US 11888392

US Patent 11888392: High Speed, Efficient SiC Power Module

Title: High speed, efficient sic power module

Assignee: Wolfspeed Inc.

Inventors: Mrinal K. Das, Adam Barkley, Henry Lin, Marcelo Schupbach

Filing Date: April 17, 2020

Issue Date: January 30, 2024

Abstract:
A power converter module is disclosed, comprising an active metal braze (AMB) substrate, power converter circuitry, and a housing. The AMB substrate features an aluminum nitride base layer with first and second conductive layers on its opposite surfaces. The power converter circuitry, which includes multiple silicon carbide (SiC) switching components, is coupled via the first conductive layer. The housing encapsulates the power converter circuitry and the AMB substrate. This design, utilizing an AMB substrate with an aluminum nitride base layer, aims to significantly improve the thermal dissipation characteristics and structural integrity of the power converter module.

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Plain-Language Overview of Independent Claims:

Independent Claim 1:
This claim describes a power converter module that includes:

• A housing.
• A substrate located inside the housing, which has a base layer and a conductive layer on one of its surfaces.
• Power converter circuitry built on the substrate, containing at least two silicon carbide (SiC) switching components connected to each other through the conductive layer.
  Crucially, this power converter module is explicitly stated to not include a baseplate.

Independent Claim 15:
This claim outlines a power converter module featuring:

• A housing.
• A substrate that consists of a base layer, a first conductive layer on its first surface, and a second conductive layer on its second, opposite surface.
• Power converter circuitry situated on the substrate, comprising at least two silicon carbide (SiC) switching components. These components are interconnected by the first conductive layer and are arranged to form multiple "channels," with each channel containing at least one silicon carbide transistor.
  Similar to Claim 1, this power converter module is also characterized by being devoid of a baseplate.

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CAFC 2026 Dockets Search:
As of April 26, 2026, a search of the CAFC 2026 dockets for US patent 11888392 did not yield any results. Therefore, no ongoing litigation or appeals concerning this specific patent number were found in the 2026 dockets.## US Patent 11888392: High Speed, Efficient SiC Power Module

Title: High speed, efficient sic power module
Assignee: Wolfspeed Inc.
Inventors: Mrinal K. Das, Adam Barkley, Henry Lin, Marcelo Schupbach
Filing Date: April 17, 2020
Issue Date: January 30, 2024

Abstract:
A power converter module is described, featuring an active metal braze (AMB) substrate, power converter circuitry, and a housing. The AMB substrate is constructed with an aluminum nitride base layer, which has a first conductive layer on one surface and a second conductive layer on the opposite surface. The power converter circuitry, consisting of several silicon carbide (SiC) switching components, is interconnected via the first conductive layer. The entire assembly of the power converter circuitry and the AMB substrate is enclosed by the housing. This design aims to significantly improve the module's thermal dissipation while maintaining its structural integrity, primarily through the use of an AMB substrate with an aluminum nitride base layer.

Plain-Language Overview of Independent Claims:

Independent Claim 1:
This claim defines a power converter module that contains a casing (housing) and a foundation (substrate) inside it. The foundation has a core layer and a conductive layer on its top surface. Mounted on this foundation is the power converter's electrical system (power converter circuitry), which includes at least two switching components made of silicon carbide (SiC) that are connected to each other through the conductive layer. A key feature of this module is that it does not include a separate baseplate.

Independent Claim 15:
This claim details another version of a power converter module. It also includes a casing (housing). The foundation (substrate) here is more complex, having a core layer with a first conductive layer on its upper side and a second conductive layer on its underside. The power converter's electrical system (power converter circuitry) is built on this foundation and comprises at least two silicon carbide (SiC) switching components. These components are linked via the first conductive layer and are arranged into multiple sections or "channels," with each channel containing at least one transistor made of silicon carbide. Like Claim 1, this power converter module is also specified to be without a baseplate.

CAFC 2026 Dockets:
As of April 26, 2026, no records for US patent 11888392 were found in the CAFC 2026 dockets, indicating no ongoing appeals or litigation at the Federal Circuit for this patent in the current year.