Derivative works — US Patent 8368201

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Defensive Disclosure for US Patent 8368201: Method for embedding a component in a base

Date: April 26, 2026

Patent Under Analysis: US 8368201 B2, "Method for embedding a component in a base"

Objective: To expand the public domain of prior art related to embedded component technology, thereby rendering future incremental improvements by competitors as obvious or non-novel in the context of US Patent 8368201. This document details derivative variations of the electronic module described in independent claim 1 of US 8368201, covering material/component substitutions, operational parameter expansions, cross-domain applications, integration with emerging technologies, and inverse/failure modes.

Derivative Variations of the Electronic Module

1. Material & Component Substitution

Enabling Description: The electronic module as described in claim 1 is herein disclosed with a ceramic (e.g., Alumina, Aluminum Nitride) baseboard to enhance thermal conductivity and mechanical rigidity. The hardened insulating polymer layer is substituted with a high-performance polyimide film (e.g., Kapton® HN) applied via spin-coating and subsequently cured, offering superior dielectric strength and temperature resistance. The at least one component embedded within the baseboard comprises a micro-electromechanical system (MEMS) device, such as an accelerometer or gyroscope, instead of a standard microcircuit. The contact areas on the first surface of the MEMS component are fabricated with gold (Au) bumps via electroplating. The conductive patterns on the hardened insulating polyimide layer are formed from a nickel-palladium-gold (NiPdAu) stack, patterned by subtractive etching. The conductors within the hardened insulating polyimide layer for forming electrical contacts between the conductive patterns and the MEMS component contact areas are realized as copper (Cu) pillars grown via through-hole plating, subsequently filled with a conductive epoxy for mechanical reinforcement.

graph TD
    A[Select Ceramic Baseboard (Alumina/AlN)] --> B[Spin-coat Polyimide Film (Kapton HN)]
    B --> C{Cure Polyimide Film}
    C --> D[Embed MEMS Component (Accelerometer/Gyroscope)]
    D --> E[MEMS Component with Au Bumps on First Surface]
    E --> F[Pattern NiPdAu Conductive Layer on Polyimide]
    F --> G[Grow Cu Pillars for Interconnects]
    G --> H[Fill Cu Pillars with Conductive Epoxy]
    H --> I[Finished Electronic Module]

2. Operational Parameter Expansion - Nanoscale Integration

Enabling Description: An electronic module integrating components at the nanoscale. The baseboard is a self-assembling polymer-nanocomposite matrix (e.g., polystyrene-block-poly(methyl methacrylate) copolymer with embedded carbon nanotubes) approximately 500 nm thick. The hardened insulating polymer layer consists of an atomic layer deposition (ALD) grown hafnium dioxide (HfO₂) or aluminum oxide (Al₂O₃) layer, approximately 5 nm thick, providing ultra-thin, high-k dielectric insulation. The embedded component is a quantum dot (QD) based sensor array (e.g., for light detection), with individual quantum dots having dimensions less than 10 nm, configured with contact areas comprising graphene nanoribbon pads. These quantum dot components are directly integrated "within" the polymer-nanocomposite matrix. Conductive patterns on the HfO₂/Al₂O₃ layer are formed by directed self-assembly of metallic nanoparticles (e.g., Au or Ag nanoparticles) or electron beam lithography of platinum (Pt) lines, with feature sizes below 50 nm. Conductors within the ALD dielectric layer are vertically aligned carbon nanotubes (CNTs) or atomic-scale metallic nanowires (e.g., copper nanowires), acting as through-insulator vias (TIVs) to establish electrical contacts between the conductive patterns and the graphene nanoribbon contact areas of the quantum dot components. This fabrication requires precision at the picometer scale for alignment.

classDiagram
    class ElectronicModule {
        -PolymerNanocompositeMatrix baseboard
        -ALD_Dielectric insulatingLayer
        -QuantumDotArray embeddedComponent
        -GrapheneNanoribbon contactAreas
        -MetallicNanoparticlePattern conductivePatterns
        -CarbonNanotubeVias conductors
    }
    class PolymerNanocompositeMatrix {
        +SelfAssembly()
        +EmbedCNTs()
    }
    class ALD_Dielectric {
        +HFO2_Layer()
        +AL2O3_Layer()
    }
    class QuantumDotArray {
        +SensorFunctionality()
        +GrapheneNanoribbonPads()
    }
    class MetallicNanoparticlePattern {
        +DirectedSelfAssembly()
        +EBL_PtLines()
    }
    class CarbonNanotubeVias {
        +VerticalAlignment()
        +AtomicScaleNanowires()
    }
    ElectronicModule *-- PolymerNanocompositeMatrix
    ElectronicModule *-- ALD_Dielectric
    ElectronicModule *-- QuantumDotArray
    QuantumDotArray *-- GrapheneNanoribbon
    ElectronicModule *-- MetallicNanoparticlePattern
    ElectronicModule *-- CarbonNanotubeVias

3. Operational Parameter Expansion - High Temperature/Pressure Environments

Enabling Description: An electronic module designed for extreme operational environments (e.g., downhole oil/gas exploration, aerospace engine control) capable of sustained operation at temperatures up to 300°C and pressures up to 200 MPa (approx. 2000 atmospheres). The baseboard is constructed from a silicon carbide (SiC) or aluminum nitride (AlN) ceramic substrate, chosen for its high thermal stability and mechanical strength. The hardened insulating layer is a high-temperature polybenzimidazole (PBI) polymer film, or a thin layer of boron nitride (BN) deposited via chemical vapor deposition (CVD), specifically engineered to maintain insulating properties and structural integrity under extreme heat and pressure. The embedded component consists of wide bandgap (WBG) semiconductors (e.g., SiC MOSFETs, GaN HEMTs) configured with high-temperature metallization (e.g., tungsten, platinum, nickel silicide) for their contact areas. Conductive patterns on the PBI/BN layer are formed using refractory metals (e.g., molybdenum, tantalum) patterned by laser ablation, ensuring thermal and chemical stability. Conductors within the insulating layer are high-aspect-ratio through-silicon vias (TSVs) filled with tungsten or an intermetallic compound like Cu/Sn-Ag, providing robust electrical contacts that withstand thermal cycling and high pressures, minimizing delamination and electromigration effects.

stateDiagram-v2
    State_Init: Module Assembly
    State_Init --> State_LowTempPressure: Initial Deployment
    State_LowTempPressure --> State_HighTempPressure: Operational Mode
    State_HighTempPressure --> State_HighTempPressure: Sustained Operation (300C, 200MPa)
    State_HighTempPressure --> State_Cooling: Deactivation/Cooling
    State_HighTempPressure --> State_CriticalFailure: Over-limit Excursion
    State_Cooling --> State_Storage: Return to Ambient
    State_CriticalFailure --> State_Shutdown: Safe Shutdown
    State_HighTempPressure -- (monitor > 300C or > 200MPa) --> State_OverLimitWarning
    State_OverLimitWarning --> State_CriticalFailure

4. Cross-Domain Application - Automotive Engine Control Units (ECUs)

Enabling Description: An electronic module specifically adapted for use as an Engine Control Unit (ECU) in automotive applications, emphasizing robustness against vibration, temperature extremes, and electromagnetic interference (EMI). The baseboard is a high-Tg epoxy resin composite (e.g., FR-4 variant with ceramic fillers or a polyimide-based laminate) for enhanced thermal and mechanical stability, approximately 1.5 mm thick. The hardened insulating polymer layer is a flexible, high-temperature polyimide film (e.g., DuPont™ Pyralux® AP) with integrated damping characteristics to mitigate vibrational stress, laminated onto the baseboard. Embedded components include automotive-grade microcontrollers (e.g., Infineon AURIX™ family), power management ICs, and sensor interface ASICs. These components feature robust, lead-free solder ball grid arrays (BGAs) or copper pillar bumps as contact areas. Conductive patterns on the insulating layer are formed from thick copper traces (e.g., 70 µm) for high current carrying capability and EMI shielding. Furthermore, as explicitly mentioned in US8368201 (FIG. 4), integrated ground planes and Faraday cages (using copper foil plating on cavity sidewalls and above/below components) are incorporated around the embedded components within the baseboard structure to provide electromagnetic protection, connecting to the main ground plane of the ECU. Conductors within the insulating layer are formed by laser-drilled and copper-filled microvias.

graph TD
    A[Automotive Baseboard (High-Tg Epoxy/Polyimide)] --> B{Embed Automotive Microcontroller (e.g., AURIX)}
    B --> C{Embed Power Management ICs/Sensors}
    C --> D[Laminate Flexible Polyimide Insulating Layer with Damping]
    D --> E[Components' BGA/Copper Pillars Against Insulating Layer]
    E --> F[Pattern Thick Copper Traces on Insulating Layer]
    F --> G[Integrate EMI Shielding / Ground Planes (per FIG. 4)]
    G --> H[Form Laser-Drilled, Copper-Filled Microvias]
    H --> I[Finished Automotive ECU Module]

5. Cross-Domain Application - Medical Implants (Neuromodulation)

Enabling Description: An electronic module designed for chronic medical implantation, such as a neuromodulation device (e.g., for deep brain stimulation or spinal cord stimulation), requiring stringent biocompatibility, miniaturization, and long-term reliability. The baseboard is a thin (e.g., 100-200 µm) medical-grade titanium alloy (Ti-6Al-4V) or a specialized ceramic (e.g., Al₂O₃ or ZrO₂) for mechanical support and hermeticity. The hardened insulating polymer layer is a biocompatible Parylene C (poly-para-xylylene) film, deposited conformally via chemical vapor deposition (CVD) to a thickness of 5-10 µm, offering excellent moisture barrier properties and chemical inertness. Embedded components are ultra-low-power neuromodulation micro-chips (e.g., ASICs for signal processing and stimulation), with contact areas comprising platinum-iridium (PtIr) pads for biocompatibility and electrical stability. Conductive patterns on the Parylene C layer are thin-film platinum (Pt) or gold (Au), patterned using photolithography and lift-off techniques to minimize surface roughness and potential for biological interaction. Conductors within the Parylene C layer are formed by laser ablation of microvias and subsequent PtIr or Au metallization, creating direct, robust electrical connections between the PtIr/Au pads of the neuromodulation micro-chips and the thin-film Pt/Au conductive patterns. The entire module is hermetically sealed within a biocompatible encapsulation.

classDiagram
    class MedicalImplantModule {
        -TitaniumAlloy/Ceramic baseboard
        -ParyleneC_Film insulatingLayer
        -NeuromodulationMicrochip embeddedComponent
        -PlatinumIridium contactAreas
        -ThinFilmPt/Au conductivePatterns
        -LaserAblatedPtIr/AuVias conductors
        +BiocompatibleEncapsulation
    }
    class TitaniumAlloy {
        +MedicalGrade()
        +HighStrength()
    }
    class ParyleneC_Film {
        +CVD_Deposition()
        +MoistureBarrier()
    }
    class NeuromodulationMicrochip {
        +UltraLowPower()
        +ASIC_Functionality()
    }
    MedicalImplantModule *-- TitaniumAlloy
    MedicalImplantModule *-- ParyleneC_Film
    MedicalImplantModule *-- NeuromodulationMicrochip
    MedicalImplantModule *-- PlatinumIridium
    MedicalImplantModule *-- ThinFilmPt/Au
    MedicalImplantModule *-- LaserAblatedPtIr/AuVias

6. Cross-Domain Application - Renewable Energy (Smart Grid Sensors)

Enabling Description: An electronic module tailored for deployment as a smart sensor node within harsh outdoor environments of renewable energy infrastructure (e.g., solar farms, wind turbines), demanding extreme longevity, wide operating temperature range, and resistance to environmental degradation. The baseboard is a high-strength, UV-stabilized composite material, such as a fiberglass-reinforced polymer (FRP) or a specialized weatherproof FR-4 laminate, providing structural integrity against mechanical stress and environmental exposure. The hardened insulating polymer layer is a robust fluoropolymer (e.g., PTFE or FEP), chosen for its excellent chemical inertness, UV resistance, and wide operating temperature range (-60°C to +200°C), applied via lamination or spray coating. Embedded components are ultra-low-power sensor microcircuits (e.g., for voltage, current, temperature, vibration monitoring), energy harvesting PMICs, and wireless transceivers. These components feature environmentally hardened contact areas, such as robust copper-nickel-gold pads. Conductive patterns on the fluoropolymer layer are thick film silver (Ag) or copper (Cu) traces with an anti-corrosion overcoat, formed by screen printing or conventional etching. Conductors within the fluoropolymer layer are filled with a UV-stable conductive epoxy or specialized weather-resistant plated vias, establishing durable electrical connections. The module includes an integrated inductive power transfer coil for maintenance-free power delivery and a robust, sealed enclosure.

graph LR
    A[Baseboard: FRP/Weatherproof FR-4] --> B(Insulating Layer: Fluoropolymer (PTFE/FEP))
    B --> C[Embed Components: Ultra-Low-Power Sensors, PMICs, Transceivers]
    C --> D(Component Contact Areas: CuNiAu Pads)
    D --> E[Conductive Patterns: Thick Film Ag/Cu + Overcoat]
    E --> F[Conductors: UV-Stable Conductive Epoxy/Plated Vias]
    F --> G(Integrated Inductive Power Transfer Coil)
    G --> H[Robust Sealed Enclosure]
    H --> I[Smart Grid Sensor Module]

7. Integration with Emerging Tech - AI-driven Manufacturing Optimization

Enabling Description: The manufacturing process for the electronic module, as described, is enhanced through an AI-driven optimization system. An electronic module with embedded components is produced using a baseboard (e.g., FR4), an insulating polymer layer (e.g., pre-preg), embedded microcircuits, conductive patterns, and through-layer conductors. During each critical manufacturing step (e.g., polymer film lamination, component placement, curing, metallization), real-time sensor data (temperature, pressure, alignment accuracy from machine vision, chemical bath composition, viscosity of filler material) is collected and fed to a central AI agent. This AI agent, based on a reinforcement learning or predictive control algorithm, dynamically adjusts operational parameters (e.g., laminator speed and temperature, component placement force and alignment offsets, curing time and temperature profiles, electrochemical deposition parameters) to maximize yield, minimize defects, and optimize electrical performance of the embedded components. For instance, the AI analyzes variations in baseboard flatness and adjusts component insertion depth to ensure optimal contact with the polymer film, or modifies curing profiles based on real-time epoxy polymerization rates. The AI system learns from historical manufacturing data and real-time feedback loops to continuously improve the embedding process, making it adaptive and self-optimizing.

sequenceDiagram
    participant MCS as Manufacturing Control System
    participant Sensors
    participant AI as AI Optimization Agent
    participant ManufacturingTools as Manufacturing Tools (Laminator, Pick&Place, Oven, Plater)

    loop Manufacturing Cycle
        MCS->>ManufacturingTools: Initiate Stage (e.g., Lamination)
        ManufacturingTools->>Sensors: Collect Real-time Data (Temp, Pressure, Viscosity, Alignment)
        Sensors->>AI: Send Real-time Data
        AI->>AI: Analyze Data & Predict Outcomes (Yield, Defects, Performance)
        AI->>AI: Determine Optimal Parameter Adjustments
        AI->>ManufacturingTools: Send Optimized Parameters (e.g., Laminator Speed, Temp)
        ManufacturingTools->>MCS: Report Stage Completion
    end
    AI->>AI: Update Model based on Final Product Quality

8. Integration with Emerging Tech - IoT Sensors for Real-time Monitoring

Enabling Description: An electronic module where the embedded components themselves, or additional micro-sensors integrated within the baseboard and hardened insulating polymer layer, are equipped for real-time monitoring of the module's operational health and environmental conditions. This module comprises a standard FR4 baseboard, a cured epoxy insulating layer, and embedded microcircuits. Additionally, miniature MEMS temperature sensors, strain gauges, and impedance monitoring points are embedded adjacent to critical components and interconnects within the polymer layer. These embedded sensors are connected via dedicated conductors within the hardened insulating polymer layer to a low-power wireless transceiver micro-chip, also embedded within the module. This transceiver continuously collects sensor data (e.g., component temperature, localized strain, interconnect resistance changes) and transmits it via a low-energy wireless protocol (e.g., Bluetooth Low Energy (BLE) or Thread) to a nearby Internet of Things (IoT) gateway. The IoT gateway then relays this data to a cloud-based analytics platform for predictive maintenance, anomaly detection, and long-term performance tracking. This enables continuous, non-invasive health monitoring of the embedded components throughout the module's lifecycle.

graph TD
    A[Electronic Module] --> B{Embedded Components (Microcircuits)}
    A --> C{Embedded IoT Micro-Sensors (Temp, Strain, Impedance)}
    C --> D[Low-Power Wireless Transceiver (Embedded)]
    D -- BLE/Thread --> E(IoT Gateway)
    E -- Internet --> F(Cloud Analytics Platform)
    F --> G{Predictive Maintenance Alerts}
    F --> H{Performance Analytics}

9. The "Inverse" or Failure Mode - Graceful Degradation / Low-Power Mode

Enabling Description: An electronic module designed with an inherent "graceful degradation" capability, allowing for continued, albeit limited, operation upon detection of a primary component failure or a critical power event. The module consists of a multi-layer baseboard with redundant, embedded microcontrollers (e.g., a primary high-performance core and a secondary low-power core) within different sections of the baseboard, separated by hardened insulating polymer layers. Each microcontroller has its dedicated power plane and a set of critical contact areas. A dedicated Power Management Unit (PMU), also embedded, continuously monitors the health (e.g., voltage, current draw, clock integrity) of the primary components. Upon detection of a failure in the primary microcontroller or a significant drop in the module's power supply (e.g., battery low), the PMU automatically switches control from the primary core to the secondary low-power core. This secondary core activates a limited-functionality mode, enabling essential operations (e.g., critical data logging, emergency communication, safety shutdown procedures) while deactivating non-essential peripherals to conserve power. The conductors within the insulating layer are designed with redundant paths, allowing the PMU to re-route power and data signals to the operational core.

stateDiagram-v2
    state PrimaryOperational <<start>>
    state LowPowerMode

    PrimaryOperational --> PrimaryFailureDetected: Primary component fails
    PrimaryOperational --> LowBatteryDetected: Power supply critically low

    PrimaryFailureDetected --> TransitionToLowPowerMode: PMU re-routes control
    LowBatteryDetected --> TransitionToLowPowerMode: PMU re-routes control

    TransitionToLowPowerMode --> LowPowerMode: Secondary core activated

    LowPowerMode --> CriticalDataLogging: Essential operation
    LowPowerMode --> EmergencyCommunication: Essential operation
    LowPowerMode --> SafeShutdownProcedure: Essential operation
    LowPowerMode --> PrimaryOperational: Primary system restored (if possible)

10. The "Inverse" or Failure Mode - Environmentally Responsive Disassembly

Enabling Description: An electronic module engineered for environmentally responsive disassembly or degradation at the end of its useful life, addressing e-waste and material recovery. The baseboard is constructed from a biodegradable polymer composite (e.g., polylactic acid (PLA) reinforced with natural fibers). The hardened insulating polymer layer is a thermo-responsive or water-soluble polymer (e.g., polyvinyl alcohol (PVA) or a specific self-dissolving epoxy), designed to lose its adhesive and insulating properties under specific environmental triggers (e.g., elevated temperature (e.g., >80°C) or immersion in water/solvent). Embedded components are standard microcircuits, but their contact areas and the conductive patterns on the insulating layer are made from easily separable or recyclable metals (e.g., pure copper or aluminum). The conductors within the insulating layer are also designed for easy recovery (e.g., solid copper vias). Upon intentional immersion in a hot water bath or a specific solvent at end-of-life, the thermo-responsive/water-soluble polymer layer degrades or dissolves, allowing for clean separation of the baseboard, embedded components, and conductive materials. This facilitates automated sorting and recycling of the constituent materials, minimizing hazardous waste and maximizing resource recovery.

graph TD
    A[Electronic Module] --> B{Baseboard: Biodegradable Polymer (PLA)}
    B --> C{Insulating Layer: Thermo-Responsive/Water-Soluble Polymer (PVA/Self-Dissolving Epoxy)}
    C --> D{Embedded Components: Standard Microcircuits}
    D --> E{Contact Areas/Conductive Patterns: Easily Separable Metals (Cu/Al)}
    E --> F{Conductors: Solid Copper Vias}
    F --> G(Trigger End-of-Life: Heat/Water/Solvent Immersion)
    G --> H[Polymer Degrades/Dissolves]
    H --> I[Separation of Materials: Baseboard, Components, Conductors]
    I --> J[Facilitated Recycling/Degradation]

Combination Prior Art Scenarios

These scenarios combine the teachings of US 8368201 with existing open-source standards, thereby expanding the prior art landscape.

US 8368201 with IPC-A-610 and IPC-7351 Standards for Embedded Components:
- Description: The method and resulting electronic module of US 8368201, which describes embedding components within a baseboard and forming electrical contacts, are considered in the context of widely accepted industry standards for electronic assembly. Specifically, the principles of ensuring proper alignment of components and reliable electrical contacts, as detailed in US 8368201 (e.g., aligning component holes relative to conductive patterns in stage E and G, using contact protrusions 9 for connection in FIG. 3), are combined with the "Acceptability of Electronic Assemblies" (IPC-A-610) criteria for embedded components and the "Generic Requirements for Surface Mount Design and Land Pattern Standard" (IPC-7351). This combination establishes that the fabrication of conductive patterns and component placement for embedded chips, where components are pressed against a polymer film, must meet specific quality and reliability standards, making any future incremental improvement in manufacturing tolerances or connection integrity for such embedded modules an obvious design choice for a skilled artisan seeking to comply with IPC standards. This extends to visual inspection criteria (IPC-A-610) for microvias and embedded pad structures, and land pattern design considerations (IPC-7351) for the component contact areas and conductive patterns on the insulating layer.
US 8368201 with RISC-V Open Standard Architecture:
- Description: The methodology of US 8368201 for embedding microcircuits within a base is applied specifically to integrate open-source RISC-V processor cores. An electronic module is constructed wherein the "at least one component within the baseboard" (claim 1) is a bare die RISC-V microcontroller (e.g., a commercial implementation of the RV32I or RV64GC instruction set architecture). The baseboard, hardened insulating polymer layer, conductive patterns, and conductors are manufactured according to the techniques described in US 8368201 (e.g., using FR4, RCC foil, copper metallization as in FIG. 1). The design of the RISC-V chip's contact areas and the corresponding conductive patterns on the polymer layer are made in accordance with the open specifications for the RISC-V processor interface, utilizing standard flip-chip or copper pillar bump geometries. This explicitly discloses embedding an open-source, configurable processor architecture directly into a circuit board structure via the described method, making any future embedding of other open-source IP cores or variations of RISC-V chips using similar methods obvious to one skilled in the art.
US 8368201 with Open-Source Hardware Initiatives (e.g., Arduino/Raspberry Pi Design Principles):
- Description: The electronic module and embedding methodology of US 8368201 are utilized to create a highly compact, ruggedized version of an open-source hardware platform, such as an Arduino-compatible microcontroller board or a simplified Raspberry Pi compute module. The "at least one component within the baseboard" (claim 1) comprises the core microcontroller (e.g., ATmega328P for Arduino, or a Broadcom SoC for Raspberry Pi) and associated essential passive components (resistors, capacitors) as bare dies, embedded directly into a multi-layer FR4 baseboard using the process of US 8368201. The hardened insulating polymer layer and internal conductors are formed to create the necessary interconnections, power planes, and ground planes, effectively shrinking the form factor. External conductive patterns on the outer surface of the hardened insulating polymer layer provide standard interface connections (e.g., GPIO pins, USB data lines) consistent with the open-source hardware schematics. This demonstrates the application of the embedding technique to integrate common, publicly available electronic building blocks into a compact, embedded form, thus making the embedding of other standard electronic components or functional blocks from open-source hardware designs an obvious extension.