US 10446700

An analysis of U.S. Patent No. 10,446,700 has been conducted based on available patent and legal databases as of April 26, 2026.

Summary of U.S. Patent No. 10,446,700

• Title: Microstructure enhanced absorption photosensitive devices
• Assignee: W&wsens Devices Inc
• Inventors: Shih-Yuan Wang, Shih-Ping Wang, M. Saif Islam
• Filing Date: October 30, 2017
• Issue Date: October 15, 2019
• Abstract: This patent details the creation of photosensitive devices, like photodiodes, with improved light absorption. This is achieved by incorporating microstructures, such as holes, into the device. The goal is to enhance the quantum efficiency of these devices, which are made from silicon and III-V materials. The invention is aimed at applications in high-speed optical communications, including data centers, telecommunications, and light detection and ranging (LIDAR).

Plain-Language Overview of Independent Claims

A plain-language summary of the independent claims of U.S. Patent No. 10,446,700 is provided below:

• Claim 1: This claim describes a single-chip device that integrates a light-detecting component (a microstructure-enhanced photodetector or MSPD) with an electronic circuit on the same silicon base. The MSPD features layers of silicon, germanium, or a combination, and crucially, has tiny, manufactured holes in at least one layer to better capture light. The integrated electronic circuit then processes the electrical signal from the MSPD, for example, by amplifying it.

• Claim 16: This claim focuses on the light-detecting component itself. It details a structure with top, bottom, and middle layers, with at least one layer containing deliberately created holes. The top and bottom layers are electrically doped, while the middle layer is not, or is less so. A key feature is a layer of a dielectric material that covers the holes and the areas between them, which is in the path of the incoming light.

• Claim 25: This claim outlines a method for manufacturing the aforementioned light-detecting device. It describes the process of forming the layered structure on a substrate and creating the specific holes within one or more of these layers. The method also includes steps for creating an area for light to enter through these holes and a way to get the electrical signal out.

Litigation Status

A search of the U.S. Court of Appeals for the Federal Circuit (CAFC) dockets for the year 2026 did not yield any specific results for litigation directly involving U.S. Patent No. 10,446,700. However, public records indicate that the patent family to which this patent belongs has been subject to litigation, including proceedings before the Patent Trial and Appeal Board (PTAB) and in U.S. District Court. The provided information indicates a PTAB case (IPR2025-00996) and a case in the Texas Eastern District Court (2:24-cv-00854) associated with this patent family. The absence of a CAFC case in 2026 does not preclude the existence of ongoing or resolved disputes in other venues.