US 9592660

US Patent 9,592,660 Summary

Title: Heated build platform and system for three dimensional printing methods
Current Assignee: Stratasys Inc. (formerly Arevo Inc.)
Inventors: Riley Reese, Hemant Bheda
Filing Date: December 17, 2014
Issue Date: March 14, 2017

Abstract:
The patent describes an apparatus designed as a base for 3D printing objects using high-temperature thermoplastics. This apparatus includes a heated build platform, a thin removable plate secured on top, and a high-temperature polymer coating applied to the removable plate. The polymer coating may also have a surface treatment to enhance adhesion between the 3D object and the printing surface. The removable plate has a low coefficient of thermal expansion (CTE) to prevent warping when heated, thus maintaining a flat printing surface. A key feature is that the thin removable plate allows 3D objects to detach easily upon cooling without damaging the coating, the plate, or the object. This design also facilitates continuous printer operation by allowing for quick plate changes for cooling and subsequent printing.

Plain-Language Overview of Independent Claims:

Independent Claim 1:
This claim describes a 3D printing build apparatus for creating thermoplastic objects using additive manufacturing. It consists of:

• A build platform with a heating unit to control its temperature.
• A thermally conductive plate positioned next to the build platform.
• A polymer coating applied to the surface of the thermally conductive plate. This coating must:
  • Help the 3D object stick to the plate during printing.
  • Allow the 3D object to be removed easily once formed and cooled, without needing chemical or mechanical removal of the coating from the object, and without damaging the coating, the plate, or the object itself.
  • Crucially, the polymer coating is explicitly not a polymer tape.

Litigation Status:
US patent 9,592,660 is currently active and is set to expire on January 8, 2035. The patent has been involved in several litigation proceedings:

• Multiple US cases have been filed in the Texas Eastern District Court.
• A US case has been filed in the Texas Western District Court.
• An Inter Partes Review (IPR) case, IPR2025-00257, was filed before the Patent Trial and Appeal Board (PTAB) and is currently pending (instituted).
• The patent is part of a legal battle where Stratasys Inc. (the current assignee) alleges that Bambu Lab's 3D printers infringe upon this and other patents. Stratasys acquired the intellectual property for this patent from Arevo Inc. in March 2024.

I do not have authoritative information specifically placing US patent 9,592,660 in CAFC dockets for 2026, though general Federal Circuit updates for April and June 2026 were reviewed.

The search results provide detailed information about the litigation involving US Patent 9592660, primarily focusing on Stratasys against Bambu Lab.

Here's a breakdown of the cases:

1. PTAB Case: IPR2025-00257

• Plaintiff(s) / Petitioner(s): SHENZHEN TUOZHU TECHNOLOGY CO., LTD., BAMBULAB LIMITED, SHANGHAI LUNKUO TECHNOLOGY CO. LTD., TUOZHU TECHNOLOGY LIMITED, AND BAMBULAB USA, INC.
• Defendant(s) / Patent Owner: Stratasys, Inc.
• Jurisdiction: Patent Trial and Appeal Board (PTAB)
• Case Number: IPR2025-00257
• Filing Date: 2025-01-14 (as per Legal Events in the original patent text, confirmed as the IPR filing in search results)
• Current Status: Instituted (Pending - Instituted)

2. District Court Case: Stratasys, Inc. v. Shenzhen Tuozhu Technology Co. Ltd. et al. (Eastern District of Texas)

• Plaintiff(s): Stratasys, Inc.
• Defendant(s): Shenzhen Tuozhu Technology Co. Ltd., Shanghai Lunkuo Technology Co., and Tuozhu Technology Limited, Bambu Lab Ltd.
• Jurisdiction: U.S. District Court for the Eastern District of Texas, Marshall Division
• Case Number: 2:24-cv-00644-JRG
• Filing Date: August 2024 (specifically mentions "Last Thursday industrial 3D printer manufacturer, Stratasys, filed two lawsuits... in August 2024")
• Current Status: Consolidated into Case No. 2:25-cv-00465-JRG as of June 2025. Prior to consolidation, Bambu Lab's motion to dismiss was denied on May 29, 2025.

3. District Court Case: Stratasys, Inc. v. Shenzhen Tuozhu Technology Co. Ltd. et al. (Eastern District of Texas - Consolidated Case)

• Plaintiff(s): Stratasys, Inc.
• Defendant(s): Bambu Lab's full product lineup across ten patents, including Shenzhen Tuozhu Technology Co., Ltd., Shanghai Lunkuo Technology Co., Ltd., and Tuozhu Technology Limited, Bambu Lab Ltd.
• Jurisdiction: U.S. District Court for the Eastern District of Texas
• Case Number: 2:25-cv-00465-JRG
• Filing Date: This case number is the consolidated case from lead cases 2:24-cv-00644-JRG and 2:24-cv-00645-JRG, with consolidation occurring in June 2025. The original patent text indicated a filing date for 2:25-cv-00465 as "2025" and search results confirm the consolidation in June 2025.
• Current Status: Active and involves a jury trial expected.

4. District Court Case: BambuLab USA, Inc. et al. v. Stratasys, Inc. (Western District of Texas)

• Plaintiff(s): BambuLab USA, Inc. et al. (This is a declaratory judgment action by Bambu Lab USA).
• Defendant(s): Stratasys, Inc.
• Jurisdiction: U.S. District Court for the Western District of Texas, Austin Division
• Case Number: 1:24-cv-01511
• Filing Date: December 9, 2024.
• Current Status: Pending. The case was reassigned to Judge Alan D Albright on March 27, 2025.

Note on European Litigation:
While the search results mention a European patent (EP2964450) and Unified Patent Court (UPC) litigation (e.g., UPC-CFI-305/2026, UPC-CFI-0001952/2025) between Stratasys and Bambu Lab, these cases involve a European patent and are not directly "known litigation involving US patent 9592660" as explicitly requested. The request specifies "US patent 9592660" and focuses on US litigation sources.

Based on the information available:

The following is a list of known litigation involving US patent 9592660:

• Case 1: Inter Partes Review (IPR2025-00257)

  • Plaintiff(s) / Petitioner(s): Shenzhen Tuozhu Technology Co., Ltd., Bambulab Limited, Shanghai Lunkuo Technology Co. Ltd., Tuozhu Technology Limited, and BambuLab USA, Inc.
  • Defendant(s) / Patent Owner: Stratasys, Inc.
  • Jurisdiction: Patent Trial and Appeal Board (PTAB)
  • Case Number: IPR2025-00257
  • Filing Date: January 14, 2025.
  • Current Status: Instituted (Pending - Instituted).

• Case 2: Patent Infringement Lawsuit (Consolidated)

  • Plaintiff(s): Stratasys, Inc.
  • Defendant(s): Shenzhen Tuozhu Technology Co. Ltd., Shanghai Lunkuo Technology Co., Ltd., Tuozhu Technology Limited, and Bambu Lab Ltd.
  • Jurisdiction: U.S. District Court for the Eastern District of Texas
  • Case Number: 2:25-cv-00465-JRG (consolidated from lead and member cases including 2:24-cv-00644-JRG).
  • Filing Date: The original lawsuits (e.g., 2:24-cv-00644-JRG) were filed in August 2024, and the consolidation into 2:25-cv-00465-JRG occurred in June 2025.
  • Current Status: Active, with a jury trial expected.

• Case 3: Declaratory Judgment Action

  • Plaintiff(s): BambuLab USA, Inc. et al.
  • Defendant(s): Stratasys, Inc.
  • Jurisdiction: U.S. District Court for the Western District of Texas, Austin Division
  • Case Number: 1:24-cv-01511
  • Filing Date: December 9, 2024.
  • Current Status: Pending. The case was reassigned to Judge Alan D Albright on March 27, 2025.Known litigation involving US patent 9592660 includes the following cases:

• Case 1: Inter Partes Review (IPR2025-00257)

  • Plaintiff(s) / Petitioner(s): SHENZHEN TUOZHU TECHNOLOGY CO., LTD., BAMBULAB LIMITED, SHANGHAI LUNKUO TECHNOLOGY CO. LTD., TUOZHU TECHNOLOGY LIMITED, and BAMBULAB USA, INC.
  • Defendant(s) / Patent Owner: Stratasys, Inc.
  • Jurisdiction: Patent Trial and Appeal Board (PTAB)
  • Case Number: IPR2025-00257
  • Filing Date: January 14, 2025.
  • Outcome or Current Status: Instituted (Pending - Instituted).

• Case 2: Patent Infringement Lawsuit (Consolidated in Eastern District of Texas)

  • Plaintiff(s): Stratasys, Inc.
  • Defendant(s): Shenzhen Tuozhu Technology Co. Ltd., Shanghai Lunkuo Technology Co., Ltd., Tuozhu Technology Limited, and Bambu Lab Ltd.
  • Jurisdiction: U.S. District Court for the Eastern District of Texas
  • Case Number: 2:25-cv-00465-JRG (This case number represents a consolidation of earlier cases, including 2:24-cv-00644-JRG, into a single action).
  • Filing Date: The original lawsuits (e.g., 2:24-cv-00644-JRG) were filed in August 2024. The consolidation into 2:25-cv-00465-JRG occurred in June 2025.
  • Outcome or Current Status: Active, with a jury trial expected. Prior to consolidation, a motion to dismiss filed by Bambu Lab in the 2:24-cv-00644 case was denied on May 29, 2025.

• Case 3: Declaratory Judgment Action (Western District of Texas)

  • Plaintiff(s): BambuLab USA, Inc. et al.
  • Defendant(s): Stratasys, Inc.
  • Jurisdiction: U.S. District Court for the Western District of Texas, Austin Division
  • Case Number: 1:24-cv-01511
  • Filing Date: December 9, 2024.
  • Outcome or Current Status: Pending. The case was reassigned to Judge Alan D Albright on March 27, 2025.

Proceedings overview

There is one AIA trial proceeding on file for US Patent 9,592,660. This proceeding has reached a Final Written Decision. The bottom-line defensive posture for a defendant will depend heavily on the specific claims challenged and their outcomes in the FWD.

IPR2025-00257 — Shenzhen Tuozhu Technology Co., Ltd. et al. v. Stratasys, Inc. et al.

• Type: Inter Partes Review
• Filed: 2024-12-09
• Status: Final Written Decision, last modified 2026-06-03. This means the PTAB has issued a final determination on the patentability of the challenged claims.
• Judge panel: Information not available in the provided patent text or readily found in a preliminary search. (To be obtained from the FWD document itself)
• Petition grounds: Information not available in the provided patent text or readily found in a preliminary search. (To be obtained from the Petition or Institution Decision)
• Institution decision: Information not available in the provided patent text or readily found in a preliminary search. (To be obtained from the Institution Decision document)
• Final Written Decision (if issued): The specific claim-level verdict is not available in the provided patent text. A detailed review of the Final Written Decision document is required to determine which independent and dependent claims were canceled or held patentable.
• Settlement / termination: Information not available in the provided patent text or readily found in a preliminary search. (To be obtained from PTAB records if applicable)
• Appeal: Information not available in the provided patent text or readily found in a preliminary search. (To be obtained from PTAB or Federal Circuit records)
• Defensive value: The defensive value for a defendant facing assertion of this patent hinges entirely on the outcome of the Final Written Decision in IPR2025-00257. If key asserted claims were invalidated, any infringement theory built on those claims would be severely undermined. If the patent owner prevailed, an IPR-based defense will be more challenging, and alternative strategies would need to be considered.

Strategic summary

As of the current date, only one AIA trial proceeding, IPR2025-00257, has been filed against US Patent 9,592,660, and it has reached a Final Written Decision. Without access to the specific details of the Final Written Decision, it is impossible to definitively state which claims of 9,592,660 are now CANCELED vs. SUSTAINED vs. UNTESTED. The impact of this IPR on the patent's scope and the viability of future assertions depends entirely on the outcome detailed in the FWD.

Regarding the estoppel landscape, if IPR2025-00257 resulted in a Final Written Decision, then under 35 U.S.C. § 315(e)(2), the petitioner (Shenzhen Tuozhu Technology Co., Ltd. et al.) and any parties in privity with them would be estopped from asserting in any other USPTO proceeding or in any civil action any ground that was raised or reasonably could have been raised during the IPR. For a defendant currently being asserted against, the availability of prior-art grounds depends on whether they are in privity with the IPR petitioner. If not, they may still be able to challenge the patent using prior art that was not used in IPR2025-00257. The listed petitioner suggests a potential defensive aggregator or a party accused of infringement has challenged the patent.

Recommended next steps

To determine the precise impact of IPR2025-00257 on US Patent 9,592,660 and formulate a defensive strategy, the immediate next step is to obtain and thoroughly review the Final Written Decision for IPR2025-00257. This document will provide the specific claim-by-claim patentability determinations made by the PTAB.

You can access PTAB decisions via the USPTO PTAB E2E search portal https://ptab.uspto.gov/#/search/decisions by entering "IPR2025-00257" into the search field. This will allow you to read the detailed reasoning for each challenged claim, identify the judge panel, understand the petition grounds, and determine the exact disposition of the patent claims. Without this document, the strategic implications remain largely speculative. Additionally, investigate if an appeal to the Federal Circuit was filed using the IPR number or patent number on the Federal Circuit's docket or CourtListener to determine if the FWD has been upheld or overturned.

Inventors

• Riley Reese (Arevo Inc.)
• Hemant Bheda (Arevo Inc.)

Both inventors were associated with Arevo Inc., the original assignee, at the time of the initial assignment. There is no information provided to suggest their departure within 12 months of filing.

Original assignee

The original assignee named on the issued patent is Arevo Inc..
Arevo Inc.'s primary line of business, as described in the patent, appears to be related to 3D printing methods, specifically developing heated build platforms for high-temperature thermoplastics.
The current status of Arevo Inc. is that it has assigned its interest in this patent to Stratasys, Inc. as of September 18, 2023. The patent text does not indicate whether Arevo Inc. continues to operate as an independent entity or has been acquired or dissolved.

Assignment timeline

• 2014-11-25 (executed) / recorded 2015-06-16 — Reel 035923/0099

  • Conveyance: Assignment
  • Assignor: Hemant Bedha (as listed in 2015 record, later corrected), Riley Reese
  • Assignee: Arevo Inc.
  • Correspondent: Not recorded in source data.
  • Context: Initial assignment from inventors to the company.

• 2018-04-20 to 2018-04-23 (executed) / recorded 2018-04-26 — Reel 046024/0372

  • Conveyance: Corrective Assignment
  • Assignor: Riley Reese, Hemant Bheda
  • Assignee: AREVO, INC. (corrected name from Arevo Inc.)
  • Correspondent: Not recorded in source data.
  • Context: Corrective assignment to update an assignor's last name (Bedha to Bheda) and assignee's name (Arevo Inc. to AREVO, INC.).

• 2023-02-06 (executed) / recorded 2023-08-31 — Reel 064789/0954

  • Conveyance: Security Interest
  • Assignor: Arevo, Inc
  • Assignee: McGeary Cukor LLC
  • Correspondent: Not recorded in source data.
  • Context: Arevo, Inc. granted a security interest in the patent to McGeary Cukor LLC.

• 2023-09-15 (executed) / recorded 2023-09-18 — Reel 064942/0384

  • Conveyance: Assignment of Assignors Interest
  • Assignor: AREVO, INC.
  • Assignee: STRATASYS, INC.
  • Correspondent: Not recorded in source data.
  • Context: Transfer of patent ownership from Arevo, Inc. to Stratasys, Inc.

• Not specified (executed) / recorded 2023-09-20 — Reel Not specified

  • Conveyance: Release by Secured Party
  • Assignor: McGeary Cukor LLC
  • Assignee: AREVO INC
  • Correspondent: Not recorded in source data.
  • Context: Release of the security interest by McGeary Cukor LLC to Arevo Inc., likely in conjunction with the sale of the patent to Stratasys, Inc.

Timeline diagram

timeline
    title Ownership of US 9592660
    2014 : Filed by Arevo Inc.
    2015 : Issued
    2015 : Inventors assigned to Arevo
    2018 : Corrective assignment
    2023 : Security interest to McGeary
         : Assigned to Stratasys Inc.
         : Security interest released
    2024 : Litigation filed

NPE / troll-pattern signals

1. Shell-entity transfer — Unclear. McGeary Cukor LLC took a security interest in the patent (recorded 2023-08-31, reel 064789/0954). While it's not an ownership transfer, such entities can be associated with financing for assertion. However, the subsequent full assignment was to Stratasys, Inc., a known operating company.
2. Known asserter in the chain — Not present. Stratasys, Inc. is the current assignee. Stratasys is a well-known operating company in the 3D printing industry and is not typically identified as a Non-Practicing Entity (NPE). McGeary Cukor LLC is not typically listed as a known NPE.
3. Repeat correspondent across the chain — Not determinable. Correspondent information is not provided in the source data.
4. Cascading transfers — Not present. There was a security interest, followed by an assignment of ownership and then a release of the security interest within a short period (August-September 2023). However, this sequence represents a single financing/sale event rather than multiple consecutive transfers of ownership through different entities.
5. Pre-litigation transfer — Present. The patent was assigned to Stratasys, Inc. on September 18, 2023. The provided legal events show litigation filed in Texas Western District Court (case 1:24-cv-01511) and Texas Eastern District Court (case 2:24-cv-00644) in 2024, and another in 2025 (case 2:25-cv-00465), and a PTAB case IPR2025-00257 filed in 2025. The earliest listed litigation dates are within six months of the transfer of ownership to Stratasys, Inc., suggesting the transfer may have been made in preparation for assertion.
6. Bankruptcy fire-sale — Not present. There is no indication in the provided legal events that Arevo, Inc. filed for bankruptcy.
7. Privateering — Unclear. While Stratasys, Inc. is an operating company, the close proximity of the assignment to the initial litigation filings could suggest a strategic assertion. Without further SEC filings or specific reporting, it's difficult to ascertain if this is a privateering arrangement.
8. Defensive aggregator (anti-NPE) — Not present. The patent chain does not terminate at a known defensive aggregator like RPX, AST, LOT Network, Unified Patents, or Open Invention Network.

Verdict

Operating-company assertion

The verdict is "Operating-company assertion" with moderate confidence. While there is a strong signal for a pre-litigation transfer (assignment to Stratasys, Inc. on 2023-09-18, followed by litigation filings in 2024), Stratasys, Inc. is a well-established operating company in the 3D printing sector and the current assignee. This suggests they are asserting the patent to protect their market or gain a competitive advantage rather than acting as a traditional NPE.

USPTO Assignment Center search page for verification: https://assignmentcenter.uspto.gov/

The search results provide abstracts or descriptions for some of the cited patents. I will now process them one by one, focusing on the key distinguishing features of US9592660B2, particularly the polymer coating (not tape) and easy, damage-free removal upon cooling.

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Analysis of Prior Art for US9592660B2

1. US6722872B1

• Full Citation: US6722872B1 - High temperature modeling apparatus; Stratasys, Inc.; Publication date: 2004-04-20.
• Publication/Filing Date: Priority date 1999-06-23, Publication date 2004-04-20.
• Brief Description: This patent describes a three-dimensional modeling apparatus that builds objects in a heated build chamber by dispensing modeling material, such as thermoplastic, onto a base. It focuses on maintaining the build chamber temperature to relieve stresses and prevent warping in the finished model. The apparatus includes a heated build chamber isolated from the printer's motion control components and electronics.
• Potential Anticipation (35 U.S.C. § 102):
  • Claim 1: This patent discloses a "heated build chamber" and the use of "thermoplastic material" for 3D objects. It implies a "build platform" (referred to as a "base") within a heated environment. However, it does not clearly disclose a removable, thermally conductive plate with a polymer coating (not tape) that specifically facilitates adhesion during printing and permits damage-free removal upon cooling. It focuses on the heated chamber for stress relief. Therefore, it does not anticipate the novel aspects of Claim 1 related to the specific build surface and removal mechanism.
  • Claims 3, 4, 5, 6, 8, 13: The concept of a heated build environment and temperature control, potentially using heating elements and sensors, is broadly disclosed. While specific implementations like heater cartridges and thermocouples might be present in the broader Stratasys art this patent draws upon, this document primarily focuses on the heated chamber. The temperatures (150-300°C) for high-temperature thermoplastics are mentioned in US9592660B2's background, and US6722872B1 mentions "high-temperature engineering thermoplastics" in related discussions (EP1552459B1, which cites US6722872B1). Thus, the general idea of a heated platform for high temperatures could be anticipated.

2. US7127309B2

• Full Citation: US7127309B2 - Modeling apparatus with tray substrate; Stratasys, Inc.; Publication date: 2006-10-24.
• Publication/Filing Date: Priority date 2004-02-10, Publication date 2006-10-24.
• Brief Description: This patent describes an apparatus for removably mounting a substrate to a modeling platform in an additive manufacturing machine. The substrate is a rigid tray that provides a modeling surface and can be releasably locked to the platform. It mentions various substrate materials including polymer foam, wire mesh sandpaper, water-soluble wax, or a sheet of magnetic material, and how these are held (e.g., by vacuum forces). The purpose is to maintain accurate positioning and allow removal and reuse of the substrate.
• Potential Anticipation (35 U.S.C. § 102):
  • Claim 1: This patent clearly discloses a "removable substrate" (plate) and a "modeling platform," which are "releasably locked together." It also discusses "adhesion" (implicitly for the modeling material) and "removal of the model" after completion. However, it does not describe a polymer coating (not tape) applied directly to the surface of a thermally conductive plate, or the specific mechanism of damage-free removal upon cooling due to thermal contraction, or the requirement for high-temperature thermoplastics. The listed substrate materials (foam, sandpaper, wax, magnetic sheet) are different from the polymer coating of US9592660B2. Therefore, it does not anticipate Claim 1.
  • Claims 12, 15: The concept of a "removable plate" (substrate) and its "easy removal" is directly relevant. The securing mechanisms (male/female connectors, vacuum, magnets) are described. This patent anticipates the removability aspect and certain securing mechanisms.

3. US20010038168A1

• Full Citation: US20010038168A1 - Method and apparatus for three-dimensional modeling; Stratasys, Inc.; Publication date: 2001-11-08.
• Publication/Filing Date: Priority date 1999-06-23, Publication date 2001-11-08. (This shares the same priority date as US6722872B1, suggesting it's likely a related or parent application).
• Brief Description: Given its shared priority date and assignee with US6722872B1, and similar title to other Stratasys patents on modeling, it likely pertains to methods and apparatus for FDM, including possibly heated build chambers and handling of materials. Without the abstract, it is difficult to determine specifics beyond general 3D modeling using additive processes. The full text of US6722872B1 references "the aforementioned patents," suggesting US20010038168A1 could be part of that family.
• Potential Anticipation (35 U.S.C. § 102): Based on the available information and its relation to US6722872B1, it likely addresses general additive manufacturing processes and potentially heated build environments. However, without specific details on a removable plate, a non-tape polymer coating, and the specific easy-release mechanism of US9592660B2, it is unlikely to fully anticipate Claim 1. It may generally anticipate aspects of a heated build platform or 3D printing methods.

4. US20050058837A1

• Full Citation: US20050058837A1 - Processes for facilitating removal of stereolithographically fabricated objects from platens of stereolithographic fabrication equipment, object release elements for effecting such processes, systems and fabrication processes employing the object release elements, and objects which have been fabricated using the object release elements; Farnworth Warren M.; Publication date: 2005-03-17.
• Publication/Filing Date: Priority date 2003-09-16, Publication date 2005-03-17.
• Brief Description: This patent deals with processes and elements for facilitating the removal of objects from platens in stereolithography (SLA) equipment. This suggests solutions for detaching 3D printed parts from a build surface. The mention of "object release elements" implies materials or methods to aid in this release.
• Potential Anticipation (35 U.S.C. § 102):
  • Claim 1: While it addresses "facilitating removal" of 3D objects from a build surface (platens), the context is stereolithography, not fused filament fabrication using thermoplastics as in US9592660B2. The type of "object release elements" is not specified but would likely differ from a direct polymer coating for FFF. It does not clearly disclose a thermally conductive plate with a non-tape polymer coating for use with high-temperature thermoplastics and the specific cooling-based release mechanism. Therefore, it does not anticipate Claim 1.
  • Claim 12: The general concept of "easier dissociation" or facilitating removal is present. However, the mechanism and materials are distinct.

5. US20050275129A1

• Full Citation: US20050275129A1 - Systems and methods for fabricating 3-D objects; Sambu Shiva P; Publication date: 2005-12-15.
• Publication/Filing Date: Priority date 2004-06-14, Publication date 2005-12-15.
• Brief Description: The title suggests a general apparatus and methods for 3D object fabrication. Without an abstract, it's hard to determine specific features related to the build platform or material release.
• Potential Anticipation (35 U.S.C. § 102): Unclear without more detailed information. It's too generic to assess anticipation of the specific features of US9592660B2, especially the unique coating and removal mechanism.

6. US20060198918A1

• Full Citation: US20060198918A1 - Stereolithography apparatus; Dainippon Screen Mfg. Co., Ltd.; Publication date: 2006-09-07.
• Publication/Filing Date: Priority date 2005-03-03, Publication date 2006-09-07.
• Brief Description: This patent describes a stereolithography apparatus. Similar to US20050058837A1, its context is SLA, which uses photopolymer resins and UV light, not heated thermoplastics and extrusion.
• Potential Anticipation (35 U.S.C. § 102): Given it's for stereolithography, it's highly unlikely to disclose a heated build platform for thermoplastics, a thermally conductive plate, or a non-tape polymer coating designed for adhesion and cooling-based release of thermoplastic objects. Therefore, it does not anticipate Claim 1.

7. US20070037509A1

• Full Citation: US20070037509A1 - Method for the manufacture of a molding as well as a sensor unit for the application thereof; Bernd Renz; Publication date: 2007-02-15.
• Publication/Filing Date: Priority date 2005-05-31, Publication date: 2007-02-15.
• Brief Description: The title suggests a method for manufacturing moldings and associated sensor units. Without an abstract, it's unclear if this relates to 3D printing, specifically build platforms, or material release. "Molding" generally refers to a different manufacturing process than additive manufacturing.
• Potential Anticipation (35 U.S.C. § 102): Unclear without more detailed information.

8. US7261542B2

• Full Citation: US7261542B2 - Apparatus for three dimensional printing using image layers; Desktop Factory, Inc.; Publication date: 2007-08-28.
• Publication/Filing Date: Priority date 2004-03-18, Publication date: 2007-08-28.
• Brief Description: This patent describes an apparatus for 3D printing using "image layers." This often refers to technologies like binder jetting or possibly some form of stereolithography, where layers are formed based on images.
• Potential Anticipation (35 U.S.C. § 102): Like other SLA/binder jetting related patents, it's unlikely to feature a heated build platform for thermoplastics, a thermally conductive plate, or a non-tape polymer coating designed for the specific adhesion and cooling-based release mechanism of US9592660B2. Therefore, it does not anticipate Claim 1.

9. US20100012630A1

• Full Citation: US20100012630A1 - Apparatus for manufacturing a three-dimensional object layer by layer; Eos Gmbh Electro Optical Systems; Publication date: 2010-01-21.
• Publication/Filing Date: Priority date 2008-07-03, Publication date: 2010-01-21.
• Brief Description: EOS is known for selective laser sintering (SLS) and direct metal laser sintering (DMLS). This patent likely relates to these powder-bed fusion methods.
• Potential Anticipation (35 U.S.C. § 102): Powder-bed fusion systems operate differently from FFF. While they use heated build chambers/beds, they don't use a "thermally conductive plate" with a "polymer coating" in the same way for adhesion and removal of extruded thermoplastics. Therefore, it does not anticipate Claim 1.

10. US20100174392A1

• Full Citation: US20100174392A1 - Optimal dimensional and mechanical properties of laser sintered hardware by thermal analysis and parameter optimization; Fink Jeffrey E; Publication date: 2010-07-08.
• Publication/Filing Date: Priority date 2003-06-10, Publication date: 2010-07-08.
• Brief Description: This patent focuses on optimizing laser sintering processes (another powder-bed fusion method) by thermal analysis to improve part properties.
• Potential Anticipation (35 U.S.C. § 102): Similar to US20100012630A1, this is for laser sintering and does not involve the specific build platform structure and coating of US9592660B2. Therefore, it does not anticipate Claim 1.

11. US20100193998A1

• Full Citation: US20100193998A1 - Inorganic ionic support materials for digital manufacturing systems; Stratasys, Inc.; Publication date: 2010-08-05.
• Publication/Filing Date: Priority date 2009-02-02, Publication date: 2010-08-05.
• Brief Description: This patent is from Stratasys and focuses on "inorganic ionic support materials" for digital manufacturing. This is about support structures, not the build surface itself for the primary object.
• Potential Anticipation (35 U.S.C. § 102): While from Stratasys and related to additive manufacturing, it concerns support materials, not the build platform, removable plate, or polymer coating for primary object adhesion and release. Therefore, it does not anticipate Claim 1.

12. US20100316877A1

• Full Citation: US20100316877A1 - Method for preparing polyimide and polyimide prepared using the same; Lg Chem. Ltd.; Publication date: 2010-12-16.
• Publication/Filing Date: Priority date 2007-02-09, Publication date: 2010-12-16.
• Brief Description: This patent describes methods for preparing polyimide. Polyimide is disclosed as a potential polymer coating in US9592660B2 (Claim 2). This patent focuses on the preparation of the polyimide material itself.
• Potential Anticipation (35 U.S.C. § 102):
  • Claim 2: This patent directly relates to polyimide material. While it doesn't describe its use as a coating on a 3D printer build plate with the specific adhesion/release properties of Claim 1, it provides a method for producing the material itself. If the material itself is novel, then this might be prior art for the material, but not necessarily for its application in the specific context of US9592660B2. However, since Claim 2 specifies "wherein the polymer coating is a polyimide," the existence of methods to prepare polyimide is prior art to the material itself, even if not its specific application. It doesn't anticipate the apparatus of Claim 1 but shows the material (polyimide) is known.

13. US20110241947A1

• Full Citation: US20110241947A1 - Additive manufacturing apparatus and method; Mtt Technologies Limited; Publication date: 2011-10-06.
• Publication/Filing Date: Priority date 2008-10-30, Publication date: 2011-10-06.
• Brief Description: The title suggests general additive manufacturing apparatus and methods. MTT Technologies is known for laser powder bed fusion (SLM).
• Potential Anticipation (35 U.S.C. § 102): Similar to other powder-bed fusion patents, it's unlikely to disclose the specific FFF build platform, removable plate, and polymer coating combination of US9592660B2. Therefore, it does not anticipate Claim 1.

14. US8119053B1

• Full Citation: US8119053B1 - Apparatus for three dimensional printing using imaged layers; 3D Systems, Inc.; Publication date: 2012-02-21.
• Publication/Filing Date: Priority date 2004-03-18, Publication date: 2012-02-21.
• Brief Description: From 3D Systems, a major player in SLA, and with "imaged layers" in the title, this likely relates to stereolithography.
• Potential Anticipation (35 U.S.C. § 102): Does not anticipate Claim 1 for the reasons mentioned for other SLA/powder-bed patents (different process, materials, build surface requirements).

15. US20120133083A1

• Full Citation: US20120133083A1 - Stereolithography Machine; Dws S.R.L.; Publication date: 2012-05-31.
• Publication/Filing Date: Priority date 2009-08-03, Publication date: 2012-05-31.
• Brief Description: Explicitly a "Stereolithography Machine."
• Potential Anticipation (35 U.S.C. § 102): Does not anticipate Claim 1.

16. US20120231225A1

• Full Citation: US20120231225A1 - Core-shell consumable materials for use in extrusion-based additive manufacturing systems; Stratasys, Inc.; Publication date: 2012-09-13.
• Publication/Filing Date: Priority date 2010-09-17, Publication date: 2012-09-13.
• Brief Description: From Stratasys and explicitly mentioning "extrusion-based additive manufacturing systems" and "consumable materials." This is relevant to FFF materials.
• Potential Anticipation (35 U.S.C. § 102): This patent focuses on the consumable materials themselves ("core-shell") rather than the build platform, removable plate, or its coating for adhesion/release. It does not anticipate the apparatus features of Claim 1.

17. US8282380B2

• Full Citation: US8282380B2 - Automated 3D build processes; Makerbot Industries; Publication date: 2012-10-09.
• Publication/Filing Date: Priority date 2010-08-18, Publication date: 2012-10-09.
• Brief Description: This patent describes a conveyor or other transport mechanism to support multiple, sequential builds from a 3D fabrication machine. The conveyor "may be heated/cooled, coated, or otherwise treated to assist in adhesion during a build, as well as removal of objects after a build." It mentions automatic removal of objects to restore a buildable surface. It explicitly states it covers "additive fabrication processes including without limitation selective laser sintering, fused deposition modeling, three dimensional printing, and the like".
• Potential Anticipation (35 U.S.C. § 102):
  • Claim 1: This patent is highly relevant. It discloses a heated/cooled build surface (conveyor) that can be "coated, or otherwise treated to assist in adhesion during a build, as well as removal of objects after a build". The "conveyor" acts as a movable "thermally conductive plate" that is heated, and its surface is treated for adhesion and removal. It also mentions "automated removal of objects." The main difference from Claim 1 is that US8282380B2 describes a conveyor as the "transport mechanism" rather than a removable plate that is secured over a build platform and then removed. The phrase "polymer coating which is not a polymer tape" is a strong distinguishing feature of US9592660B2, and US8282380B2 is generic about the "coating or treatment". However, the overall functionality of having a treated, heated/cooled surface for adhesion and removal of objects in an FDM context is present.
  • Claims 3, 4, 6: The concept of a heated/cooled surface and temperature control is present.
  • Claim 12: The idea of assisting in "removal of objects after a build" is explicit.
  • Claim 15: The conveyor is a removable and moving surface, but not necessarily "non-magnetically secured" in the same manner as a plate.

18. US20120328726A1

• Full Citation: US20120328726A1 - Modelling Plate for a Stereolithography Machine, Stereolithography Machine Using Said Modelling Plate and Tool for Cleaning Said Modelling Plate; Dws S.R.L.; Publication date: 2012-12-27.
• Publication/Filing Date: Priority date 2010-01-12, Publication date: 2012-12-27.
• Brief Description: Similar to US20120133083A1, this patent relates to a "Modelling Plate for a Stereolithography Machine."
• Potential Anticipation (35 U.S.C. § 102): Does not anticipate Claim 1 due to being for stereolithography.

19. US20130098068A1

• Full Citation: US20130098068A1 - Temperature control device; Kelk Ltd.; Publication date: 2013-04-25.

• Publication/Filing Date: Priority date 2011-10-19, Publication date: 2013-04-25.

• Brief Description: This patent describes a "temperature control device" in a general sense. Without an abstract specific to 3D printing, it's hard to assess its relevance. The provided snippets are unrelated to 3D printing, discussing patient data and medical devices. This appears to be a mis-match in the search result for the patent. I need to re-evaluate this or state that the search result is not relevant.

  Re-evaluation for US20130098068A1: The search result for this patent (which refers to US20130030831A1) describes "System and method for real time viewing of critical patient data on mobile devices". This is clearly not related to 3D printing. It's possible the original patent text for US9592660B2 cited a different patent with this number or that the Google Patents snippet is incorrect or from a different family. Given the user instruction to prioritize search results, I will state that the search result for this specific publication number is not relevant to 3D printing.

• Potential Anticipation (35 U.S.C. § 102): No anticipation based on the provided search result, as it describes unrelated technology (patient data viewing).

20. US20130186558A1

• Full Citation: US20130186558A1 - Layer transfusion with heat capacitor belt for additive manufacturing; Stratasys, Inc.; Publication date: 2013-07-25.
• Publication/Filing Date: Priority date 2011-09-23, Publication date: 2013-07-25.
• Brief Description: From Stratasys, this patent describes "layer transfusion with heat capacitor belt for additive manufacturing." This suggests a method for transferring heat to printed layers, possibly involving a moving belt as a build surface.
• Potential Anticipation (35 U.S.C. § 102): This patent touches on heat management and a moving build surface (belt) in additive manufacturing, similar in concept to a conveyor. However, it doesn't explicitly mention a removable plate secured over a build platform, or a non-tape polymer coating with the specific adhesion/release properties. The "heat capacitor belt" might serve some similar function to a heated plate, but the overall structure and material specifics of the coating are likely different.

21. US20130256953A1

• Full Citation: US20130256953A1 - Method for manufacturing an object by solidifying powder using a laser beam with the insertion of a member for absorbing deformations; Phenix Systems; Publication date: 2013-10-03.
• Publication/Filing Date: Priority date 2011-04-29, Publication date: 2013-10-03.
• Brief Description: This patent describes manufacturing objects by solidifying powder using a laser beam, i.e., powder bed fusion.
• Potential Anticipation (35 U.S.C. § 102): Does not anticipate Claim 1 as it's for powder bed fusion, not FFF with a polymer coating.

22. US20130287934A1

• Full Citation: US20130287934A1 - Liquid Metal Digital Manufacturing System; Pallant Satnarine Ramsundar; Publication date: 2013-10-31.
• Publication/Filing Date: Priority date 2012-04-30, Publication date: 2013-10-31.
• Brief Description: This patent describes a system for manufacturing with "liquid metal."
• Potential Anticipation (35 U.S.C. § 102): Not relevant to polymer FFF and its specific build platform/coating. Does not anticipate Claim 1.

23. US20130297320A1

• Full Citation: US20130297320A1 - Voice-controlled three-dimensional fabrication system; Anthony James Buser; Publication date: 2013-11-07.
• Publication/Filing Date: Priority date 2012-05-04, Publication date: 2013-11-07.
• Brief Description: This patent describes a "voice-controlled" 3D fabrication system, focusing on the control interface, not the build platform.
• Potential Anticipation (35 U.S.C. § 102): Not relevant to the physical structure of the build platform or coating. Does not anticipate Claim 1.

24. US8827684B1

• Full Citation: US8827684B1 - 3D printer and printhead unit with multiple filaments; Radiant Fabrication; Publication date: 2014-09-09.
• Publication/Filing Date: Priority date 2013-12-23, Publication date: 2014-09-09.
• Brief Description: This patent describes a fused filament fabrication (FFF) printer with a fixed extrusion module having multiple printheads. It focuses on printing speed and the use of multiple printheads, sharing a common heating block. It mentions FFF and the expiration of earlier patents leading to low-cost alternatives.
• Potential Anticipation (35 U.S.C. § 102): While this is clearly an FFF patent, its focus is on the printhead and multiple filaments, not the heated build platform, removable plate, or polymer coating for adhesion and removal. Therefore, it does not anticipate Claim 1.

25. US20150037527A1

• Full Citation: US20150037527A1 - Cover for a three-dimensional printer build surface; Ideal Jacobs Corporation; Publication date: 2015-02-05.
• Publication/Filing Date: Priority date 2013-07-30, Publication date: 2015-02-05.
• Brief Description: This patent describes a "cover for a three-dimensional printer build surface." This is directly relevant to the build surface. Covers can function as adhesion layers or protective layers.
• Potential Anticipation (35 U.S.C. § 102): Without the abstract, it is difficult to determine if this "cover" functions as a non-tape polymer coating with the specific adhesion and cooling-based release properties of US9592660B2. It might refer to a different type of removable surface or a protective layer. If the "cover" is a polymer coating (not tape) providing the specified adhesion and removal properties, it could anticipate Claim 1. Further detail is needed to confirm.

26. US20150145174A1

• Full Citation: US20150145174A1 - Magnetic platen assembly for additive manufacturing system; Stratasys, Inc.; Publication date: 2015-05-28.
• Publication/Filing Date: Priority date 2013-11-22, Publication date: 2015-05-28.
• Brief Description: From Stratasys, this patent describes a "magnetic platen assembly" for an additive manufacturing system. This relates to how a build plate or platen is secured.
• Potential Anticipation (35 U.S.C. § 102):
  • Claim 1: This patent clearly teaches a "platen" (equivalent to a plate) secured to a build platform using magnets. However, it does not specify a polymer coating (not tape) with the specific adhesion and cooling-based release properties of US9592660B2. It might anticipate the removable plate aspect and the magnetic securing method.
  • Claim 15: The use of "magnets" to secure a "plate" (platen) is directly anticipated by this patent. However, Claim 15 of US9592660B2 specifies "non-magnetically secured," which this patent contradicts. This means US20150145174A1 describes a different securing method, making Claim 15 distinguished by US9592660B2's claim, not anticipated. Re-reading Claim 15: "wherein the thermally conductive plate is non-magnetically secured to and removable from the build platform." This implies the absence of magnetic securing. Therefore, US20150145174A1 would teach away from Claim 15's specific non-magnetic limitation.

27. US20150165687A1

• Full Citation: US20150165687A1 - Heating platform and 3d printing apparatus; Xyzprinting, Inc.; Publication date: 2015-06-18.
• Publication/Filing Date: Priority date 2013-12-12, Publication date: 2015-06-18.
• Brief Description: This patent describes a "heating platform and 3D printing apparatus." XYZprinting is a consumer 3D printer manufacturer. This is likely very relevant to heated build plates.
• Potential Anticipation (35 U.S.C. § 102):
  • Claim 1: This is highly likely to describe a "heated build platform" for "3D printing" of "thermoplastics." The question is whether it has a removable plate and a non-tape polymer coating with the specific adhesion/release properties. Without the abstract/details, it's hard to confirm the coating and removal mechanism, but the general concept of a heated build platform is anticipated.
  • Claims 3, 4, 6, 8, 13: The concept of a heating platform with temperature control is very likely to be present.

28. US20160096326A1

• Full Citation: US20160096326A1 - Selective zone temperature control build plate; Tyco Electronics Corporation; Publication date: 2016-04-07.
• Publication/Filing Date: Priority date 2014-10-03, Publication date: 2016-04-07.
• Brief Description: This patent describes a "selective zone temperature control build plate." This is directly relevant to heated build platforms and their control.
• Potential Anticipation (35 U.S.C. § 102):
  • Claim 1: It likely discloses a "heated build platform" with "temperature control." However, it does not explicitly describe a removable plate with a non-tape polymer coating having the specific adhesion/removal properties of US9592660B2. The focus appears to be on zoned heating.
  • Claims 3, 4, 6, 8, 13: The concepts of a heated build platform and temperature control (even selective zone control) are anticipated.

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Summary of Most Relevant Prior Art & General Observations:

Based on the available abstracts and titles, the most relevant prior art documents appear to be those that address:

1. Heated build platforms in FFF: US6722872B1, US20150165687A1, US20160096326A1.
2. Removable build surfaces: US7127309B2, US8282380B2, US20150145174A1, US20150037527A1.
3. Adhesion and part removal: US8282380B2, US20050058837A1 (though for SLA).

US8282380B2 (Makerbot Industries) stands out as particularly relevant because it discloses a conveyor that "may be heated/cooled, coated, or otherwise treated to assist in adhesion during a build, as well as removal of objects after a build" for FFF processes. This directly addresses the function of the coating and removal mechanism in US9592660B2, although the physical form is a conveyor rather than a secured removable plate, and the "coating" is generic, not explicitly "not a polymer tape" or a specific polymer like polyimide. This patent comes closest to the functional claims of US9592660B2 regarding adhesion and removal on a heated/cooled, treated surface.

US7127309B2 (Stratasys, Inc.) is also highly relevant for its explicit teaching of a "removable substrate" or tray that is "releasably locked" to a platform, specifically for 3D modeling machines. This directly anticipates the "removable plate" aspect of US9592660B2.

The key distinguishing feature of US9592660B2, as emphasized in Claim 1, is the "polymer coating attached to a surface of the thermally conductive plate... wherein the polymer coating is not a polymer tape," which facilitates adhesion and permits damage-free removal upon cooling without chemical or mechanical removal of the coating itself. Most cited prior art addresses some aspects (heated platforms, removable platforms, general adhesion/release), but none explicitly disclose this specific non-tape polymer coating with its unique properties on a removable plate for high-temperature FFF applications.

---

Detailed Analysis of Cited Prior Art for US9592660B2

1. US20010038168A1

• Full Citation: US20010038168A1 - Method and apparatus for three-dimensional modeling; Stratasys, Inc.; Publication date: 2001-11-08.
• Publication/Filing Date: Priority date 1999-06-23, Publication date 2001-11-08.
• Brief Description: This patent is a continuation of U.S. Pat. No. 6,722,872, and describes a three-dimensional modeling apparatus for layered deposition of solidifiable modeling material, likely for FDM. It emphasizes building models in a heated build chamber to control stress and distortion.
• Potential Anticipation (35 U.S.C. § 102):
  • Claim 1: Anticipates the "build apparatus for printing a 3D object of thermoplastics employing additive manufacturing methods" and "heated build platform" broadly, but does not specify a removable plate with a non-tape polymer coating for adhesion and specific damage-free removal upon cooling.
  • Claims 6, 8: Anticipates a heated build platform capable of high temperatures and made of certain materials in a broad sense.

2. US6722872B1

• Full Citation: US6722872B1 - High temperature modeling apparatus; Stratasys, Inc.; Publication date: 2004-04-20.
• Publication/Filing Date: Priority date 1999-06-23, Publication date 2004-04-20.
• Brief Description: Describes a 3D modeling apparatus that builds objects in a heated build chamber by dispensing modeling material, focusing on using thermoplastic materials and controlling the chamber temperature to reduce stresses and distortion.
• Potential Anticipation (35 U.S.C. § 102):
  • Claim 1: Broadly anticipates "heated build platform" for "thermoplastics employing additive manufacturing methods." Does not specify the removable plate or the non-tape polymer coating with its specific adhesion and removal properties.
  • Claims 3, 4, 6, 8, 13: Anticipates the general concept of heating and temperature control for a build platform (base) for high temperatures (implied by "high temperature modeling apparatus" and mention of high-temperature engineering thermoplastics in related documents).

3. US20050058837A1

• Full Citation: US20050058837A1 - Processes for facilitating removal of stereolithographically fabricated objects from platens of stereolithographic fabrication equipment, object release elements for effecting such processes, systems and fabrication processes employing the object release elements, and objects which have been fabricated using the object release elements; Farnworth Warren M.; Publication date: 2005-03-17.
• Publication/Filing Date: Priority date 2003-09-16, Publication date 2005-03-17.
• Brief Description: Focuses on facilitating the removal of stereolithographically fabricated objects from build platens, using "object release elements."
• Potential Anticipation (35 U.S.C. § 102):
  • Claim 1: The concept of "facilitating adhesion... and permitting removal of the 3D object" is generally present, but the context is stereolithography, not FFF with thermoplastics, and the "object release elements" are not specified as a non-tape polymer coating. Therefore, it does not anticipate Claim 1 in its entirety.
  • Claim 12: Generally anticipates the concept of "easier dissociation" or facilitating removal.

4. US20050275129A1

• Full Citation: US20050275129A1 - Systems and methods for fabricating 3-D objects; Sambu Shiva P; Publication date: 2005-12-15.
• Publication/Filing Date: Priority date 2004-06-14, Publication date 2005-12-15.
• Brief Description: Generic title "Systems and methods for fabricating 3-D objects." No further details available in the search result.
• Potential Anticipation (35 U.S.C. § 102): Unclear due to lack of specific information.

5. US20060198918A1

• Full Citation: US20060198918A1 - Stereolithography apparatus; Dainippon Screen Mfg. Co., Ltd.; Publication date: 2006-09-07.
• Publication/Filing Date: Priority date 2005-03-03, Publication date 2006-09-07.
• Brief Description: Describes a stereolithography apparatus.
• Potential Anticipation (35 U.S.C. § 102): No anticipation of Claim 1 due to being for stereolithography.

6. US7127309B2

• Full Citation: US7127309B2 - Modeling apparatus with tray substrate; Stratasys, Inc.; Publication date: 2006-10-24.
• Publication/Filing Date: Priority date 2004-02-10, Publication date 2006-10-24.
• Brief Description: An apparatus for removably mounting a rigid "tray substrate" to a modeling platform for 3D modeling machines, allowing for reuse and accurate positioning. Mentions various substrate materials (polymer foam, sandpaper, magnetic sheet).
• Potential Anticipation (35 U.S.C. § 102):
  • Claim 1: Anticipates the "thermally conductive plate disposed adjacent to the build platform" and "removable" aspects. However, it does not disclose the polymer coating (not tape) and its specific adhesion/release properties, or the use of high-temperature thermoplastics.
  • Claim 15: Anticipates the "removable from the build platform" aspect and the use of securing mechanisms (e.g., magnetic, mechanical). It could be argued that the substrate is "non-magnetically secured" if other methods are used, but it also mentions magnetic methods.

7. US20070037509A1

• Full Citation: US20070037509A1 - Method for the manufacture of a molding as well as a sensor unit for the application thereof; Bernd Renz; Publication date: 2007-02-15.
• Publication/Filing Date: Priority date 2005-05-31, Publication date 2007-02-15.
• Brief Description: Concerns the manufacture of moldings and sensor units, not explicitly 3D printing build platforms.
• Potential Anticipation (35 U.S.C. § 102): Unclear due to lack of relevant information.

8. US7261542B2

• Full Citation: US7261542B2 - Apparatus for three dimensional printing using image layers; Desktop Factory, Inc.; Publication date: 2007-08-28.
• Publication/Filing Date: Priority date 2004-03-18, Publication date 2007-08-28.
• Brief Description: Describes an apparatus for 3D printing using "image layers," likely a form of stereolithography or binder jetting.
• Potential Anticipation (35 U.S.C. § 102): No anticipation of Claim 1 due to being for a different 3D printing method.

9. US20100012630A1

• Full Citation: US20100012630A1 - Apparatus for manufacturing a three-dimensional object layer by layer; Eos Gmbh Electro Optical Systems; Publication date: 2010-01-21.
• Publication/Filing Date: Priority date 2008-07-03, Publication date 2010-01-21.
• Brief Description: Likely relates to powder-bed fusion (SLS/DMLS) given the assignee.
• Potential Anticipation (35 U.S.C. § 102): No anticipation of Claim 1 due to being for a different 3D printing method.

10. US20100174392A1

• Full Citation: US20100174392A1 - Optimal dimensional and mechanical properties of laser sintered hardware by thermal analysis and parameter optimization; Fink Jeffrey E; Publication date: 2010-07-08.
• Publication/Filing Date: Priority date 2003-06-10, Publication date 2010-07-08.
• Brief Description: Focuses on optimizing laser sintering processes.
• Potential Anticipation (35 U.S.C. § 102): No anticipation of Claim 1 due to being for a different 3D printing method.

11. US20100193998A1

• Full Citation: US20100193998A1 - Inorganic ionic support materials for digital manufacturing systems; Stratasys, Inc.; Publication date: 2010-08-05.
• Publication/Filing Date: Priority date 2009-02-02, Publication date 2010-08-05.
• Brief Description: Concerns inorganic support materials for digital manufacturing, not the build surface itself for the primary object.
• Potential Anticipation (35 U.S.C. § 102): No anticipation of Claim 1 as it relates to support materials, not the build surface for the main object.

12. US20100316877A1

• Full Citation: US20100316877A1 - Method for preparing polyimide and polyimide prepared using the same; Lg Chem. Ltd.; Publication date: 2010-12-16.
• Publication/Filing Date: Priority date 2007-02-09, Publication date 2010-12-16.
• Brief Description: Describes methods for preparing polyimide.
• Potential Anticipation (35 U.S.C. § 102):
  • Claim 2: Anticipates the material polyimide being known. It does not anticipate the specific application as a non-tape coating on a removable plate for 3D printing adhesion and release.

13. US20110241947A1

• Full Citation: US20110241947A1 - Additive manufacturing apparatus and method; Mtt Technologies Limited; Publication date: 2011-10-06.
• Publication/Filing Date: Priority date 2008-10-30, Publication date 2011-10-06.
• Brief Description: Generic title for additive manufacturing apparatus and method. Likely powder bed fusion based on assignee.
• Potential Anticipation (35 U.S.C. § 102): No anticipation of Claim 1 due to lack of specific relevant features or being for a different 3D printing method.

14. US8119053B1

• Full Citation: US8119053B1 - Apparatus for three dimensional printing using imaged layers; 3D Systems, Inc.; Publication date: 2012-02-21.
• Publication/Filing Date: Priority date 2004-03-18, Publication date 2012-02-21.
• Brief Description: Concerns 3D printing using "imaged layers," likely stereolithography.
• Potential Anticipation (35 U.S.C. § 102): No anticipation of Claim 1 due to being for a different 3D printing method.

15. US20120133083A1

• Full Citation: US20120133083A1 - Stereolithography Machine; Dws S.R.L.; Publication date: 2012-05-31.
• Publication/Filing Date: Priority date 2009-08-03, Publication date 2012-05-31.
• Brief Description: Explicitly a stereolithography machine.
• Potential Anticipation (35 U.S.C. § 102): No anticipation of Claim 1 due to being for stereolithography.

16. US20120231225A1

• Full Citation: US20120231225A1 - Core-shell consumable materials for use in extrusion-based additive manufacturing systems; Stratasys, Inc.; Publication date: 2012-09-13.
• Publication/Filing Date: Priority date 2010-09-17, Publication date 2012-09-13.
• Brief Description: Focuses on core-shell consumable materials for FFF.
• Potential Anticipation (35 U.S.C. § 102): No anticipation of Claim 1 as it relates to consumable materials, not the build platform apparatus.

17. US8282380B2

• Full Citation: US8282380B2 - Automated 3D build processes; Makerbot Industries; Publication date: 2012-10-09.
• Publication/Filing Date: Priority date 2010-08-18, Publication date 2012-10-09.
• Brief Description: Discloses a heated/cooled conveyor as a build surface for multiple sequential builds in FFF, which can be "coated, or otherwise treated to assist in adhesion during a build, as well as removal of objects after a build". It supports automatic object removal.
• Potential Anticipation (35 U.S.C. § 102):
  • Claim 1: Highly relevant. Anticipates the "heated build platform" (conveyor), "thermoplastics employing additive manufacturing methods," and a treated surface "facilitating adhesion... and permitting removal of the 3D object." The conveyor functions as a movable, heated build surface. However, it does not explicitly disclose a removable plate secured over a build platform or a polymer coating which is not a polymer tape with the specific damage-free removal properties upon cooling. The "coating" is generic.
  • Claims 3, 4, 6: Anticipates general heating and temperature control for an FFF build surface.
  • Claim 12: Anticipates the concept of "easier dissociation" for object removal.

18. US20120328726A1

• Full Citation: US20120328726A1 - Modelling Plate for a Stereolithography Machine, Stereolithography Machine Using Said Modelling Plate and Tool for Cleaning Said Modelling Plate; Dws S.R.L.; Publication date: 2012-12-27.
• Publication/Filing Date: Priority date 2010-01-12, Publication date 2012-12-27.
• Brief Description: Concerns a modeling plate for a stereolithography machine.
• Potential Anticipation (35 U.S.C. § 102): No anticipation of Claim 1 due to being for stereolithography.

19. US20130098068A1

• Full Citation: US20130098068A1 - Temperature control device; Kelk Ltd.; Publication date: 2013-04-25.
• Publication/Filing Date: Priority date 2011-10-19, Publication date 2013-04-25.
• Brief Description: The search results indicate this patent describes a "System and method for real time viewing of critical patient data on mobile devices", which is not related to 3D printing.
• Potential Anticipation (35 U.S.C. § 102): No anticipation, as the subject matter is unrelated to 3D printing.

20. US20130186558A1

• Full Citation: US20130186558A1 - Layer transfusion with heat capacitor belt for additive manufacturing; Stratasys, Inc.; Publication date: 2013-07-25.
• Publication/Filing Date: Priority date 2011-09-23, Publication date 2013-07-25.
• Brief Description: Describes a heat capacitor belt for layer transfusion in additive manufacturing. This suggests a heated, movable build surface.
• Potential Anticipation (35 U.S.C. § 102):
  • Claim 1: Broadly anticipates "heated build platform" and a movable build surface. However, it does not explicitly disclose a removable plate secured over a build platform or a non-tape polymer coating with specific adhesion/release properties.

21. US20130256953A1

• Full Citation: US20130256953A1 - Method for manufacturing an object by solidifying powder using a laser beam with the insertion of a member for absorbing deformations; Phenix Systems; Publication date: 2013-10-03.
• Publication/Filing Date: Priority date 2011-04-29, Publication date 2013-10-03.
• Brief Description: Describes manufacturing objects by solidifying powder using a laser beam (powder bed fusion).
• Potential Anticipation (35 U.S.C. § 102): No anticipation of Claim 1 due to being for a different 3D printing method.

22. US20130287934A1

• Full Citation: US20130287934A1 - Liquid Metal Digital Manufacturing System; Pallant Satnarine Ramsundar; Publication date: 2013-10-31.
• Publication/Filing Date: Priority date 2012-04-30, Publication date 2013-10-31.
• Brief Description: Describes a system for manufacturing with liquid metal.
• Potential Anticipation (35 U.S.C. § 102): No anticipation of Claim 1 as it is for metal printing, not polymer FFF.

23. US20130297320A1

• Full Citation: US20130297320A1 - Voice-controlled three-dimensional fabrication system; Anthony James Buser; Publication date: 2013-11-07.
• Publication/Filing Date: Priority date 2012-05-04, Publication date 2013-11-07.
• Brief Description: Focuses on voice control for a 3D fabrication system.
• Potential Anticipation (35 U.S.C. § 102): No anticipation of Claim 1 as it concerns control interface, not the build platform structure.

24. US8827684B1

• Full Citation: US8827684B1 - 3D printer and printhead unit with multiple filaments; Radiant Fabrication; Publication date: 2014-09-09.
• Publication/Filing Date: Priority date 2013-12-23, Publication date 2014-09-09.
• Brief Description: Describes an FFF printer with multiple printheads, focusing on printing speed and multi-material printing.
• Potential Anticipation (35 U.S.C. § 102): Broadly anticipates "FFF printer" for 3D objects. Does not anticipate Claim 1 as its focus is on printheads, not the build platform or its coating.

25. US20150037527A1

• Full Citation: US20150037527A1 - Cover for a three-dimensional printer build surface; Ideal Jacobs Corporation; Publication date: 2015-02-05.
• Publication/Filing Date: Priority date 2013-07-30, Publication date 2015-02-05.
• Brief Description: Describes a "cover for a three-dimensional printer build surface."
• Potential Anticipation (35 U.S.C. § 102):
  • Claim 1: This could anticipate the "polymer coating" aspect if the "cover" is indeed a non-tape polymer coating directly applied to a plate, and exhibits the adhesion/removal properties of Claim 1. However, the abstract alone doesn't provide enough detail to confirm all limitations. It may anticipate the general idea of a modified build surface.

26. US20150145174A1

• Full Citation: US20150145174A1 - Magnetic platen assembly for additive manufacturing system; Stratasys, Inc.; Publication date: 2015-05-28.
• Publication/Filing Date: Priority date 2013-11-22, Publication date 2015-05-28.
• Brief Description: Discloses a magnetic platen assembly for securing a build plate in an additive manufacturing system.
• Potential Anticipation (35 U.S.C. § 102):
  • Claim 1: Anticipates a "thermally conductive plate disposed adjacent to the build platform" and "removable." It does not disclose the specific polymer coating with adhesion/release properties.
  • Claim 15: Discloses a method of securing a removable plate (platen) using magnets. Since Claim 15 of US9592660B2 specifically states "non-magnetically secured," this patent teaches a different securing method and therefore does not anticipate the non-magnetic limitation, but rather presents an alternative.

27. US20150165687A1

• Full Citation: US20150165687A1 - Heating platform and 3d printing apparatus; Xyzprinting, Inc.; Publication date: 2015-06-18.
• Publication/Filing Date: Priority date 2013-12-12, Publication date 2015-06-18.
• Brief Description: Describes a "heating platform and 3D printing apparatus." This is general for FFF.
• Potential Anticipation (35 U.S.C. § 102):
  • Claim 1: Broadly anticipates "heated build platform" for "3D printing apparatus." The specific "removable plate" and "non-tape polymer coating" with its unique adhesion/release properties cannot be confirmed without further detail, but general heated platform concepts are likely anticipated.
  • Claims 3, 4, 6, 8, 13: The concepts of heating and temperature control for a build platform are likely anticipated.

28. US20160096326A1

• Full Citation: US20160096326A1 - Selective zone temperature control build plate; Tyco Electronics Corporation; Publication date: 2016-04-07.
• Publication/Filing Date: Priority date 2014-10-03, Publication date 2016-04-07.
• Brief Description: Describes a "selective zone temperature control build plate." This means a heated build plate with advanced temperature control.
• Potential Anticipation (35 U.S.C. § 102):
  • Claim 1: Broadly anticipates "heated build platform" with "temperature control unit." Does not explicitly detail a removable plate or the non-tape polymer coating with specific adhesion/release properties.
  • Claims 3, 4, 6, 8, 13: Anticipates advanced temperature control for a build plate.

---

Most Relevant Prior Art Identification:

Based on the analysis, US8282380B2 (Makerbot Industries) appears to be the most relevant prior art. It discloses a heated/cooled build surface (conveyor) for FFF that can be "coated, or otherwise treated to assist in adhesion during a build, as well as removal of objects after a build". This addresses the core functional problem that US9592660B2 aims to solve (adhesion during print, easy removal after cooling) within the FFF context. While it uses a conveyor and a generic "coating" rather than a non-tape polymer coating on a removable plate, its overall teaching comes closest to the functional claims of US9592660B2's Claim 1.

US7127309B2 (Stratasys, Inc.) is also highly relevant for clearly teaching a "removable substrate" that is "releasably locked" to a platform in an additive manufacturing machine. This directly addresses the "removable plate" aspect of US9592660B2, which is a significant component of the claimed invention.

These two patents together represent significant teachings that the inventor of US9592660B2 would need to distinguish from, particularly regarding the specific "polymer coating, not a polymer tape" and the precise damage-free removal mechanism upon cooling.Here is an analysis of the most relevant prior art for US patent 9592660, based on the provided patent text and external search results:

The core invention of US9592660B2 revolves around a build apparatus for 3D printing of high-temperature thermoplastics. Key features include a heated build platform, a thermally conductive, removable plate secured over it, and a high-temperature polymer coating (explicitly not a polymer tape) applied directly to the plate. This coating facilitates adhesion during printing and allows for damage-free object removal upon cooling, without chemically or mechanically removing the coating itself.

Analysis of Cited Prior Art:

1. US20010038168A1

• Full Citation: US20010038168A1 - Method and apparatus for three-dimensional modeling; Stratasys, Inc.; Publication date: 2001-11-08.
• Publication/Filing Date: Priority date: 1999-06-23, Publication date: 2001-11-08.
• Brief Description: This patent, from Stratasys, describes general methods and apparatus for three-dimensional modeling, likely related to Fused Deposition Modeling (FDM), and aims to control stress and distortion during the build process. It is a continuation of US6722872B1.
• Potential Anticipation (35 U.S.C. § 102): Broadly anticipates the concept of a "build apparatus for printing a 3D object of thermoplastics employing additive manufacturing methods" and a "heated build platform." It does not, however, detail a specific removable plate with a non-tape polymer coating designed for adhesion and specific damage-free removal upon cooling, as specified in Claim 1 of US9592660B2.

2. US6722872B1

• Full Citation: US6722872B1 - High temperature modeling apparatus; Stratasys, Inc.; Publication date: 2004-04-20.
• Publication/Filing Date: Priority date: 1999-06-23, Publication date: 2004-04-20.
• Brief Description: Describes a 3D modeling apparatus that builds objects in a heated build chamber using thermoplastic materials, controlling the chamber temperature to reduce stresses and distortion in the finished model.
• Potential Anticipation (35 U.S.C. § 102): Broadly anticipates a "heated build platform" for "thermoplastics employing additive manufacturing methods" at high temperatures. It also implies temperature control. However, it does not disclose a removable, thermally conductive plate or a polymer coating (not tape) with the specific adhesion and damage-free removal properties upon cooling detailed in Claim 1 of US9592660B2. It generally anticipates concepts of Claims 6 and 8 regarding high temperature and material composition.

3. US20050058837A1

• Full Citation: US20050058837A1 - Processes for facilitating removal of stereolithographically fabricated objects from platens of stereolithographic fabrication equipment, object release elements for effecting such processes, systems and fabrication processes employing the object release elements, and objects which have been fabricated using the object release elements; Farnworth Warren M.; Publication date: 2005-03-17.
• Publication/Filing Date: Priority date: 2003-09-16, Publication date: 2005-03-17.
• Brief Description: This patent addresses methods and elements to facilitate the removal of stereolithographically (SLA) fabricated objects from build platens.
• Potential Anticipation (35 U.S.C. § 102): While it deals with "facilitating removal" of 3D objects from a build surface, its context is stereolithography, which differs significantly from FFF of thermoplastics. It does not disclose a heated build platform for thermoplastics, a thermally conductive plate, or a non-tape polymer coating as specified in Claim 1. It generally anticipates the concept of easier object dissociation (Claim 12) but through different means.

4. US20050275129A1

• Full Citation: US20050275129A1 - Systems and methods for fabricating 3-D objects; Sambu Shiva P; Publication date: 2005-12-15.
• Publication/Filing Date: Priority date: 2004-06-14, Publication date: 2005-12-15.
• Brief Description: A generic title for systems and methods for fabricating 3D objects. No specific details about the build platform or release mechanisms are available from the provided context.
• Potential Anticipation (35 U.S.C. § 102): Unclear due to lack of specific information.

5. US20060198918A1

• Full Citation: US20060198918A1 - Stereolithography apparatus; Dainippon Screen Mfg. Co., Ltd.; Publication date: 2006-09-07.
• Publication/Filing Date: Priority date: 2005-03-03, Publication date: 2006-09-07.
• Brief Description: Describes a stereolithography apparatus.
• Potential Anticipation (35 U.S.C. § 102): No anticipation of Claim 1 as it is for stereolithography, a different 3D printing method.

6. US7127309B2

• Full Citation: US7127309B2 - Modeling apparatus with tray substrate; Stratasys, Inc.; Publication date: 2006-10-24.
• Publication/Filing Date: Priority date: 2004-02-10, Publication date: 2006-10-24.
• Brief Description: Discloses an apparatus for removably mounting a rigid "tray substrate" to a modeling platform in an additive manufacturing machine. The substrate provides a modeling surface and can be releasably locked to the platform for accurate positioning and subsequent removal and reuse. Various substrate materials like polymer foam, wire mesh sandpaper, or magnetic sheets are mentioned.
• Potential Anticipation (35 U.S.C. § 102): Anticipates the "thermally conductive plate disposed adjacent to the build platform" (as a "tray substrate") and its "removable" aspect. However, it does not specify a polymer coating (not tape) with the unique adhesion/removal properties, nor is it explicitly directed to high-temperature thermoplastics with a heated build platform as described in Claim 1. It anticipates the concept of removability in Claim 15.

7. US20070037509A1

• Full Citation: US20070037509A1 - Method for the manufacture of a molding as well as a sensor unit for the application thereof; Bernd Renz; Publication date: 2007-02-15.
• Publication/Filing Date: Priority date: 2005-05-31, Publication date: 2007-02-15.
• Brief Description: Concerns methods for manufacturing moldings and associated sensor units.
• Potential Anticipation (35 U.S.C. § 102): Unclear due to lack of specific relevant information.

8. US7261542B2

• Full Citation: US7261542B2 - Apparatus for three dimensional printing using image layers; Desktop Factory, Inc.; Publication date: 2007-08-28.
• Publication/Filing Date: Priority date: 2004-03-18, Publication date: 2007-08-28.
• Brief Description: Describes an apparatus for 3D printing using "image layers," often associated with binder jetting or similar technologies.
• Potential Anticipation (35 U.S.C. § 102): No anticipation of Claim 1 as it is for a different 3D printing method.

9. US20100012630A1

• Full Citation: US20100012630A1 - Apparatus for manufacturing a three-dimensional object layer by layer; Eos Gmbh Electro Optical Systems; Publication date: 2010-01-21.
• Publication/Filing Date: Priority date: 2008-07-03, Publication date: 2010-01-21.
• Brief Description: Likely relates to powder-bed fusion (e.g., Selective Laser Sintering or Direct Metal Laser Sintering) given the assignee.
• Potential Anticipation (35 U.S.C. § 102): No anticipation of Claim 1 as it is for a different 3D printing method.

10. US20100174392A1

• Full Citation: US20100174392A1 - Optimal dimensional and mechanical properties of laser sintered hardware by thermal analysis and parameter optimization; Fink Jeffrey E; Publication date: 2010-07-08.
• Publication/Filing Date: Priority date: 2003-06-10, Publication date: 2010-07-08.
• Brief Description: Focuses on optimizing laser sintering processes by thermal analysis.
• Potential Anticipation (35 U.S.C. § 102): No anticipation of Claim 1 as it is for a different 3D printing method.

11. US20100193998A1

• Full Citation: US20100193998A1 - Inorganic ionic support materials for digital manufacturing systems; Stratasys, Inc.; Publication date: 2010-08-05.
• Publication/Filing Date: Priority date: 2009-02-02, Publication date: 2010-08-05.
• Brief Description: Concerns inorganic ionic support materials for additive manufacturing.
• Potential Anticipation (35 U.S.C. § 102): No anticipation of Claim 1, as it relates to support materials rather than the primary build surface and its coating for object adhesion.

12. US20100316877A1

• Full Citation: US20100316877A1 - Method for preparing polyimide and polyimide prepared using the same; Lg Chem. Ltd.; Publication date: 2010-12-16.
• Publication/Filing Date: Priority date: 2007-02-09, Publication date: 2010-12-16.
• Brief Description: Describes methods for preparing polyimide material.
• Potential Anticipation (35 U.S.C. § 102): Anticipates the general knowledge and preparation of polyimide material, which is disclosed as a polymer coating in Claim 2 of US9592660B2. However, it does not teach the specific application of polyimide as a non-tape coating on a removable plate for 3D printing adhesion and cooling-based release.

13. US20110241947A1

• Full Citation: US20110241947A1 - Additive manufacturing apparatus and method; Mtt Technologies Limited; Publication date: 2011-10-06.
• Publication/Filing Date: Priority date: 2008-10-30, Publication date: 2011-10-06.
• Brief Description: Generic title for additive manufacturing apparatus and method, likely for powder bed fusion based on the assignee.
• Potential Anticipation (35 U.S.C. § 102): No anticipation of Claim 1 due to lack of specific relevant features or being for a different 3D printing method.

14. US8119053B1

• Full Citation: US8119053B1 - Apparatus for three dimensional printing using imaged layers; 3D Systems, Inc.; Publication date: 2012-02-21.
• Publication/Filing Date: Priority date: 2004-03-18, Publication date: 2012-02-21.
• Brief Description: Concerns 3D printing using "imaged layers," likely stereolithography.
• Potential Anticipation (35 U.S.C. § 102): No anticipation of Claim 1 as it is for a different 3D printing method.

15. US20120133083A1

• Full Citation: US20120133083A1 - Stereolithography Machine; Dws S.R.L.; Publication date: 2012-05-31.
• Publication/Filing Date: Priority date: 2009-08-03, Publication date: 2012-05-31.
• Brief Description: Explicitly describes a stereolithography machine.
• Potential Anticipation (35 U.S.C. § 102): No anticipation of Claim 1 as it is for stereolithography.

16. US20120231225A1

• Full Citation: US20120231225A1 - Core-shell consumable materials for use in extrusion-based additive manufacturing systems; Stratasys, Inc.; Publication date: 2012-09-13.
• Publication/Filing Date: Priority date: 2010-09-17, Publication date: 2012-09-13.
• Brief Description: Focuses on "core-shell consumable materials" for FFF systems.
• Potential Anticipation (35 U.S.C. § 102): No anticipation of Claim 1, as it relates to consumable materials, not the build platform apparatus and its coating.

17. US8282380B2

• Full Citation: US8282380B2 - Automated 3D build processes; Makerbot Industries; Publication date: 2012-10-09.
• Publication/Filing Date: Priority date: 2010-08-18, Publication date: 2012-10-09.
• Brief Description: Discloses a conveyor or other transport mechanism to support multiple, sequential builds in additive fabrication processes, including Fused Deposition Modeling (FDM). The conveyor "may be heated/cooled, coated, or otherwise treated to assist in adhesion during a build, as well as removal of objects after a build." It also discusses automatic object removal.
• Potential Anticipation (35 U.S.C. § 102):
  • Claim 1: Highly relevant. Anticipates a "heated build platform" (conveyor), "thermoplastics employing additive manufacturing methods" (FDM), and a surface that is "coated, or otherwise treated to assist in adhesion during a build, as well as removal of objects after a build." The conveyor functions as a movable, heated build surface. However, it does not explicitly specify a removable plate secured over a static build platform or a polymer coating which is not a polymer tape, nor the specific damage-free removal properties upon cooling due to thermal contraction.
  • Claims 3, 4, 6: Anticipates the general concept of heating and temperature control for an FFF build surface.
  • Claim 12: Anticipates the concept of "easier dissociation" or facilitating removal of objects.

18. US20120328726A1

• Full Citation: US20120328726A1 - Modelling Plate for a Stereolithography Machine, Stereolithography Machine Using Said Modelling Plate and Tool for Cleaning Said Modelling Plate; Dws S.R.L.; Publication date: 2012-12-27.
• Publication/Filing Date: Priority date: 2010-01-12, Publication date: 2012-12-27.
• Brief Description: Describes a modeling plate for a stereolithography machine.
• Potential Anticipation (35 U.S.C. § 102): No anticipation of Claim 1 as it is for stereolithography.

19. US20130098068A1

• Full Citation: US20130098068A1 - Temperature control device; Kelk Ltd.; Publication date: 2013-04-25.
• Publication/Filing Date: Priority date: 2011-10-19, Publication date: 2013-04-25.
• Brief Description: The search results indicate this patent describes a "System and method for real time viewing of critical patient data on mobile devices."
• Potential Anticipation (35 U.S.C. § 102): No anticipation, as the subject matter is unrelated to 3D printing.

20. US20130186558A1

• Full Citation: US20130186558A1 - Layer transfusion with heat capacitor belt for additive manufacturing; Stratasys, Inc.; Publication date: 2013-07-25.
• Publication/Filing Date: Priority date: 2011-09-23, Publication date: 2013-07-25.
• Brief Description: Describes a heat capacitor belt for layer transfusion in additive manufacturing, suggesting a heated, movable build surface.
• Potential Anticipation (35 U.S.C. § 102): Broadly anticipates a "heated build platform" and a movable build surface in additive manufacturing. However, it does not explicitly disclose a removable plate secured over a static build platform or a non-tape polymer coating with specific adhesion/release properties as in Claim 1.

21. US20130256953A1

• Full Citation: US20130256953A1 - Method for manufacturing an object by solidifying powder using a laser beam with the insertion of a member for absorbing deformations; Phenix Systems; Publication date: 2013-10-03.
• Publication/Filing Date: Priority date: 2011-04-29, Publication date: 2013-10-03.
• Brief Description: Describes manufacturing objects by solidifying powder using a laser beam (powder bed fusion).
• Potential Anticipation (35 U.S.C. § 102): No anticipation of Claim 1 as it is for a different 3D printing method.

22. US20130287934A1

• Full Citation: US20130287934A1 - Liquid Metal Digital Manufacturing System; Pallant Satnarine Ramsundar; Publication date: 2013-10-31.
• Publication/Filing Date: Priority date: 2012-04-30, Publication date: 2013-10-31.
• Brief Description: Describes a system for manufacturing with liquid metal.
• Potential Anticipation (35 U.S.C. § 102): No anticipation of Claim 1 as it is for metal printing, not polymer FFF.

23. US20130297320A1

• Full Citation: US20130297320A1 - Voice-controlled three-dimensional fabrication system; Anthony James Buser; Publication date: 2013-11-07.
• Publication/Filing Date: Priority date: 2012-05-04, Publication date: 2013-11-07.
• Brief Description: Focuses on voice control for a 3D fabrication system.
• Potential Anticipation (35 U.S.C. § 102): No anticipation of Claim 1 as it concerns control interface, not the build platform structure.

24. US8827684B1

• Full Citation: US8827684B1 - 3D printer and printhead unit with multiple filaments; Radiant Fabrication; Publication date: 2014-09-09.
• Publication/Filing Date: Priority date: 2013-12-23, Publication date: 2014-09-09.
• Brief Description: Describes an FFF printer with multiple printheads, focusing on printing speed and multi-material printing.
• Potential Anticipation (35 U.S.C. § 102): Broadly anticipates an "FFF printer" for 3D objects. However, its focus is on the printhead unit and multiple filaments, not the heated build platform, removable plate, or polymer coating with its specific adhesion and removal properties as in Claim 1.

25. US20150037527A1

• Full Citation: US20150037527A1 - Cover for a three-dimensional printer build surface; Ideal Jacobs Corporation; Publication date: 2015-02-05.
• Publication/Filing Date: Priority date: 2013-07-30, Publication date: 2015-02-05.
• Brief Description: Describes a "cover for a three-dimensional printer build surface."
• Potential Anticipation (35 U.S.C. § 102): This could potentially anticipate the "polymer coating attached to a surface" aspect of Claim 1 if the "cover" is a non-tape polymer coating directly applied to a plate and offers the claimed adhesion and removal characteristics. However, further details are needed to confirm the specific properties and material (non-tape, polymer type).

26. US20150145174A1

• Full Citation: US20150145174A1 - Magnetic platen assembly for additive manufacturing system; Stratasys, Inc.; Publication date: 2015-05-28.
• Publication/Filing Date: Priority date: 2013-11-22, Publication date: 2015-05-28.
• Brief Description: Discloses a magnetic platen assembly for securing a removable build plate (platen) in an additive manufacturing system.
• Potential Anticipation (35 U.S.C. § 102): Anticipates a "thermally conductive plate disposed adjacent to the build platform" that is "removable." It also explicitly describes magnetic securing. However, Claim 15 of US9592660B2 specifies "non-magnetically secured," meaning this patent describes an alternative securing method rather than directly anticipating the "non-magnetic" limitation of Claim 15. It does not disclose the specific polymer coating with adhesion/release properties of Claim 1.

27. US20150165687A1

• Full Citation: US20150165687A1 - Heating platform and 3d printing apparatus; Xyzprinting, Inc.; Publication date: 2015-06-18.
• Publication/Filing Date: Priority date: 2013-12-12, Publication date: 2015-06-18.
• Brief Description: Describes a "heating platform and 3D printing apparatus." This is a general description relevant to FFF.
• Potential Anticipation (35 U.S.C. § 102): Broadly anticipates a "heated build platform" for a "3D printing apparatus." Specific details on a removable plate or a non-tape polymer coating with particular adhesion/release properties, as in Claim 1, are not provided in the title/abstract. It likely anticipates general concepts related to heated platforms (Claims 3, 4, 6, 8, 13).

28. US20160096326A1

• Full Citation: US20160096326A1 - Selective zone temperature control build plate; Tyco Electronics Corporation; Publication date: 2016-04-07.
• Publication/Filing Date: Priority date: 2014-10-03, Publication date: 2016-04-07.
• Brief Description: Describes a "selective zone temperature control build plate," indicating a heated build plate with advanced temperature control capabilities.
• Potential Anticipation (35 U.S.C. § 102): Broadly anticipates a "heated build platform" with a "temperature control unit." It does not explicitly detail a removable plate or the non-tape polymer coating with specific adhesion/release properties. It anticipates the underlying technology for temperature control (Claims 3, 4, 6, 8, 13).

Most Relevant Prior Art:

Based on the available information, US8282380B2 (Makerbot Industries) is identified as the most relevant prior art. It explicitly discloses a heated/cooled build surface (a conveyor) for Fused Deposition Modeling (FDM) that can be "coated, or otherwise treated to assist in adhesion during a build, as well as removal of objects after a build". This patent directly addresses the functional objectives of US9592660B2 related to adhesion and object removal on a heated/treated build surface within the same FFF context, making it a strong reference for the functionality described in Claim 1. While the form (conveyor vs. removable plate) and specificity of the coating material (generic vs. non-tape polymer) differ, the underlying problem and a solution approach are similar.

US7127309B2 (Stratasys, Inc.) is also highly relevant for its clear teaching of a "removable substrate" (plate) that can be "releasably locked" to a modeling platform for 3D objects. This directly addresses the "removable plate" aspect, which is a key structural component of US9592660B2.

Obviousness Analysis of US Patent 9,592,660 under 35 U.S.C. § 103

A patent claim is considered obvious if the differences between the claimed invention and the prior art are such that the subject matter as a whole would have been obvious at the time the invention was made to a person having ordinary skill in the art (PHOSITA). This analysis considers the scope and content of the prior art, the differences between the prior art and the claims at issue, the level of ordinary skill in the pertinent art, and secondary considerations of non-obviousness (though the latter are not addressed here given the prompt's focus).

Person Having Ordinary Skill in the Art (PHOSITA)

For US Patent 9,592,660, which relates to heated build platforms for 3D printing with high-temperature thermoplastics, a PHOSITA would likely be an engineer or technician with experience in additive manufacturing (3D printing), materials science (particularly polymers and composites), and thermal management systems. This individual would be familiar with common challenges in 3D printing, such as part adhesion, warp prevention, and efficient part removal, especially when working with high-performance polymers.

Analysis of Independent Claim 1

Independent Claim 1 defines the core invention:
"A build apparatus for printing a 3D object of thermoplastics employing additive manufacturing methods, the apparatus comprising:
a build platform with a temperature control unit configured to control heating of the build platform;
a thermally conductive plate disposed adjacent to the build platform; and
a polymer coating attached to a surface of the thermally conductive plate which is capable of (i) facilitating adhesion to the 3D object during printing and (ii) permitting removal of the 3D object once the 3D object has been formed and cooled without chemically or mechanically removing the polymer coating from 3D object and without damaging the polymer coating, the thermally conductive plate, or the 3D object, wherein the polymer coating is not a polymer tape."

Prior Art Combination and Motivation

A combination of the following prior art references, along with general knowledge in the field, would likely render Independent Claim 1 obvious to a PHOSITA:

1. US6722872B1 to Stratasys, Inc. ("High temperature modeling apparatus"): This patent clearly discloses a heated build platform for three-dimensional modeling, capable of operating at high temperatures. This directly addresses the "build platform with a temperature control unit configured to control heating of the build platform" element, particularly for high-temperature applications.
2. US7127309B2 to Stratasys, Inc. ("Modeling apparatus with tray substrate"): This patent teaches the use of a "tray substrate" in a modeling apparatus, which functions as a removable build plate. This fulfills the requirement of a "thermally conductive plate disposed adjacent to the build platform" and inherently suggests its removable nature.
3. US20050058837A1 to Farnworth ("Processes for facilitating removal..."): This reference highlights the known problem of removing fabricated objects from platens in stereolithographic (a form of additive manufacturing) equipment and proposes "object release elements" to facilitate this removal. While not explicitly describing a coating for FFF, it teaches the concept and motivation to create a surface that aids in part release.
4. General Knowledge in the Art regarding Polyimide and the Background Section of US9592660:
   • The background of US9592660 explicitly acknowledges that "polyimide tape has been applied to heated build plates for its tactility and performance under high temperatures." It then details the significant problems associated with this tape: "inevitably allowing for tiny debris or air to be trapped...creating an uneven printing surface," "the adhesive for the polyimide tape can burn off under high temperatures releasing fumes and damaging the coating," and "the tape can be easily damaged upon removal of the part."
   • US20100316877A1 demonstrates the existing knowledge of polyimide material itself and methods for its preparation.

Motivation to Combine:

A PHOSITA, utilizing the heated build platform of US6722872B1 and the removable tray substrate of US7127309B2 for 3D printing high-temperature thermoplastics, would be keenly aware of the adhesion and removal challenges for printed parts. Faced with the well-known deficiencies of polyimide tape (as explicitly detailed in the background of US9592660), such as uneven surfaces due to trapped air, adhesive degradation at high temperatures, and damage during part removal, the PHOSITA would be motivated to seek a more robust and reliable adhesion solution.

Knowing that polyimide itself offers desirable high-temperature performance and tactility (which is why the tape was used), a PHOSITA would be motivated to apply polyimide directly as a coating rather than a tape. This approach directly addresses and overcomes the problems inherent with tape:

• Applying a coating (e.g., via spray coating, as described in the detailed description of US9592660) would eliminate trapped air and debris, providing a consistently even printing surface.
• A coating formulated for high temperatures would avoid issues with burning adhesives.
• A resilient, directly applied coating would be less prone to tearing or damage during part removal compared to tape, as further supported by the objective of US20050058837A1 to facilitate removal.

Therefore, replacing polyimide tape with a polyimide coating to address known problems while retaining the beneficial properties of the material would be an obvious design choice for a PHOSITA, falling within the routine optimization of known systems. The specific characteristics of the coating, such as facilitating adhesion and permitting damage-free removal, would be expected results of applying a durable, high-temperature polymer coating designed to overcome the limitations of the prior art tape.

Analysis of Dependent Claims (Examples)

Most dependent claims would also be rendered obvious by this combination or by applying common engineering principles:

• Claim 2 (Polyimide coating): Obvious given the admitted use of polyimide tape in the prior art for its desirable properties, and the motivation to improve its application form.
• Claim 6 (Temperature range 150-300°C): Directly addressed by US6722872B1's "high temperature modeling apparatus" and the known requirements for high-temperature thermoplastics.
• Claims 7 & 8 (Materials for plate/platform with low CTE): Selecting common thermally conductive engineering materials (aluminum, steel, brass, ceramic, glass) and choosing materials with a low coefficient of thermal expansion (CTE) to prevent warping under heat are well-established engineering principles for heated systems. US9592660 itself lists these materials and emphasizes low CTE for maintaining flatness.
• Claim 9 (Plate thickness 0.025-0.5″ based on flexural character): Optimizing plate thickness for heat transfer, stability, and desired flexibility (to aid part release upon cooling) is a routine design consideration for a PHOSITA.
• Claim 11 (Surface features for increased adhesion): Roughening a surface to improve adhesion is a fundamental and well-known engineering technique (e.g., sand blasting, bead blasting).
• Claim 12 (Flexible plate for easier dissociation): Designing the plate to be flexible to aid in part removal upon cooling is an obvious modification to address a known problem (difficult part removal), especially when considering the objectives of US20050058837A1.
• Claim 14 (Plate CTE < Platform CTE): This is a direct application of fundamental thermal expansion principles to prevent bowing and maintain a flat printing surface, as explicitly discussed in the detailed description of US9592660.

In summary, the core inventive step of US Patent 9,592,660, particularly the "polymer coating... which is not a polymer tape," appears to be an obvious modification of existing technologies driven by clearly identified problems with the prior art, and would be readily apparent to a PHOSITA.

To analyze US patent 9592660, I will retrieve information regarding its patent term adjustments (PTA), patent term extensions (PTE), continuation/divisional applications, related family members, and projected expiration date.

Patent Term Adjustments (PTA) and Patent Term Extensions (PTE)

US patent 9592660 was filed on December 17, 2014, and issued on March 14, 2017. Since the application was filed on or after June 8, 1995, its patent term is generally 20 years from its earliest effective filing date, plus any Patent Term Adjustments (PTA). PTA is added to a patent's term to compensate for delays in prosecution caused by the USPTO. Patent Term Extensions (PTE) are typically granted for patents covering products subject to regulatory review, such as pharmaceuticals, and can extend protection by up to five additional years. Without access to the USPTO Public PAIR record for US9592660, the exact PTA awarded cannot be determined. There is no indication from the provided text that this patent is related to a pharmaceutical product, therefore, it is unlikely to have a PTE.

Continuation and Divisional Applications

The patent text indicates two other versions, US20160176118A1 and US20170217106A1. The "Priority Applications" section also lists:

• US14/574,237 (which is the application number for US9592660B2 itself, filed 2014-12-17).
• US15/422,303 (filed 2017-02-01, published as US20170217106A1). This is a continuation application, as confirmed by its priority date being the same as the parent (2014-12-17) and its filing date being after the parent's.
• US16/388,675 (filed 2019-04-18, published as US20190315115A1). This is also a continuation application, sharing the same priority date of 2014-12-17.

The "Related Child Applications" section also confirms US15/422,303 as a continuation.

A continuation application generally shares the parent's filing date for prior art purposes and does not extend the patent term beyond the parent's 20-year term from the earliest effective filing date. However, each continuation application can receive its own PTA based on its individual prosecution history. A divisional application, filed due to a restriction requirement, can potentially have a term extended beyond the parent's 20-year term, with its PTA calculated independently. The patent text does not explicitly identify any divisional applications for US9592660B2; only continuations are listed.

Related Family Members

The patent family (ID=56128452) includes the following applications, all sharing the priority date of December 17, 2014:

• US14/574,237 (US9592660B2) - Active
• US15/422,303 (US20170217106A1) - Abandoned
• US16/388,675 (US20190315115A1) - Abandoned

The fact that the continuation applications (US15/422,303 and US16/388,675) are listed as "Abandoned" means they did not result in issued patents.

Projected Expiration Date

The patent was filed on December 17, 2014. The standard patent term is 20 years from the earliest effective filing date. Therefore, without any Patent Term Adjustment (PTA), the patent would expire on December 17, 2034.

The Google Patents record explicitly states a legal status of "Active, expires 2035-01-08" and an "Adjusted expiration" date of 2035-01-08. This "Adjusted expiration" date indicates that Patent Term Adjustment (PTA) was applied to the patent term.

Therefore, the projected expiration date for US patent 9592660 is January 8, 2035.

Defensive Disclosure: Derivative Variations of US Patent 9,592,660

This document outlines a series of derivative variations of the core concepts presented in US Patent 9,592,660, specifically focusing on Independent Claim 1. The aim is to defensively publish these concepts to render future incremental improvements by competitors obvious or non-novel, establishing prior art as of the current date (April 26, 2026).

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Core Claim for Derivation: Independent Claim 1

"A build apparatus for printing a 3D object of thermoplastics employing additive manufacturing methods, the apparatus comprising:
a build platform with a temperature control unit configured to control heating of the build platform;
a thermally conductive plate disposed adjacent to the build platform; and
a polymer coating attached to a surface of the thermally conductive plate which is capable of (i) facilitating adhesion to the 3D object during printing and (ii) permitting removal of the 3D object once the 3D object has been formed and cooled without chemically or mechanically removing the polymer coating from 3D object and without damaging the polymer coating, the thermally conductive plate, or the 3D object, wherein the polymer coating is not a polymer tape."

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Derivative Variations

1. Material & Component Substitution

Derivative 1.1: Advanced Composite Removable Plate with Nanoparticle-Enhanced Polymer Coating

• Enabling Description: The thermally conductive removable plate (104) is fabricated from a carbon fiber reinforced polymer (CFRP) composite with embedded high-thermal-conductivity graphite flakes or boron nitride nanoparticles, oriented to maximize through-thickness thermal conductivity while maintaining low in-plane CTE. The plate's thickness is tuned (e.g., 0.1 mm to 0.5 mm) for optimal flexural modulus to facilitate part release. The polymer coating (106) applied to this composite plate is a liquid crystal polymer (LCP) or polyetherketoneketone (PEKK) resin, spray-coated and then thermally cured, which is further enhanced with surface-modified silica nanoparticles (1-10 nm diameter, 5-10 wt%) to increase surface energy and micro-roughness for improved initial adhesion without sacrificing the low-adhesion-upon-cooling property. This coating eliminates the need for an adhesive layer inherent to polymer tapes and provides superior scratch resistance.

classDiagram
    class BuildPlatform {
        +TemperatureControlUnit
        +HeaterCartridges
        +Thermocouples
        +Material: Aluminum, Steel
    }
    class RemovablePlate {
        +Material: CFRP Composite w/ Graphite/BN Nanoparticles
        +Thickness: 0.1-0.5mm
        +FlexuralModulus
        +CTE: Low
    }
    class PolymerCoating {
        +Material: LCP/PEKK Resin + Silica Nanoparticles
        +ApplicationMethod: Spray-Coated, Thermally Cured
        +Properties: High Temp, Adhesion During Print, Release Upon Cooling, Non-Tape
    }
    class AdditiveManufacturingSystem {
        +PrintHead
        +Thermoplastics
    }

    BuildPlatform "1" -- "1" RemovablePlate : disposed adjacent to
    RemovablePlate "1" -- "1" PolymerCoating : attached to surface of
    AdditiveManufacturingSystem "1" -- "1" BuildPlatform : utilizes
    PolymerCoating "1" -- "*" Thermoplastics : facilitates adhesion/release

Derivative 1.2: Shape-Memory Alloy Plate with Bio-Inspired Surface Texture

• Enabling Description: The thermally conductive removable plate (104) is constructed from a shape-memory alloy (SMA) such as a NiTi (Nitinol) alloy. This plate is pre-stressed to be flat at high printing temperatures (e.g., 200-300°C) and designed to undergo a controlled shape change (e.g., slight convex bowing or localized undulating deformation) upon cooling below a critical transition temperature (e.g., 50-80°C). This active deformation physically assists in detaching the 3D printed object without external mechanical force. The polymer coating (106) is an atom-transfer radical polymerization (ATRP) grafted fluoropolymer (e.g., PTFE-like) with a biomimetic surface texture (e.g., gecko-like lamellar structures or sharklet pattern) at the micro/nanoscale, achieved via photolithographic patterning or directed self-assembly, providing tunable adhesion properties (high at elevated temps, low upon cooling).

stateDiagram
    direction LR
    StateA: Plate at High Temp (200-300C)
    StateB: Object Adhered, Printing
    StateC: Plate Cooling (50-80C)
    StateD: Shape-Memory Deformation
    StateE: Object Released

    StateA --> StateB: Heating Complete
    StateB --> StateC: Printing Complete, Initiate Cooling
    StateC --> StateD: Temperature Crosses SMA Transition
    StateD --> StateE: Physical Detachment by Plate Deformation

Derivative 1.3: Graphene-Integrated Ceramic Plate with Sacrificial Buffer Coating

• Enabling Description: The thermally conductive removable plate (104) is a silicon carbide (SiC) or aluminum nitride (AlN) ceramic plate, manufactured with a CVD-deposited graphene layer on its surface to enhance electrical conductivity and uniform heating/cooling across the plate. Over this, a sacrificial buffer polymer coating (106) is applied. This coating comprises a blend of a high-temperature polyimide and a small percentage (e.g., 2-5 wt%) of a thermally decomposable polymer (e.g., polylactic acid (PLA) microparticles or a degradable ester-linked polymer). Upon completion of printing and cooling, the plate can be subjected to a brief, localized thermal or UV impulse that selectively degrades a thin interface layer of the sacrificial polymer, reducing adhesion and enabling part removal without damaging the main polyimide matrix or the object.

flowchart TD
    A[SiC/AlN Ceramic Plate] --> B{CVD Graphene Layer};
    B --> C[Sacrificial Buffer Coating: Polyimide + Decomposable Polymer];
    C -- Adhesion During Print --> D[3D Printed Object (Thermoplastic)];
    D -- Cooling & Print Complete --> E{Localized Thermal/UV Impulse};
    E -- Degradation of Interface --> F[Reduced Adhesion];
    F --> G[Damage-Free Object Removal];

2. Operational Parameter Expansion

Derivative 2.1: Ultra-Large Scale Additive Manufacturing Platform (Industrial Scale)

• Enabling Description: A build apparatus scaled for industrial additive manufacturing, capable of producing objects up to 5 cubic meters in volume. The build platform (102) is segmented into modular, independently heated zones (e.g., 1m x 1m sections), each with its own temperature control unit (PID controllers, embedded resistive heaters, and multiple thermocouples per segment). The thermally conductive removable plate (104) is similarly segmented or a continuous, flexible sheet of advanced polymer-ceramic composite (e.g., alumina-filled polyetherimide) up to 2.5 cm thick, capable of spanning multiple segments. The polymer coating (106) is applied robotically via a wide-area plasma deposition or chemical vapor deposition (CVD) process, ensuring uniformity over large areas. Post-print cooling is managed by an integrated forced-air or liquid-cooling manifold beneath the plate, providing rapid, controlled temperature reduction across the massive surface.

graph TD
    A[Build Platform (Modular, Large Scale)] --> B{Segmented Heating Zones};
    B --> C[Independent Temperature Control Units];
    C --> D[Thermally Conductive Removable Plate (Flexible, Spanning Segments)];
    D --> E[Polymer Coating (Robotic CVD/Plasma Deposition)];
    E -- Adhesion During Print --> F[Ultra-Large 3D Object];
    F -- Post-Print Cooling --> G[Rapid Controlled Cooling Manifold];
    G --> H[Damage-Free Object Removal];

Derivative 2.2: Micro-Scale/High-Precision Build Platform for Biomedical Devices

• Enabling Description: A build apparatus designed for additive manufacturing of micro-scale thermoplastic biomedical devices (e.g., scaffolds, microfluidic chips) with features down to 50 micrometers. The build platform (102) and removable plate (104) are fabricated from polished single-crystal silicon or sapphire for extreme flatness and thermal stability. Temperature control utilizes Peltier elements for sub-degree Celsius precision heating/cooling, with infrared thermography providing real-time surface temperature mapping. The thermally conductive removable plate is 0.2-0.5 mm thick. The polymer coating (106) is applied via atomic layer deposition (ALD) or spin-coating of an ultrathin (100-500 nm) biocompatible polyimide or parylene-C layer, specifically engineered with micro-patterned adhesion zones (e.g., photo-patterned silanes) for localized adhesion control and precise release of delicate micro-structures upon cooling.

sequenceDiagram
    participant P as Peltier Elements
    participant S as Si/Sapphire Plate
    participant C as Polymer Coating (ALD/Spin-Coat)
    participant O as Micro 3D Object
    participant IR as IR Thermography
    participant CTRL as Control System

    CTRL->P: Set Precise Temp (heating)
    P->S: Heat Plate to Setpoint
    IR->S: Monitor Surface Temp
    CTRL->C: Apply Micro-Patterned Coating
    C->O: Facilitate Adhesion during print
    CTRL->O: 3D Print Micro Object
    CTRL->P: Initiate Precise Cooling
    P->S: Cool Plate
    S->O: Plate Contraction & Localized Release
    O->O: Damage-Free Micro Object Removal

Derivative 2.3: Vacuum/Inert Atmosphere Build Platform for Reactive Polymers

• Enabling Description: A build apparatus integrated within a vacuum chamber or inert atmosphere (e.g., argon, nitrogen) for printing reactive thermoplastics (e.g., high-performance polyamides or specific PEEK grades sensitive to oxidation). The build platform (102) and thermally conductive removable plate (104) are composed of ultra-high vacuum (UHV) compatible materials (e.g., special stainless steels, ceramics) with integral heating elements resistant to high vacuum/inert conditions. The removable plate features a PVD (Physical Vapor Deposition) or CVD applied coating (106) of a ceramic-polymer hybrid (e.g., a high-temperature polyimide matrix reinforced with alumina or silicon nitride, deposited as a continuous, dense layer without trapped air). The cooling process is precisely controlled within the vacuum/inert environment, leveraging the rapid thermal contraction differences for damage-free part release.

stateDiagram
    direction LR
    StateA: System Under Vacuum/Inert Atmosphere
    StateB: Build Platform Heated (UHV Compatible)
    StateC: Thermally Conductive Removable Plate (PVD/CVD Coating)
    StateD: Thermoplastic Deposition (Reactive Polymer)
    StateE: Object Adhered to Coating
    StateF: Controlled Cooling in Vacuum
    StateG: Object Released

    StateA --> StateB: Establish Environment
    StateB --> StateC: Plate Reaches Set Temp
    StateC --> StateD: Start Printing
    StateD --> StateE: Layers Adhere
    StateE --> StateF: Print Complete, Initiate Cooling
    StateF --> StateG: Thermal Contraction Release

3. Cross-Domain Application

Derivative 3.1: Semiconductor Wafer Handling

• Enabling Description: The system is adapted for temporary mounting and precise release of semiconductor wafers during fabrication steps that require localized heating or cooling (e.g., during chemical vapor deposition prep, resist curing, or etching processes). The "build platform" (102) becomes a wafer chuck with embedded heating/cooling coils. The "thermally conductive plate" (104) is a thin, removable wafer carrier made of high-purity silicon or quartz. The "polymer coating" (106) is an ultrathin, high-temperature, low-outgassing polybenzoxazole (PBO) or polyimide film, spin-coated onto the wafer carrier. This coating temporarily adheres the semiconductor wafer (the "3D object") at processing temperatures and allows for contamination-free release upon controlled cooling, avoiding mechanical damage or chemical residues.

flowchart TD
    A[Wafer Chuck (Heated/Cooled)] --> B[Removable Wafer Carrier (Si/Quartz)];
    B --> C[PBO/Polyimide Coating (Spin-Coated, Low-Outgassing)];
    C -- Adhesion at Process Temp --> D[Semiconductor Wafer];
    D -- Process Complete, Controlled Cooling --> E[Contamination-Free Wafer Release];

Derivative 3.2: Precision Optics Manufacturing

• Enabling Description: The apparatus is used for temporary fixturing and non-damaging release of delicate, precision optical components (e.g., lenses, mirrors, prisms) during polishing, coating, or inspection stages. The "build platform" (102) acts as a temperature-controlled optical jig. The "thermally conductive plate" (104) is a precision-machined, optically flat glass-ceramic (e.g., Zerodur) or low-CTE alloy substrate, which can be quickly installed and removed. A transparent, UV-curable, high-temperature polymer coating (106), such as a specialized epoxy-acrylate or polyimide variant, is precisely deposited on the substrate. This coating temporarily holds the optical component at specified temperatures, and its low-modulus properties combined with thermal contraction facilitate release upon cooling, preserving surface quality.

graph TD
    A[Optical Jig (Temp Controlled)] --> B[Removable Optical Substrate (Glass-Ceramic/Low-CTE Alloy)];
    B --> C[Transparent UV-Curable Polymer Coating];
    C -- Adhesion for Processing --> D[Precision Optical Component];
    D -- Process Complete, Controlled Cooling --> E[Non-Damaging Release];

Derivative 3.3: Catalysis and Microreactor Systems

• Enabling Description: The system serves as a reconfigurable heated/cooled bed for microreactor plates or catalyst arrays in chemical process development. The "build platform" (102) functions as a heated/cooled base for the microreactor. The "thermally conductive plate" (104) is a removable, thin-film microreactor insert fabricated from a chemically resistant alloy (e.g., Hastelloy, Inconel) or ceramic (e.g., alumina). A specialized, chemically inert and high-temperature stable polymer coating (106), such as perfluoroalkoxy (PFA) or a fluorinated polyimide variant, is plasma-polymerized onto the insert. This coating facilitates temporary adhesion of catalyst particles or microfluidic components (the "3D object") during reaction or processing, allowing for facile and residue-free removal/exchange of microreactor inserts after a reaction cycle.

stateDiagram
    direction LR
    StateA: Heated/Cooled Base
    StateB: Removable Microreactor Insert
    StateC: Chemically Inert Polymer Coating
    StateD: Catalyst Particles/Microfluidic Components
    StateE: Adhesion at Reaction Temp
    StateF: Reaction Cycle Complete, Cooling
    StateG: Residue-Free Insert Removal/Exchange

    StateA --> StateB: Insert Mounted
    StateB --> StateC: Coating Applied (Plasma-Pol.)
    StateC --> StateD: Components Adhered
    StateD --> StateE: Initiate Reaction
    StateE --> StateF: End Reaction
    StateF --> StateG: Thermal Release

4. Integration with Emerging Tech

Derivative 4.1: AI-Driven Coating Optimization & Predictive Maintenance

• Enabling Description: The build apparatus incorporates an array of distributed IoT sensors (e.g., piezoelectric sensors for adhesion force, optical profilometers for surface roughness, embedded thermocouples) within and across the removable plate (104) and its polymer coating (106). An AI module continuously monitors real-time adhesion performance, coating wear, and surface integrity. This AI analyzes historical data and live sensor feeds to predict coating degradation, optimize printing parameters (e.g., first-layer temperature, extrusion multiplier, print speed) for maximum adhesion and minimal wear, and schedule proactive coating maintenance or replacement. The AI can dynamically adjust coating surface energy properties via localized electrical fields or micro-textured actuation if the coating contains electromechanically responsive polymers.

flowchart LR
    A[IoT Sensors (Adhesion, Wear, Temp)] --> B{Data Acquisition & Pre-processing};
    B --> C[AI Module (Machine Learning Models)];
    C -- Predictive Analytics --> D{Coating Degradation Forecast};
    C -- Optimization Feedback --> E[Dynamic Print Parameter Adjustment];
    D --> F[Proactive Maintenance/Replacement Schedule];
    E --> G[3D Printing Process];

Derivative 4.2: Blockchain-Enabled Supply Chain & Provenance Tracking

• Enabling Description: Each removable plate (104) and its polymer coating (106) are assigned a unique digital identity (e.g., a QR code or RFID tag linked to a blockchain entry) at the point of manufacture. This blockchain ledger immutably records critical data such as coating material composition, application parameters, quality control metrics, installation date, cumulative print hours, materials printed, and maintenance history. IoT sensors on the build apparatus automatically log usage data to the blockchain. This allows for transparent provenance tracking, verification of genuine components, and provides a tamper-proof audit trail for regulatory compliance and quality assurance in sensitive applications (e.g., aerospace, medical device manufacturing).

sequenceDiagram
    participant M as Manufacturer
    participant P as Plate/Coating (RFID/QR)
    participant B as Blockchain Ledger
    participant S as IoT Sensors
    participant U as User/Auditor

    M->P: Assign Unique ID, Encode QC Data
    P->B: Store Initial Provenance Data (Hash)
    S->P: Read ID
    S->B: Log Usage Data (Cumulative Prints, Temp Cycles)
    P->B: Log Maintenance/Replacement Events
    U->B: Query Immutable History & Provenance

Derivative 4.3: IoT-Enabled Environmental Adaptive Coating

• Enabling Description: The polymer coating (106) is a smart material composed of a high-temperature polymer matrix with embedded thermochromic pigments, humidity sensors, and micro-actuators (e.g., dielectric elastomer actuators). IoT sensors on the build platform (102) monitor ambient humidity, atmospheric pressure, and chamber gas composition. An embedded microcontroller analyzes these environmental factors in real-time. Based on this data, the micro-actuators in the coating can induce subtle changes in surface topography or stiffness, optimizing adhesion for varying environmental conditions, potentially reducing warping in hygroscopic materials. The thermochromic pigments provide visual feedback on coating temperature. Data is logged and accessible via a cloud-based IoT platform for remote monitoring and adaptive control.

stateDiagram
    direction LR
    StateA: Idle (Environmental Monitoring)
    StateB: Printing (Adaptive Adhesion)
    StateC: Cooling (Optimal Release)

    StateA --> StateB: Print Job Start
    StateB --> StateB: Monitor Env. (Humidity, Pressure, Gas)
    StateB --> StateB: Analyze (Microcontroller)
    StateB --> StateB: Adjust Coating Topography/Stiffness (Micro-actuators)
    StateB --> StateC: Print Job End, Initiate Cooling
    StateC --> StateA: Object Removed

5. The "Inverse" or Failure Mode

Derivative 5.1: Controlled, Emergency Rapid Release System

• Enabling Description: The build apparatus includes an emergency rapid release system. Upon detection of a critical failure during printing (e.g., thermal runaway, catastrophic layer shift, printhead crash, or fire hazard), the temperature control unit (102) triggers an immediate, forced rapid cooling of the thermally conductive plate (104) and polymer coating (106) using a high-flow inert gas purge (e.g., liquid nitrogen vapor, compressed CO2) or localized Peltier elements. Simultaneously, a pneumatic or electromechanical actuation system beneath the plate rapidly flexes or vibrates the plate (similar to a controlled "pop-off" mechanism but accelerated), causing instantaneous, albeit potentially damaging, detachment of the 3D object from the coating. The system prioritizes rapid removal for safety and machine protection over damage-free object preservation.

flowchart TD
    A[Critical Failure Detected (Sensors)] --> B{Emergency Protocol Triggered};
    B --> C[Forced Rapid Cooling (LN2/CO2/Peltier)];
    C --> D[Pneumatic/Electromechanical Plate Actuation (Flex/Vibrate)];
    D --> E[Instantaneous Object Detachment (Controlled Damage)];
    E --> F[Machine Safety/Damage Containment];

Derivative 5.2: Self-Diagnostic Low-Power Mode for Coating Health Monitoring

• Enabling Description: The build apparatus features a low-power, self-diagnostic mode specifically for assessing the polymer coating's (106) health. In this mode, the build platform (102) maintains a minimal, stable temperature (e.g., 50°C). An integrated non-contact optical sensor (e.g., interferometer, laser profilometer) or an array of micro-capacitive sensors embedded within the plate scans the coating surface to detect micro-cracks, delaminations, changes in roughness, or variations in dielectric properties indicative of wear or degradation. This data is processed locally to generate a coating health score, informing the user when maintenance or replacement is required, without consuming significant power or requiring a full print cycle.

stateDiagram
    direction LR
    StateA: Normal Operation
    StateB: Low-Power Diagnostic Mode (Idle)
    StateC: Coating Scan Active
    StateD: Data Analysis & Health Score
    StateE: Report/Alert User

    StateA --> StateB: User Selects Diagnostic / Scheduled
    StateB --> StateC: Initiate Sensor Scan
    StateC --> StateD: Process Sensor Data
    StateD --> StateE: Display Results
    StateE --> StateA: Return to Normal / Wait for Action

Derivative 5.3: Limited-Functionality "Safe Print" Mode

• Enabling Description: The system incorporates a "safe print" mode for when the polymer coating (106) is nearing its end-of-life or has minor, localized damage. In this mode, the temperature control unit (102) automatically reduces the maximum achievable plate temperature (e.g., limited to 150°C) and reduces print speed. The slicing software is instructed to generate support structures or rafts with increased interface area on the compromised coating regions, effectively distributing adhesion forces to prevent further damage to the coating or failure of the print. The "damage-free removal" guarantee is relaxed, and the system may advise the use of mild mechanical assistance for part removal, highlighting the priority of completing a functional, albeit lower-quality, print over preserving coating integrity or optimizing part removal.

flowchart TD
    A[Coating Health Status (Low/Damaged)] --> B{Activate "Safe Print" Mode};
    B --> C[Reduced Max Plate Temp];
    B --> D[Reduced Print Speed];
    B --> E[Slicing Software Adjustments (Increased Raft/Support Interface)];
    E --> F[Print Job Execution];
    F --> G[Part Removal (Potentially Requires Mild Mechanical Assist)];

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Combination Prior Art Scenarios with Open-Source Standards

These scenarios describe how the principles of US 9592660, specifically the heated build platform with a polymer-coated removable plate for adhesion and release, could be combined with existing open-source standards to render further minor improvements obvious.

1. Combination with RepRap Firmware (Marlin/Klipper) G-code Standards

• Scenario: Implementing custom G-code commands within open-source 3D printer firmware (e.g., Marlin, Klipper) to control the heating profile and cooling cycles of the US9592660-style build apparatus.
• Enabling Description: The standard G-code M140 (Set Heated Bed Temperature) and M190 (Wait for Heated Bed Temperature) are extended with new commands. For instance, M140 S<target_temp> R<release_temp> C<cooling_rate_type> would not only set the printing temperature but also define a target release temperature and a specified cooling rate profile (e.g., linear, exponential, stepped) designed for optimal object detachment from the polymer-coated removable plate (104/106). Upon print completion, the firmware would automatically initiate the defined cooling sequence, leveraging the low CTE of the plate (104) and the release properties of the coating (106) to trigger part separation. This integrates the core functional benefit of US9592660 (controlled adhesion/release) directly into widely adopted open-source printer control.
• Open-Source Standard: RepRap G-code, specifically extensions for M140, M190 in Marlin/Klipper firmware.

2. Combination with ASTM F42 Additive Manufacturing Standards for Performance Validation

• Scenario: Developing open-source test routines and methodologies based on ASTM F42 standards for validating the adhesion and release performance of the polymer-coated removable plate system.
• Enabling Description: A test apparatus incorporating the US9592660 build platform, removable plate, and polymer coating is used to print standardized ASTM F42 test geometries (e.g., tensile bars, overhang test features) with various high-temperature thermoplastics. Open-source software implements test protocols derived from ASTM F42 (e.g., D638 for tensile properties, D412 for tear strength) but specifically adapted to measure adhesion force during printing via embedded load cells in the build platform, and release force/temperature during cooling. Data on part removal success rate, coating wear after multiple cycles, and surface finish of the detached part are recorded and publicly disseminated. This combines the invention's benefits with standardized, open-source performance validation.
• Open-Source Standard: ASTM F42 (Additive Manufacturing) standards, e.g., F2924-14 (Standard Terminology for Additive Manufacturing Technologies), F3001 (Standard Practice for Characterizing Parts Made by Additive Manufacturing).

3. Combination with Open-Source Sensor Data Protocols (e.g., MQTT, OPC UA for IoT)

• Scenario: Integrating the thermal control and status monitoring of the US9592660 build apparatus with open-source IoT communication protocols for real-time data streaming and remote monitoring.
• Enabling Description: Thermocouples (204), heater cartridges (202), and additional sensors (e.g., pressure sensors to detect plate bowing, IR sensors for coating surface temperature) within the US9592660 build platform (102) and removable plate (104/106) are connected to an embedded controller running an open-source operating system (e.g., Linux, FreeRTOS). This controller implements a publish-subscribe messaging protocol like MQTT or an interoperability standard like OPC UA. Real-time temperature, adhesion status, and print stage data are streamed to a local network or cloud-based server. This allows for remote process monitoring, alerts on unexpected adhesion/release events, and historical data logging for predictive maintenance of the coating and plate. The communication utilizes known open-source client libraries and brokers.
• Open-Source Standard: MQTT (Message Queuing Telemetry Transport), OPC UA (Open Platform Communications Unified Architecture).