Invalidity dossier

US 8669167

Techniques for metal gate workfunction engineering to enable multiple threshold voltage FINFET devices

Current assignee: GlobalFoundries US Inc

Added 9/23/2026, 7:51:35 PM

At a glanceNo PTAB challengesNo litigation on file

Active provider: DeepSeek · deepseek-flash

Patent summary

Title, assignee, inventors, filing/issue dates, abstract, and a plain-language overview of the claims.

✓ Generated

Patent Overview: US8669167B1

Title: Techniques for metal gate workfunction engineering to enable multiple threshold voltage FINFET devices

Assignee/Applicant: Originally assigned to International Business Machines Corporation (IBM); current assignee listed as GlobalFoundries US Inc.

Key Dates:

  • Priority/filing date: 2012-08-28
  • Publication date: 2014-03-11
  • Anticipated expiration: 2032-08-28
  • Legal status: Expired – Fee Related

Inventor(s): Josephine B. Chang, Isaac Lauer, Chung-Hsun Lin, Jeffrey W. Sleight

Purpose:
The invention addresses threshold voltage (Vt) engineering in FIN field-effect transistor (FINFET) devices. Rather than doping fins—which introduces random dopant fluctuation (RDF) problems in aggressively scaled devices—it uses a work function setting material, deposited in an amount proportional to fin pitch, to enable multiple threshold voltage devices.

Plain-Language Scope:
The patent covers a method of fabricating a FINFET device and the resulting device. A semiconductor-on-insulator (SOI) wafer with an SOI layer over a buried oxide (BOX) is provided; an oxide layer and fins are patterned; an interfacial oxide is formed on the fins; and a conformal gate dielectric, conformal gate metal layer, and conformal work function setting material layer are deposited to form at least one gate stack. The volume of the gate metal and work function setting material is proportional to fin pitch. The patent describes fabricating multiple FINFETs with varying fin pitch (e.g., tight, medium, wide) and notes that an angled deposition process can deposit less work function material at tighter fin pitch. Fin patterning may use sidewall image transfer (SIT).

Source: https://patents.google.com/patent/[US8669167](/patent/US8669167)/en

What the excerpt does not establish:
The excerpted text does not establish the full claim set, prosecution history, or the complete detailed description (e.g., specific materials, thicknesses, or the referenced U.S. patent for gate-last fin-last approaches). It also does not establish the legal status as a fact—the provided status is expressly an assumption, not a legal conclusion. Independent claim language and claim scope limitations beyond the summary descriptions above are not fully verifiable from the excerpt alone.

Generated 10/1/2026, 9:41:46 PM

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Litigation summary

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Proceedings on file (0)

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No PTAB proceedings on file. This patent has not been challenged via IPR, PGR, or CBM. The absence is itself a signal — well-asserted patents eventually attract IPRs. The LLM analysis below may surface filings the ODP feed hasn’t indexed yet.

PTAB challenges

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Assignment history

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Prior art

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Obviousness

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Extensions

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Derivative works

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