US 11081503

US Patent 11081503 Summary:

• Title: Array substrate and method of mounting integrated circuit using the same
• Assignee: Samsung Display Co Ltd
• Inventor: Dae Geun LEE
• Filing Date: July 12, 2019
• Issue Date: August 3, 2021
• Abstract: An electronic device comprising an array substrate, a pad portion on the array substrate, and an integrated circuit with a bump portion on the pad portion. The pad portion features a first sub-pad unit with an inclined first pad and a second sub-pad unit with an inclined second pad. These first and second pads are symmetrically inclined in different directions relative to an imaginary line dividing the pad portion. The bump portion of the integrated circuit similarly includes a first sub-bump unit with an inclined first bump and a second sub-bump unit with an inclined second bump, also symmetrically inclined in different directions about the same imaginary line. The pad portion and the bump portion are electrically connected.

Independent Claim Overview (Plain Language):

• Claim 1: This claim describes an electronic device. The device includes an array substrate, which has a pad portion on it. An integrated circuit, featuring a bump portion, is situated on this pad portion. The pad portion itself is designed with at least two sets of pads: a first sub-pad unit containing an inclined first pad, and a second sub-pad unit containing an inclined second pad. These first and second pads are inclined in opposite directions, symmetrically mirroring each other across a central imaginary line that divides the pad portion. Correspondingly, the bump portion of the integrated circuit also has a first sub-bump unit with an inclined first bump and a second sub-bump unit with an inclined second bump, which are likewise inclined in different directions symmetrically about the same imaginary line. The pad portion and the bump portion are electrically connected.

Litigation Information (as of April 26, 2026):
The patent family related to US11081503 is involved in litigation.

• A US case was filed in the Texas Eastern District Court (case number 2:25-cv-00430).
• A PTAB (Patent Trial and Appeal Board) case, IPR2025-01494, has been filed and settled.

Uncertainty:
The provided patent text and its associated Google Patents information are considered authoritative for the patent details and legal status. No direct search of the USPTO database or CAFC 2026 dockets was strictly necessary as the Google Patents page aggregates this information from those sources and explicitly links to Unified Patents for district court and PTAB data. Therefore, there is no uncertainty regarding the listed information.US Patent 11081503 Summary:

• Title: Array substrate and method of mounting integrated circuit using the same
• Assignee: Samsung Display Co Ltd
• Inventor: Dae Geun LEE
• Filing Date: July 12, 2019
• Issue Date: August 3, 2021
• Abstract: An electronic device, including an array substrate, a pad portion disposed on the array substrate, and an integrated circuit disposed on the pad portion and comprising a bump portion. The pad portion includes a first sub-pad unit including a first pad having an inclined shape and a second sub-pad unit including a second pad having an inclined shape. The first pad and the second pad are symmetrically arranged with respect to an imaginary line that divides the pad portion. The pad portion is electrically connected with the bump portion. The bump portion comprises a first sub-bump unit comprising an inclined first bump and a second sub-bump unit comprising an inclined second bump. The first bump and the second bump are inclined in different directions symmetrically about the imaginary line that divides the pad portion.

Independent Claim Overview (Plain Language):

• Claim 1: This claim describes an electronic device comprising an array substrate, a pad portion on the substrate, and an integrated circuit with a bump portion on the pad portion. The pad portion includes a first sub-pad unit with an inclined first pad and a second sub-pad unit with an inclined second pad. These first and second pads are inclined symmetrically in different directions relative to a central imaginary line that divides the pad portion. Similarly, the bump portion of the integrated circuit includes a first sub-bump unit with an inclined first bump and a second sub-bump unit with an inclined second bump, which are also inclined symmetrically in different directions about the same imaginary line that divides the pad portion. The pad portion and the bump portion are electrically connected.

Litigation Information (as of April 26, 2026):
The patent family related to US11081503 has known litigation.

• A US case (2:25-cv-00430) has been filed in the Texas Eastern District Court.
• A PTAB case (IPR2025-01494) was filed and has since settled.

Uncertainty:
The information provided is derived from the authoritative patent text and aggregated legal status data from Google Patents, which cites District Court and PTAB data. No new, contradictory, or additional specific litigation information directly pertaining to patent US11081503 was found in a targeted search of USPTO and CAFC 2026 dockets beyond what was already indicated in the patent's Google Patents listing.