US 4827294

Patent Overview — US 4,827,294 A

Title: Thermal ink jet printhead assembly employing beam lead interconnect circuit

Patent number / application: US 4,827,294 A; application US 07/093,924

Inventor: Gary E. Hanson

Assignee (per supplied text): Originally Hewlett-Packard Company; current assignee listed as HP Inc

Key dates:

• Priority date: 1985-11-22 (claimed from US 06/801,034 / patent US 4,635,073)
• Filing date: 1987-10-26
• Publication/grant: 1989-05-02
• Anticipated expiration: 2006-05-02; status "Expired – Lifetime"

Purpose and plain-language scope (based only on supplied text):
The patent relates generally to thermal ink jet printing and, more particularly, to a "new" (text truncated at this point) printhead assembly. The core subject matter, as reflected in the title and the text's own keyword/term frequencies, is a thermal ink jet printhead assembly that uses a beam lead interconnect circuit to make electrical connection to the printhead. The assembly centers on a substrate carrying thin film structures and conductors, together with a mating/insertion arrangement for a carriage (the carriage and printhead appear prominently among the prior-art keywords). Classification confirms this: B41J25/34 (bodily-changeable print heads or carriages), B41J2/16 and subclasses (production of bubble-jet/ink jet nozzles, including bonding/adhesion, photolithography, molding, and thin-film formation), and B41J2002/14362 (assembling elements of heads). Materials mentioned in the description include silicon, silicon dioxide, silicon carbide, tantalum-aluminum, aluminum, gold, copper, and elastomers. An abstract and claims are present in the source but were not included in the supplied excerpt.

Source: https://patents.google.com/patent/US4827294/en

What the excerpt does not establish:
The actual wording of the claims is not supplied, so the precise legal scope of the invention cannot be stated. The description and abstract texts are indicated as present but were truncated/omitted, so the specific structural and process limitations, preferred embodiments, and stated objects/advantages are not established here. The excerpt also does not set out any litigation details beyond the presence of a litigation-data link, and the legal status shown is expressly an assumption, not a legal conclusion.