Invalidity dossier
US 10730746
Method for manufacturing a micromechanical inertial sensor
Current assignee: Robert Bosch GmbH
Added 9/23/2026, 4:46:03 PM
Active provider: DeepSeek · deepseek-flash
Patent summary
Title, assignee, inventors, filing/issue dates, abstract, and a plain-language overview of the claims.
Patent Overview — US10730746B2
Title: Method for manufacturing a micromechanical inertial sensor
Assignee: Robert Bosch GmbH (original assignee and current assignee per listing)
Inventors: Jochen Reinmuth, Martin Rambach
Key dates: Priority date 2017-04-27; application US15/963,830 filed 2018-04-26; published as US20180312397A1 on 2018-11-01; granted/publication date 2020-08-04. Listed status: Active, adjusted expiration 2039-01-10 (as listed by the source, not a legal conclusion).
Purpose and plain-language scope: The patent concerns making a micromechanical inertial sensor. The described problem is that combination components (on-chip integration of multiple sensors, e.g., acceleration sensors and rotation rate sensors) benefit from different cavity pressures: very low cavity pressures for rotation rate sensors, generally higher pressures for acceleration sensors. The excerpt notes these different pressures in different cavities may be implemented by various technologies, e.g., getter materials, the oxide reseal process, or the laser reseal process.
The method forms an access opening into the cavity from two opposing sides: a first narrow access channel is created which, together with a wider access channel created from another side, creates access to the cavity. A lowered closed area is situated below the wafer surface, so the closed area may no longer be mechanically stressed. A micromechanical inertial sensor is also claimed.
Refinements noted in the excerpt: The second access opening may be produced by laser drilling and/or a trenching method; laser drilling is described as advantageous particularly for polysilicon. One refinement provides that the second access opening is not completely formed by laser drilling, the rest being formed by trenching, so laser-drilling particles cannot enter movable structures. Closing of the first access opening may use laser reseal or oxide reseal; an anti-adhesion layer material may be poured into the cavity during closing.
What the excerpt does not establish: It is an excerpt only, so full claim text, complete dependents, figures, embodiments, the full background, and any cited prior art are not established here. It does not establish claim scope beyond the paraphrased passages above.
Source: https://patents.google.com/patent/[US10730746](/patent/US10730746)/en
Generated 10/1/2026, 9:44:13 PM
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Litigation summary
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PTAB challenges
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Assignment history
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Prior art
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Obviousness
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Extensions
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Derivative works
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