US 9423424

A technical analysis of U.S. Patent 9,423,424 reveals a targeted invention for enhancing the durability of probe modules used in semiconductor testing. No records were found of this patent in the dockets of the U.S. Court of Appeals for the Federal Circuit (CAFC) for the year 2026.

Summary of U.S. Patent 9,423,424

Title: Current-diverting guide plate for probe module and probe module using the same

Assignee: MPI Corp

Inventors: Hsien-Ta HSU, Horng-Kuang Fan

Filing Date: January 10, 2014

Issue Date: August 23, 2016

Abstract:
The patent describes a current-diverting guide plate for a probe module. This plate includes a body with through-holes for probes, a conducting layer within each hole, and a current-diverting circuit trace on its surface. The circuit trace connects the conducting layers to divert electrical current flowing through the probes. This design aims to prevent damage to the probes from excessive instantaneous current, a growing concern as probe diameters shrink to accommodate smaller semiconductor contact pads.

Plain-Language Overview of Independent Claims

U.S. Patent 9,423,424 has one independent claim.

Claim 1: This claim outlines a probe module with three main components: an upper guide plate, a lower guide plate, and multiple probes.

• The upper guide plate has holes for the probes to pass through.
• The lower guide plate is positioned below the upper one and also has holes for the probes. Crucially, this lower plate features a "current-diverting circuit trace" on its surface.
• The probes are designed to slide through the holes in both plates. Their tips extend below the lower plate to make contact with the device being tested. When they make contact, the probes are designed to deform elastically between the two plates.

The core of the invention lies in the electrical connection between at least two of the probes and the special current-diverting circuit trace on the lower guide plate. This connection is established through conductive layers lining the holes of the lower plate. In simple terms, if a sudden surge of current passes through the probes, the circuit trace on the lower plate provides an alternate path for the electricity to flow. This diversion prevents the slender probes from overheating and burning out, which is a significant problem in modern semiconductor testing where components are increasingly miniaturized.