Patent 11888392

Prior art

Earlier patents, publications, and products that may anticipate or render the claims unpatentable.

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Prior art

Earlier patents, publications, and products that may anticipate or render the claims unpatentable.

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To identify the most relevant prior art for US Patent 11888392, we'll examine the "Cited by examiner" section of the patent, which lists documents the patent examiner considered relevant during prosecution. Prior art is any evidence that an invention was publicly known or available before the effective filing date of a patent application, and it is used to determine if an invention is novel and non-obvious under 35 U.S.C. § 102.

Here are the prior art patent citations for US Patent 11888392, along with a brief description and potential claims they anticipate:

Patent Citations:

  • US20040212074A1

    • Full Citation: US20040212074A1 - DC-DC converter implemented in a land grid array package
    • Publication Date: October 28, 2004
    • Description: This patent application describes a DC-DC converter implemented in a land grid array package. While it addresses DC-DC conversion, the specific packaging and technology (land grid array) may differ from the SiC AMB substrate focus of US11888392.
    • Potential Anticipated Claim(s): This could potentially anticipate aspects of claims related to general power converter modules or DC-DC conversion (e.g., Claim 1, Claim 8), but likely not the specific SiC components or AMB substrate without baseplate features.

  • US20060108684A1

    • Full Citation: US20060108684A1 - Power module, phase leg, and three-phase inverter
    • Publication Date: May 25, 2006
    • Description: This reference describes a power module, phase leg, and three-phase inverter. It is relevant for its general disclosure of power module structures and inverter types.
    • Potential Anticipated Claim(s): Could potentially anticipate claims related to different power converter types (e.g., Claim 5, specifically "half-bridge converter," "full-bridge converter," "single-phase inverter," and "three-phase inverter") and the general concept of a power module (Claim 1, Claim 15).

  • US20080023825A1

    • Full Citation: US20080023825A1 - Multi-die DC-DC Boost Power Converter with Efficient Packaging
    • Publication Date: January 31, 2008
    • Description: This patent application focuses on a multi-die DC-DC boost power converter with efficient packaging. The "efficient packaging" aspect could be a point of overlap, though the materials and specific construction (e.g., SiC, AMB, no baseplate) might differentiate US11888392.
    • Potential Anticipated Claim(s): Could potentially anticipate aspects of Claim 1 and Claim 8 concerning boost converters and efficient packaging, but likely not the specific SiC and AMB substrate limitations.

  • US20080054439A1

    • Full Citation: US20080054439A1 - Power electronic package having two substrates with multiple semiconductor chips and electronic components
    • Publication Date: March 6, 2008
    • Description: This reference details a power electronic package with two substrates and multiple semiconductor chips. The use of multiple chips and substrates is relevant to the general architecture of power modules.
    • Potential Anticipated Claim(s): This could be relevant to the general structure of a power converter module with a substrate and power converter circuitry (Claim 1, Claim 15), especially regarding multiple semiconductor components.

  • US20080180974A1

    • Full Citation: US20080180974A1 - Power MISFET, semiconductor device and DC/DC converter
    • Publication Date: July 31, 2008
    • Description: This patent application describes a power MISFET, a semiconductor device, and a DC/DC converter. The mention of MISFETs and DC/DC converters is relevant to the components and function of US11888392.
    • Potential Anticipated Claim(s): Could potentially anticipate aspects of Claim 8 (boost converter/DC-DC converter) and Claim 9 (MOSFETs) if the MISFET broadly covers MOSFETs.

  • JP2009158533A

    • Full Citation: JP2009158533A - Light generator
    • Publication Date: July 16, 2009
    • Description: This Japanese patent application describes a light generator. It's less directly related to power converter modules in general, but might contain some underlying power conversion circuitry.
    • Potential Anticipated Claim(s): Given the title, direct anticipation of claims specific to "high speed, efficient SiC power module" is less likely unless the light generator incorporates similar power conversion principles. Could potentially broadly relate to the existence of power conversion circuitry.

  • US20090283309A1

    • Full Citation: US20090283309A1 - Ceramic-metal bonded body, method for manufacturing the bonded body and semi-conductor device using the bonded body
    • Publication Date: November 19, 2009
    • Description: This patent application describes ceramic-metal bonded bodies and their manufacturing, which is highly relevant to AMB substrates. This could be a significant piece of prior art regarding the substrate construction.
    • Potential Anticipated Claim(s): Highly relevant to Claim 1 and Claim 15, specifically the substrate comprising a base layer and conductive layers, and potentially the active metal braze (AMB) aspect (Claim 4).

  • US20100157608A1

    • Full Citation: US20100157608A1 - Structure of light-emitting diode lighting tube
    • Publication Date: June 24, 2010
    • Description: This patent application describes the structure of an LED lighting tube. Similar to JP2009158533A, its primary focus is not power converter modules.
    • Potential Anticipated Claim(s): Unlikely to directly anticipate specific claims of US11888392, unless it details power conversion circuitry that aligns with the claims.

  • US20110169549A1

    • Full Citation: US20110169549A1 - Electronic devices and components for high efficiency power circuits
    • Publication Date: July 14, 2011
    • Description: This reference discusses electronic devices and components for high-efficiency power circuits. The focus on high efficiency aligns with the objectives of US11888392.
    • Potential Anticipated Claim(s): Could broadly anticipate the concept of high-efficiency power converter circuitry (Claim 1, Claim 15) and the use of specific components (e.g., Claim 9 for MOSFETs and diodes, if discussed).

  • US20110210708A1

    • Full Citation: US20110210708A1 - High Frequency Power Supply Module Having High Efficiency and High Current
    • Publication Date: September 1, 2011
    • Description: This patent application specifically mentions a "High Frequency Power Supply Module Having High Efficiency and High Current." This is very relevant given the title and objectives of US11888392.
    • Potential Anticipated Claim(s): Could potentially anticipate several claims, particularly those related to the general characteristics of the module (Claim 1, Claim 15), high-frequency operation, and efficiency.

  • US20130020672A1

    • Full Citation: US20130020672A1 - System and Method for Packaging of High-Voltage Semiconductor Devices
    • Publication Date: January 24, 2013
    • Description: This reference focuses on packaging high-voltage semiconductor devices, which is directly relevant to the physical construction and integration aspects of US11888392.
    • Potential Anticipated Claim(s): Could anticipate aspects of Claim 1 and Claim 15 relating to the housing and the arrangement of power converter circuitry on a substrate.

  • US20130207123A1

    • Full Citation: US20130207123A1 - High current density power module
    • Publication Date: August 15, 2013
    • Description: This patent application describes a "High current density power module." This relates to the performance aspects that SiC enables in US11888392.
    • Potential Anticipated Claim(s): Could potentially anticipate aspects of Claim 1 and Claim 15 related to power modules and their performance characteristics.

  • US20130248883A1

    • Full Citation: US20130248883A1 - High performance power module
    • Publication Date: September 26, 2013
    • Description: This reference describes a "High performance power module." This general objective is shared with US11888392.
    • Potential Anticipated Claim(s): Could broadly anticipate claims related to power modules and their performance (Claim 1, Claim 15).

  • WO2013171136A1

    • Full Citation: WO2013171136A1 - Electronic power module arrangement
    • Publication Date: November 21, 2013
    • Description: This international publication describes an "Electronic power module arrangement," which is a general category for US11888392.
    • Potential Anticipated Claim(s): Broadly relevant to the concept of a power converter module (Claim 1, Claim 15).

  • US20140070627A1

    • Full Citation: US20140070627A1 - Integrated Group III-V Power Stage
    • Publication Date: March 13, 2014
    • Description: This patent application relates to an integrated Group III-V Power Stage. While US11888392 focuses on Silicon Carbide (Group IV), this reference indicates prior work in advanced semiconductor materials for power stages.
    • Potential Anticipated Claim(s): Could broadly relate to power converter circuitry (Claim 1, Claim 15) and the use of advanced semiconductor materials, although the specific material differs.

  • US20140138707A1

    • Full Citation: US20140138707A1 - Power semiconductor module
    • Publication Date: May 22, 2014
    • Description: This patent application describes a "Power semiconductor module," which is directly aligned with the subject matter of US11888392.
    • Potential Anticipated Claim(s): Could broadly anticipate claims related to a power converter module (Claim 1, Claim 15) and its internal components.

  • US20140246681A1

    • Full Citation: US20140246681A1 - HIGH CURRENT, LOW SWITCHING LOSS SiC POWER MODULE
    • Publication Date: September 4, 2014
    • Description: This is a highly relevant prior art reference, specifically mentioning "HIGH CURRENT, LOW SWITCHING LOSS SiC POWER MODULE." This directly addresses the core innovation claimed in US11888392.
    • Potential Anticipated Claim(s): Highly relevant and could potentially anticipate many claims, especially those relating to SiC switching components (Claim 1, Claim 9, Claim 15, Claim 17), low switching losses, and high current.

  • WO2014186448A1

    • Full Citation: WO2014186448A1 - High performance power module
    • Publication Date: November 20, 2014
    • Description: This international publication describes a "High performance power module."
    • Potential Anticipated Claim(s): Broadly relevant to the concept of a power converter module (Claim 1, Claim 15) with high performance.

  • US20150131236A1

    • Full Citation: US20150131236A1 - High voltage power chip module
    • Publication Date: May 14, 2015
    • Description: This patent application describes a "High voltage power chip module." High voltage operation is a characteristic often associated with SiC devices and is mentioned in the description of US11888392.
    • Potential Anticipated Claim(s): Could potentially anticipate aspects of claims related to the voltage output of the module (e.g., in the detailed description, "output voltage greater than 650V").

  • US20150130071A1

    • Full Citation: US20150130071A1 - Semiconductor Package Comprising a Transistor Chip Module and a Driver Chip Module and a Method for Fabricating the Same
    • Publication Date: May 14, 2015
    • Description: This reference describes a semiconductor package with a transistor chip module and a driver chip module. It addresses packaging and the integration of different functional modules.
    • Potential Anticipated Claim(s): Could anticipate aspects of Claim 1 and Claim 15 related to the housing, substrate, and power converter circuitry comprising switching components.

  • US20160276927A1

    • Full Citation: US20160276927A1 - High speed, efficient sic power module
    • Publication Date: September 22, 2016
    • Description: This is a patent application for the same or a very closely related invention, likely a parent or continuation application, as indicated by the identical title. This document is a continuation of U.S. patent application Ser. No. 15/055,872, filed on Feb. 29, 2016, which claims the benefit of U.S. provisional patent application No. 62/133,872, filed on Mar. 16, 2015. US11888392 itself is a continuation of U.S. patent application Ser. No. 16/784,857, filed on Feb. 7, 2020, which is a continuation of U.S. patent application Ser. No. 15/055,872. This indicates a chain of applications for the same invention. Therefore, it would serve as prior art for the priority date it establishes (March 16, 2015).
    • Potential Anticipated Claim(s): This document is part of the same patent family and would effectively anticipate all claims of US11888392 based on its earlier priority date, as it discloses the same invention.

  • US20160308523A1

    • Full Citation: US20160308523A1 - Power circuit and power module
    • Publication Date: October 20, 2016
    • Description: This reference describes a power circuit and power module.
    • Potential Anticipated Claim(s): Broadly relevant to the concept of a power converter module (Claim 1, Claim 15) and its internal circuitry.

  • US20170040890A1

    • Full Citation: US20170040890A1 - High speed, efficient sic power module
    • Publication Date: February 9, 2017
    • Description: Similar to US20160276927A1, this is also a patent application with the identical title, suggesting it is part of the same patent family or a continuation thereof. This document is also a continuation of U.S. patent application Ser. No. 15/055,872, filed on Feb. 29, 2016, which claims the benefit of U.S. provisional patent application No. 62/133,872, filed on Mar. 16, 2015.
    • Potential Anticipated Claim(s): This document is part of the same patent family and would effectively anticipate all claims of US11888392 based on its earlier priority date, as it discloses the same invention.

  • US10224810B2

    • Full Citation: US10224810B2 - High speed, efficient SiC power module
    • Publication Date: March 5, 2019
    • Description: This is an issued patent with the identical title, "High speed, efficient SiC power module." It explicitly states it is a continuation of U.S. patent application Ser. No. 15/055,872, filed on Feb. 29, 2016, which claims the benefit of U.S. provisional patent application No. 62/133,872, filed on Mar. 16, 2015.
    • Potential Anticipated Claim(s): This document is part of the same patent family and would effectively anticipate all claims of US11888392 based on its earlier priority date, as it discloses the same invention.

  • US20170213811A1

    • Full Citation: US20170213811A1 - High performance power module
    • Publication Date: July 27, 2017
    • Description: This patent application describes a "High performance power module." This is a continuation of 15/055,872.
    • Potential Anticipated Claim(s): This document is part of the same patent family and would effectively anticipate all claims of US11888392 based on its earlier priority date, as it discloses the same invention.

Non-Patent Citations:

  • Wang et al., 10-kV SiC MOSFET-Based Boost Converter, 2009, IEEE, Trans. Ind. Aoo., vol. 45, No. 6, 2056-2063 (Year: 2009)
    • Description: This academic paper discusses a "10-kV SiC MOSFET-Based Boost Converter." This is highly relevant as it explicitly mentions SiC MOSFETs in a boost converter configuration.
    • Potential Anticipated Claim(s): Could potentially anticipate claims related to SiC MOSFETs (Claim 9, Claim 17), boost converters (Claim 8), and the general concept of SiC power converter circuitry (Claim 1, Claim 15).

It is important to note that several of the patent citations (US20160276927A1, US20170040890A1, US10224810B2, US20170213811A1) appear to be part of the same patent family as US11888392, tracing back to the same priority date of March 16, 2015. These family members would not be considered "prior art" in the sense of anticipating the invention under 35 U.S.C. § 102 for novelty, but rather disclose the same invention and establish the effective filing date. However, an earlier filed patent application can still qualify as prior art even if not publicly available if it was filed before the new application.

Generated 7/9/2026, 12:46:25 AM