonic — i.e. stages of one deal rather than serial shell transfers. The upstream 1999 and 2001 records are unrelated employment/merger events. Caveat: Collabo is part of a family of WiLAN acquisition vehicles; I did not verify common principals or shared correspondent addresses across those siblings, because the correspondent field was unavailable.
5. Pre-litigation transfer — PRESENT.
The patents were conveyed by Panasonic to Collabo in the transaction announced 2013-12-16 with USPTO recordings on 2014-01-13 and 2014-05-26. Collabo's first Delaware infringement suit, Collabo Innovations Inc. v. Aptina (U.S.) Inc. et al, 1:14-cv-01093, filed 2014-08-22, followed the May 2014 recording by under three months — well inside the 6-month window. Google Patents flags this patent's family as having litigation in both 1:14-cv-01093 (Aptina, D. Del.) and 1:15-cv-00608 (Toshiba, D. Del.), i.e. the patents were pushed into suit almost immediately after the title records were cleaned up.
6. Bankruptcy fire-sale — NOT PRESENT.
Panasonic did not file Chapter 7/11 here. The December 2013 divestiture was a monetisation transaction by a solvent operating company, not a court-supervised sale. No bankruptcy docket, 363 sale, or claims-bar notice is associated with this chain.
7. Privateering — UNCLEAR.
The shape fits (operating company divests ~900 semiconductor patents to an NPE that then sues Toshiba, Sony, Amkor, ASE, Siliconware, Aptina, OmniVision, AMD and Qualcomm — Panasonic's own competitors). The 2014-01-13 lien naming Panasonic as assignee and Collabo as assignor is suggestive of Panasonic retaining a financial interest in the portfolio's performance, which would strengthen a privateering reading. However, I have no evidence of Panasonic directing or profiting from the assertions, and the lien record's direction may be an artifact of aggregated data. Marked unclear deliberately — the disclosed facts do not get me past "divestiture to an NPE that happens to sue Panasonic's competitors."
8. Defensive aggregator — NOT PRESENT.
The chain terminates at Collabo Innovations, Inc., an asserting licensor, not at RPX, AST, LOT Network, Unified Patents or OIN. There is no neutralisation event. Note that the patent reached its 2019-04-20 anticipated expiration ("Expired – Lifetime"); the asset has since lapsed, though Collabo continued asserting sibling patents from the same Panasonic tranche into 2024–2025 (e.g. US 7,930,575 against Qualcomm).
Verdict
NPE — high confidence.
Two strong signals plus one weaker one are documented on the available record. Signal 1 (shell-entity transfer): Panasonic Corporation conveyed this patent to Collabo Innovations, Inc. — an entity created solely to hold the ~900-patent Panasonic semiconductor portfolio — with the assignment recorded 2014-05-26, following a 2014-01-13 lien recording that names Panasonic as assignee and Collabo as assignor. Signal 2 (known asserter in the chain): Collabo Innovations, Inc. is a subsidiary of Wi-LAN Inc./Quarterhill, identified as a PAE subsidiary by RPX and categorised as an "Acquired patents" asserter by the Stanford NPE Litigation Database. Signal 5 (pre-litigation transfer): Collabo's first Delaware suit, 1:14-cv-01093 against Aptina, was filed 2014-08-22, roughly three months after the title was recorded. The single significant gap is the correspondent of record, which I could not retrieve and which would let me test the repeat-player signal — that field, plus the reel/frame numbers for the 2014-01-13 lien and 2014-05-26 assignment, should be pulled directly from Assignment Center before this analysis is finalised.
Verify at: https://assignmentcenter.uspto.gov/ and https://assignment.uspto.gov/patent/index.html (search patent number 6166405); patent text at https://patents.google.com/patent/US6166405/en
Supporting links: RPX on the WiLAN–Panasonic tranche (https://insight.rpxcorp.com/news/3739) · RPX on Collabo v. Qualcomm (https://litigation.rpxcorp.com/news/82807-wilan-s-collabo-hits-qualcomm) · WiLAN's 2013 Panasonic announcement, referenced in its 2014-10-20 release (https://www.globenewswire.com/en/news-release/2014/10/20/[1381357](/patent/1381357)/0/en/WiLAN-Concludes-Second-Patent-Agreement-With-Panasonic.html) · STATS ChipPAC Collabo licence (https://www.globenewswire.com/fr/news-release/2015/09/09/[1198524](/patent/1198524)/0/en/WiLAN-Subsidiary-Enters-into-License-Agreement-with-STATS-Chip-PAC.html) · Stanford NPE Database (https://npe.law.stanford.edu/patent/[5977613](/patent/5977613)) · Aptina case (https://insight.rpxcorp.com/litigation/dedce-55624-collabo-innovations-v-aptina) · Toshiba case counsel (https://unicourt.com/case/rc-db1-collabo-innovations-inc-v-toshiba-corporation-et-al-[205861](/patent/205861)) · Qualcomm counterclaim identifying Collabo's Plano Texas principal place of business (https://www.courtlistener.com/docket/69161440/43/collabo-innovations-inc-v-qualcomm-incorporated/) · Full Collabo docket list (https://dockets.justia.com/search?parties=Collabo%20Innovations%20Inc)
Generated 9/16/2026, 6:45:54 PM
Prior art
Earlier patents, publications, and products that may anticipate or render the claims unpatentable.
I'll research US patent 6166405 and its prior art citations.
Let me look for the examiner-cited prior art references (backward citations) on this patent.
Let me try to access the specific "References Cited" section on FreePatentsOnline and the patent PDF.
Analysis: US Patent 6,166,405 B1 — "Solid-State Imaging Device"
⚠️ Important Scope/Limitation Notice (read first)
You asked me to "look at each patent citation for 6166405" and assess § 102 anticipation. There is a critical distinction I must flag, because the two citation lists on this patent are different things:
| List | What it is | Can it anticipate 6,166,405 under § 102? |
|---|---|---|
| "References Cited" (a.k.a. backward citations, "U.S. Patent Documents" on the front page) | Prior art the examiner cited against the application during prosecution | Yes — these are the only candidates |
| "Cited By" (a.k.a. forward citations) | Later patents that cite 6,166,405 as prior art | No — they post-date it |
The authoritative text I was given for US 6,166,405 contains only the "Cited By (39)" table. It does NOT include the "References Cited" / "U.S. Patent Documents" section that appears on the patent's front page. My searches (FreePatentsOnline, Google Patents, EveryPatent, Sumobrain) returned the specification, claims, family, and forward-citation data, but not the examiner's backward-citation list.
Because of the strict no-fabrication rule, I will not invent prior-art patent numbers for an anticipation analysis. I could not verify any specific backward reference from a reliable source in this session, and inventing them would produce a false legal analysis. Below I give (1) what I can verify, (2) how to obtain the true "References Cited" list, and (3) a rigorous § 102 element-by-element framework you can apply the moment the real reference list is in hand.
1. Verified Patent Identification
| Field | Value |
|---|---|
| Patent number | US 6,166,405 B1 |
| Title | Solid-state imaging device |
| Application no. | US 09/295,061 |
| Inventors | Toshihiro Kuriyama; Syouji Tanaka |
| Original assignee | Matsushita Electronics Corporation |
| Current assignee (per Google Patents) | Collabo Innovations Inc |
| Filing date | 1999-04-20 |
| Publication/grant date | 2000-12-26 |
| Priority dates | 1998-04-23 (JP 10-113357) and 1998-08-21 (JP 10-235826) |
| Status | Expired – Lifetime (anticipated expiration 2019-04-20) |
| Family | US 6,166,405 A1; JP 3103064 B2 |
| Classifications | H10F39/011, H10F39/014, H10F39/18, H10F39/803, H10F39/805 |
Key point for § 102: the effective critical date is the 1998-04-23 Japanese priority date (and 1998-08-21 for subject matter added by the second JP filing). Any anticipating reference must predate that date.
Note: JP 3103064 B2 appears in the family but is the counterpart of the same invention (JP 10-235826), not prior art against itself.
2. The Independent Claims an Anticipating Reference Must Meet
Since anticipation must be claim-by-claim and element-by-element, here is what any single prior-art reference would need to disclose to anticipate:
Claim 1 requires ALL of:
- a plurality of pixels, each with a semiconductor substrate;
- a photo-receiving portion in the substrate;
- a diffusion region in the substrate;
- a first insulating film on the substrate;
- a gate electrode on the first insulating film, at least between the photo-receiving portion and the diffusion region;
- a read-out circuit electrically connected to either the photo-receiving portion or the diffusion region; and
- a reflection reducing film on the first insulating film, above a region including at least part of the photo-receiving portion AND excluding at least part of the diffusion region, where the film's refractive index is smaller than silicon (~3.49) and larger than silicon oxide (~1.46).
Claim 7 is the same subject matter with the gate electrode recited as "formed above the semiconductor substrate" (rather than "on the first insulating film").
Dependent claims 2–6 and 8–12 add:
- 2 / 8: reflection reducing film not in contact with the side of the gate electrode near the diffusion region;
- 3 / 9: film above a region excluding at least part of the gate-electrode region;
- 4 / 10: film is at least one of silicon nitride, silicon oxynitride, cerium oxide, titanium oxide, tantalum oxide, zirconium oxide;
- 5 / 11: film thickness 20–100 nm;
- 6 / 12: a second insulating film on the reflection reducing film.
The distinguishing feature the examiner presumably relied on (and which prior art must therefore show) is limitation 7: a partial reflection-reducing/anti-reflective layer that covers the photodiode but is deliberately absent over at least part of the diffusion/drain region.
3. The Citations That ARE Present in the Record — the "Cited By" (Forward) List
These are not prior art to 6,166,405 (all post-date 1998-04-23) and therefore cannot anticipate it under § 102. I list them because they are the "patent citations" present in the source, with dates, so you can see the technical field. (Table truncated at US 2009/0184344 A1 in the source text.)
| Publication | Priority date | Pub. date | Assignee | Title |
|---|---|---|---|---|
| US6268615B1 | 1999-06-21 | 2001-07-31 | National Science Council | Photodetector |
| US6271553B1 | 1999-11-29 | 2001-08-07 | United Microelectronics Corp. | Photo sensor in a photo diode |
| US2001/0023086A1 | 1999-12-28 | 2001-09-20 | Ki-Nam Park | Method for reducing dark current in image sensor |
| US6380030B1 | 1999-04-23 | 2002-04-30 | Taiwan Semiconductor Mfg. | Implant method for forming Si3N4 spacer |
| US2002/0196480A1 | 2001-06-26 | 2002-12-26 | Chong-Yao Chen | Structure of a CMOS image sensor |
| US6617623B2 | 1999-06-15 | 2003-09-09 | Micron Technology, Inc. | Multi-layered gate for a CMOS imager |
| US2003/0234432A1 | 2002-06-20 | 2003-12-25 | Samsung Electronics | Image sensor and method of fabricating the same |
| US2004/0075153A1 | 2000-11-13 | 2004-04-22 | Tomotaka Fujisawa | Semiconductor device and method for manufacturing the same |
| US2004/0129990A1 | 2002-12-27 | 2004-07-08 | Ju-Il Lee | Method for manufacturing CMOS image sensor using spacer etching barrier film |
| US2004/0188597A1 | 2003-01-06 | 2004-09-30 | Canon Kabushiki Kaisha | Photoelectric conversion device and method |
| US2004/0217436A1 | 2003-05-01 | 2004-11-04 | Renesas Technology Corp. | Solid-state imaging device |
| US2005/0001277A1 | 2003-07-03 | 2005-01-06 | Rhodes, Howard E. | Optimized transistor for imager device |
| US2005/0110002A1 | 2003-11-25 | 2005-05-26 | Canon Kabushiki Kaisha | Photoelectric conversion apparatus |
| US2005/0258501A1 | 2002-08-28 | 2005-11-24 | Sharp Kabushiki Kaisha | Light receiving element and method |
| US2005/0274995A1 | 2004-06-15 | 2005-12-15 | Samsung Electronics | Image sensor and method of forming the same |
| US2006/0033129A1 | 2004-08-16 | 2006-02-16 | Chandra Mouli | Low dark current image sensors |
| US2006/0061674A1 | 2004-09-03 | 2006-03-23 | Canon Kabushiki Kaisha | Solid state imaging device |
| US2006/0284223A1 | 2005-06-17 | 2006-12-21 | Dongbu Electronics | CMOS image sensor and method |
| US2007/0012963A1 | 2005-07-14 | 2007-01-18 | Dongbu Electronics | CMOS image sensor and method |
| US2007/0241375A1 | 2006-04-17 | 2007-10-18 | Jhy-Jyi Sze | Image sensor and method of forming the same |
| US2007/0241372A1 | 2006-04-18 | 2007-10-18 | Ching-Hung Kao | Image sensor device and method |
| US2008/0023737A1 | 2006-07-24 | 2008-01-31 | Dongbu Hitek | Image sensor and method |
| US2008/0029793A1 | 2006-08-02 | 2008-02-07 | Canon Kabushiki Kaisha | Photoelectric conversion device |
| US2008/0029798A1 | 2001-02-06 | 2008-02-07 | Renesas Technology Corp. | CMOS image sensor and method |
| US2008/0042170A1 | 2006-08-21 | 2008-02-21 | Chang Hun Han | Image Sensor and Method |
| EP1655780A3 | 2004-11-09 | 2008-03-12 | OmniVision Technologies | Image sensor and pixel having an anti-reflective coating over the photodiode |
| US2008/0120913A1 | 2004-03-31 | 2008-05-29 | Metalquimia, SA | (assignment likely mis-mapped) |
| US2008/0272419A1 | 2004-10-20 | 2008-11-06 | Sony Corporation | Solid-state imaging device |
| US2009/0020795A1 | 2007-07-18 | 2009-01-22 | Hiroyuki Doi | Solid-state imaging element |
| US2009/0140261A1 | 2007-12-03 | 2009-06-04 | Panasonic Corporation | MOS solid-state image device |
| US2009/0184344A1 | — | — | — | (truncated in source) |
Observation: Several forward citations attack the same concept (anti-reflective coating over photodiode; e.g., EP 1,655,780 A3, OmniVision), confirming that the "partial reflection-reducing layer over the photodiode but not the diffusion region" idea is the core inventive contribution — which is exactly why the examiner's backward cite list is the one that matters here and which I could not retrieve.
4. How to Get the Real "References Cited" List (and Why I Stopped)
Because the specification text provided omits the front-page reference list, the definitive prior-art citations must be pulled from a primary source. Recommended, in priority order:
- The patent's own front page (PDF, col. 1, "[56] References Cited") —
https://patentimages.storage.googleapis.com/b5/b1/9e/e0a420ffc8bdba/US6166405.pdf - USPTO PatentCenter / Patent Application 09/295,061 — the file wrapper lists Form PTO-892 (Notice of References Cited), the authoritative § 102/§ 103 citations.
- Espacenet / Global Dossier for the JP counterpart JP 3103064 B2 to see which JP references were cited against the corresponding claims there.
5. Confirmed Relevant Background Reference (in the patent itself, not examiner-cited)
The patent's own Background section describes two conventional structures, which function as admitted prior art but are not numbered citations:
- FIGS. 9 / 10 (conventional MOS imaging devices): photo-receiving portion + detecting portion/charge-drain portion + LDD portion, with an interlayer silicon-oxide film over the photodiode, a metal light-blocking film with an aperture, and a surface protection film — but no reflection-reducing film. The specification expressly states this prior arrangement gives ~25% visible-light reflectance (vs. ~10% with the invention). This is the closest admitted prior art and is the correct starting point for any § 103 obviousness argument.
Bottom Line
- Patent 6,166,405 verified exactly as you specified (not a similar number): US 6,166,405 B1, filed 1999-04-20, granted 2000-12-26, priority 1998-04-23, "Solid-state imaging device," Kuriyama et al., Matsushita → Collabo Innovations.
- I could not verify the examiner-cited ("References Cited") prior art from the supplied text or from the sources I reached. The source provided only the 39-item forward ("Cited By") list, which cannot anticipate under § 102 because it post-dates the 1998 priority date.
- I will not fabricate reference numbers or § 102 mappings. To complete the anticipation analysis you requested, obtain Form PTO-892 / the patent PDF front page (links above); once you provide that list, I can map each reference line-by-line against independent claims 1 and 7 and dependent claims 2–6 and 8–12 using the element framework in § 2 above.
If you can paste the front-page "[56] References Cited" list (or the PTO-892), I'll produce the full per-reference citation table with dates, descriptions, and specific § 102 anticipation mappings.
Generated 9/16/2026, 6:45:39 PM
Obviousness
Combinations of prior art that suggest the claimed invention would have been obvious under 35 U.S.C. § 103.
I'll first check what prior art the page actually surfaces, and try to retrieve the backward-citation (Patent Citations) list for US6166405, since the text you pasted contains a "Cited By" (forward-citation) table but not clearly the examiner-cited prior art.
The pasted page shows a "Cited By" (forward-citation) table but the backward-citation list appears truncated. Let me try to recover the examiner-cited prior art.
I found a highly relevant reference (JP-2000012817-A). Let me verify a few candidate pieces of prior art that appear in or around this family, including JP7-321368A (1995), which is pre-1998.
Obviousness Analysis — US 6,166,405 (35 U.S.C. § 103)
0. Evidentiary caveat about the "prior art on this page" (important)
Before analyzing, I have to flag a provenance problem with the record you supplied:
- The Google Patents page for US6166405A (https://patents.google.com/patent/US6166405/en) as pasted contains (a) "Prior art keywords/date" metadata (keywords: film, photo, state imaging, solid, imaging device; prior art date 1998‑04‑23), (b) the applicant's own Background description of conventional MOS/CMOS pixels (FIGS. 9 and 10), and (c) a "Cited By (39)" table. The text is truncated inside that table; the "Patent Citations" (examiner‑cited backward) list is not present in the material you gave me.
- The 39 "Cited By" entries are forward citations — later documents that cite US6166405. Almost all have priority dates after this patent's 1998‑04‑23 priority (earliest: US6268615B1, 1999‑06‑21; US6271553B1, 1999‑11‑29; US6380030B1, 1999‑04‑23; US20010023086A1, 1999‑12‑28). Under pre‑AIA § 102/§ 103 (this application was filed 1999‑04‑20, so pre‑AIA governs), those are not available as prior art — they neither published before the invention date nor were U.S. filings predating it, and a foreign priority date cannot be used to antedate a reference (In re Hilmer). I therefore cannot build a § 103 case out of the Cited‑By table, and I will not pretend otherwise.
- What is usable from this page is the applicant‑admitted prior art in the Background: the conventional active MOS pixel of FIG. 9 (photo‑receiving portion 53, detecting portion 54a, LDD 54b, insulating film 51, gate 52, plus amplification/reset/select transistors) and of FIG. 10 (photo‑receiving portion 63, charge drain 64a, LDD 64b, insulating film 61, gate 62), each with "an interlayer insulating film made of silicon oxide film … formed on the photo-receiving portion." Applicant admissions are prior art for § 103.
- I also located one genuinely pre‑1998 reference in the surrounding family art: JP7‑321368A (published 1995‑12‑08), listed as cited prior art in the reference list of OmniVision's anti‑reflection‑coating/photo‑diode patent family (see the Chinese grant CN100570879C, [56] 参考文献, at https://patentimages.storage.googleapis.com/3f/54/34/14e41ae6c59d30/CN100570879C.pdf). I could not retrieve JP7‑321368A's full text, so I treat its disclosure as unverified and ground my reasoning primarily on the admitted art plus the known AR‑coating design rule.
One more document worth naming but expressly not prior art here: JP‑2000012817‑A (NEC; priority 1998‑06‑24; published 2000‑01‑14; https://pubchem.ncbi.nlm.nih.gov/patent/JP-2000012817-A). It teaches a silicon‑nitride antireflection film over the photodiode whose refractive index is larger than that of the oxide and smaller than that of silicon, with "a part 15a … formed on the transfer electrode … removed to apply hydrogen from the outside." This is a near‑simultaneous, strikingly similar NEC development — strongly probative of what was obvious in the art as of mid‑1998, but it published after both the invention date and the U.S. filing date, so it is not § 102(a)/(b) art against this patent. I recommend verifying both it and JP7‑321368A against full texts before relying on either in a validity challenge.
1. The claims and the actual point of novelty
Claims 1–12 are all apparatus (device) claims. Notably, no method claims issued in this U.S. patent, even though the summary describes etching/implantation process claims. The surviving claims cover the structure:
Claim 1 — pixel comprising substrate / photo‑receiving portion / diffusion region / first insulating film / gate electrode "formed on the first insulating film at least between the photo‑receiving portion and the diffusion region" / read‑out circuit connected to either the photo‑receiving portion or the diffusion region; wherein a reflection reducing film is on the first insulating film above a region including at least part of the photo‑receiving portion and excluding at least part of the diffusion region, the film having a refractive index smaller than silicon (≈3.49) and larger than silicon oxide (≈1.46).
Claim 7 is the same in substance, with the gate recited as "formed above the semiconductor substrate" rather than "on the first insulating film" — i.e., no narrower in any material respect, and arguably broader as to gate placement.
Dependents: 2/8 (film not in contact with the gate side near the diffusion region), 3/9 (film excluded over at least part of the gate‑electrode region), 4/10 (film is at least one of silicon nitride, silicon oxynitride, cerium oxide, titanium oxide, tantalum oxide, zirconium oxide), 5/11 (thickness 20–100 nm), 6/12 (second insulating film on the AR film).
Elements (a)–(f) of claims 1/7 — substrate, photodiode, diffusion/charge‑detection node, gate oxide, transfer or reset gate, and an amplifying/read‑out circuit — are admitted conventional by the patent itself (FIGS. 9 and 10, and the statement that pixels are 3T or 4T active configurations). The only delta over the admitted art is (g) the presence/placement of a reflection‑reducing film and (h) its refractive index.
2. Why (h) is essentially the textbook AR condition
For a single‑layer quarter‑wave coating between silicon (n ≈ 3.49) and silicon oxide (n ≈ 1.46), the standard design rule gives an optimum index n ≈ √(3.49 × 1.46) ≈ 2.26, which by construction lies strictly between the two media, and an optimum thickness λ/4n ≈ 60–75 nm for n ≈ 2.0–2.3 at 500–600 nm. Claim 1's "index smaller than silicon and larger than silicon oxide" is therefore not an inventive selection — it is the inherent consequence of applying the ordinary AR‑coating rule. (Approximate textbook indices of the claim‑4 group: Si₃N₄ ≈ 2.0; SiOₓNᵧ ≈ 1.45–2.0; CeO₂ ≈ 2.2–2.4; TiO₂ ≈ 2.4–2.7; Ta₂O₅ ≈ 2.1–2.2; ZrO₂ ≈ 2.1–2.2 — every listed material satisfies the claim, which is itself telling: the list is a catalog of known AR dielectrics, not a selection with a critical member.) Notably, the patent's own OmniVision‑era counterpart art expresses this rule explicitly as T = λ/4N (CN100570879C, claim 1), confirming the rule was standard practice.
3. Combinations that render the claims obvious
Combination A (primary): Admitted 3T/4T MOS pixel + AR‑coated photodiode
- Reference 1 (primary): the applicant‑admitted MOS/CMOS active pixel structure of FIGS. 9/10 (substrate, photodiode, detecting/charge‑drain diffusion with LDD, gate oxide, gate electrode, amplification + reset + select transistors, silicon‑oxide interlayer dielectric over the photodiode).
- Reference 2 (secondary): a prior‑art image sensor having an anti‑reflection coating over its photodiode (candidate: JP7‑321368A, 1995‑12‑08, subject to text verification; the general class is confirmed by the later art's dense use of AR coatings over photodiodes).
- Motivation: the patent's own Background supplies it — "due to the difference of refractive index between the silicon substrate and the silicon oxide film, light reflects on the surface of the substrate and the amount of incident light that reaches the photo‑receiving portion decreases," which worsens with miniaturization/higher resolution. One of ordinary skill seeking to raise sensitivity would predictably place a known AR layer over the light‑receiving area. Result: no more than the predictable effect of a known coating (higher quantum efficiency).
Combination B (KSR "known design rule / known technique" route)
Even without a specific AR‑on‑photodiode reference, the § 103 case is strong: substituting the admitted silicon‑oxide layer over the photodiode with a known thin dielectric of intermediate index (silicon nitride/SiON) to exploit the known quarter‑wave interference effect is the paradigm of KSR Int'l Co. v. Teleflex Inc., 550 U.S. 398 (2007) — a "simple substitution of one known element for another to obtain predictable results," and the use of a "known technique … to improve similar devices in the same way." Optimizing film thickness to λ/4n and choosing a material of intermediate index are optimization of result‑effective parameters (In re Aller; In re Boesch), which is obvious absent unexpected results.
Combination C: Why "excluding at least part of the diffusion region" is a routine integration choice
The negative limitation (g) is the only feature that might be argued to add something, but the specification itself defuses it: the patent says of the diffusion/detecting portion that "it is required for at least part of the detecting portion to connect with the metal wiring," and that if the AR film covered the whole detecting portion, "it is required to perform all steps for implanting ions before the reflection reducing film is formed … [so] it becomes difficult to simplify the process." In other words, the specification concedes that contact formation and implant masking, not optics, dictate the exclusion — classic process‑integration/design constraints of the kind that render a placement choice obvious. A skilled artisan integrating an AR layer into a CMOS flow would:
- keep the nitride/SiON off the source/drain and contact areas so contacts can be opened to the diffusion node (here, the floating‑diffusion/detecting node 14a or the charge‑drain node 34a), and
- keep the AR film over the entire photodiode aperture.
Dependents — why each adds nothing patentable
- Claims 2/8 (no contact with the gate side near the diffusion region): depositing a nitride layer with steps/curves in the high‑field gate/drain region and then having to remove it there is a known stress/leakage concern in the art; also the NEC JP‑2000012817‑A reference independently removes the nitride over the transfer electrode. Routine engineering.
- Claims 3/9 (film excluded over at least part of the gate): expressly taught by JP‑2000012817‑A ("part 15a … removed to apply hydrogen"), and by the patent's own admission that nitride blocks the hydrogen passivation anneal used to reduce dark current.
- Claims 4/10: catalog of known AR dielectrics; obvious selection from a finite, known group, all of which satisfy the recited index range.
- Claims 5/11 (20–100 nm): the optimum is determined by the known λ/4n rule (≈60–75 nm for Si₃N₄); a range bracketing the calculated optimum is per se obvious.
- Claims 6/12 (second insulating film on the AR film): the specification itself says the overlying silicon oxide "functions as a part of an interlayer insulating film," and states that multilayer AR stacks and oxide/nitride stacks are conventional. Adding an interlayer dielectric over an AR layer is routine.
So: claims 1–6 and 7–12 (and a fortiori the broader wording of claim 7) would, on this record, be prima facie obvious over the admitted MOS pixel art in view of an AR‑coated photodiode reference and/or the standard AR design rule.
4. Anticipated counter‑arguments and why they are weak
- "The claims require two mutually inconsistent things — AR film over the photodiode but not over the diffusion region, made in a self‑aligned flow." The self‑alignment cleverness (using the residual TEOS oxide over the LDD as an implant mask, FIGS. 2(c)–(d) and 4(e)–(f)) lives in process steps that were not claimed. The issued claims are structural and read on any device having an AR layer over some of the photodiode and not over some of the diffusion region.
- "Unexpected result." The patent itself quantifies the gain as reflectance dropping from ~25% to ~10% — precisely the predictable AR effect, not an unexpected one. No teaching away is present; the Background points toward the solution.
- Objective indicia. The page shows the patent was asserted by Collabo Innovations, Inc. in D. Del. (1:14‑cv‑01093 and 1:15‑cv‑00608; https://portal.unifiedpatents.com/litigation/Delaware%20District%20Court/case/1%3A15-cv-00608), and it changed hands Matsushita → Panasonic → Collabo. Assertion/acquisition by an NPE is not evidence of nonobviousness absent a nexus between the claim and any commercial success. The patent expired 2019‑04‑20, so the practical vehicle for an obviousness challenge today is an invalidity defense (or an IPR, though the expired status simplifies the analysis).
5. Bottom line and residual uncertainty
- Best § 103 combination: admitted 3T/4T MOS/CMOS active‑pixel art (US6166405 Background, FIGS. 9–10) + an image‑sensor reference with an anti‑reflection coating over its photodiode (candidate JP7‑321368A, 1995‑12‑08) + optionally a hydrogen‑passivation/electrode‑exclusion teaching (JP‑2000012817‑A, used only as contemporaneous state‑of‑the‑art evidence). Motivation: the admitted Si/SiO₂ index mismatch causes reflection losses that reduce sensitivity and worsen with miniaturization; AR coatings over photodiodes and the λ/4n design rule were known and routine; excluding the film from contact/diffusion areas and from part of the gate is dictated by known contact‑opening and hydrogen‑passivation requirements.
- Confidence: High that the claims are obvious in substance; but my confidence in the specific references is limited. I could not retrieve (i) the examiner‑cited "Patent Citations" list for US6166405, (ii) the full text of JP7‑321368A, (iii) the JP counterpart JP3103064B2's citation list, or (iv) any US counterpart of JP‑2000012817‑A. Any formal obviousness contention should be re‑grounded on those verified documents, and I am explicitly not asserting that the Cited‑By entries on the page are § 103 prior art — they are not.
Generated 9/16/2026, 6:46:11 PM
Extensions
Patent term adjustments, term extensions, continuations, divisionals, family members, and expiration dates.
Derivative works
Defensive disclosure: derivative variations of each claim designed to render future incremental improvements obvious or non-novel.
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