Prior art

The full patent text for US11538763B2, "Chip package," primarily details its own patent family lineage in the "Description" section, rather than listing external prior art references in a dedicated "References Cited" section. Therefore, the "patent citations" identified within the provided authoritative text are the patent's own direct ancestors.

The earliest priority date for US11538763B2 is September 26, 2012, based on U.S. provisional patent application No. 61/705,649.

It is important to note that an applicant's own earlier-filed, co-pending, and published application or granted patent is generally not considered "prior art" under 35 U.S.C. § 102 against claims in a later-filed continuation application if those claims are fully supported by the disclosure of the earlier application and are entitled to the earlier application's priority date. Therefore, the patents listed below, being direct ancestors in the same patent family, would typically not anticipate the claims of US11538763B2 for subject matter sharing the common priority date. However, if US11538763B2 were to introduce new subject matter not disclosed in the earlier patents, and those earlier patents were published before the effective filing date of the new matter, then the earlier patents could potentially anticipate only those specific new claims.

Given the instructions, the following are the patent citations found within the provided text of US11538763B2:

Most Relevant Patent Citations for US11538763B2

1. U.S. Pat. No. 10,622,310

• Full Citation: U.S. Pat. No. 10,622,310.
• Publication/Filing Date: Granted from application Ser. No. 15/261,956, which was filed on September 11, 2016. The grant date for US10622310 was April 7, 2020.
• Brief Description: US10622310 is a direct ancestor in the patent family of US11538763B2. It generally describes a chip package or display device, likely involving a glass substrate with through-glass vias (metal conductors) and methods for manufacturing such structures. As a parent patent, its disclosure is expected to encompass the core subject matter of US11538763B2.
• Potential Anticipation under 35 U.S.C. § 102: Due to its status as a parent patent to US11538763B2, and both sharing the earliest common priority date of September 26, 2012, US10622310 would typically not anticipate any claims of US11538763B2 that are fully supported by the earlier disclosures. The claims of US11538763B2 are generally entitled to the same priority date as the subject matter disclosed in US10622310. Without a detailed, claim-by-claim comparison of the disclosures for any potentially new matter introduced in US11538763B2 that might not be entitled to the earliest priority date, it is highly probable that US10622310 does not anticipate the claims of US11538763B2.

2. U.S. Pat. No. 9,615,453

• Full Citation: U.S. Pat. No. 9,615,453.
• Publication/Filing Date: Granted from application Ser. No. 14/036,256, which was filed on September 25, 2013. The grant date for US9615453 was April 4, 2017.
• Brief Description: US9615453 is also an ancestor in the patent family of US11538763B2, being a continuation-in-part (CIP) of application Ser. No. 14/036,256, which ultimately claims the earliest priority date of September 26, 2012, shared with US11538763B2. This patent likely describes a method and structure for manufacturing a glass substrate and integrating one or more chips onto it, consistent with the broader technical field of US11538763B2.
• Potential Anticipation under 35 U.S.C. § 102: As a direct ancestor sharing the earliest common priority date (September 26, 2012) with US11538763B2, US9615453 would typically not anticipate any claims of US11538763B2 that are fully supported by its own disclosure and entitled to this common priority date. Similar to US10622310, a detailed analysis would be required to determine if any specific claims of US11538763B2 are directed to new subject matter not present in US9615453's disclosure and not entitled to the earlier priority date. Absent such an analysis, it is most probable that US9615453 does not anticipate the claims of US11538763B2.