US 8064202

Here is a concise summary of US Patent 8064202, "Sandwich structure with double-sided cooling and EMI shielding," as of April 26, 2026:

Title: Sandwich structure with double-sided cooling and EMI shielding
Assignee: Monolithic Power Systems Inc.
Inventors: Jian Yin, Hunt H. Jiang, Kaiwei Yao
Filing Date: February 24, 2010
Issue Date: November 22, 2011
Abstract: The patent discloses a sandwich structure and corresponding method for mini-modules, designed for double-sided thermal cooling, EMI (electromagnetic interference) noise shielding, and current carrying. The structure includes a top and a bottom component for double-sided cooling. The top component specifically provides EMI noise shielding. The design also incorporates a first set of connecting structures to link mini-module devices with the top component, and a second set of connecting structures to connect the top component with the bottom component, with all connecting structures capable of carrying current.

Plain-Language Overview of Independent Claims:

• Claim 1 (Apparatus Claim): This claim describes a physical "sandwich structure" for electronic mini-modules. It includes:

  • A top lead frame that provides cooling, EMI shielding, and carries current, having a top and bottom surface.
  • A bottom structure for cooling, current carrying, and circuit control, also with top and bottom surfaces.
  • Internal components, at least a first set of which are mounted on the top surface of the bottom structure.
  • A first set of connecting structures that link each of the first internal components to the bottom surface of the top lead frame.
  • A second set of connecting structures that connect directly between the bottom surface of the top lead frame and the top surface of the bottom structure, creating current paths for the internal components.

• Claim 11 (Method Claim): This claim outlines a method for cooling mini-modules, shielding EMI, and carrying currents. It involves the following steps:

  • Mounting a first set of components on the top surface of a bottom structure, which itself handles cooling, current, and circuit control.
  • Connecting a first side of a first set of connecting structures to a top lead frame, where the top lead frame is responsible for cooling, EMI shielding, and current carrying.
  • Connecting a first side of a second set of connecting structures to the bottom surface of the top lead frame, with these structures providing current paths for the mini-modules.
  • Connecting a second side of the first set of connecting structures to the first set of components.
  • Connecting a second side of the second set of connecting structures to the top surface of the bottom structure.

USPTO and CAFC 2026 Docket Search:

The USPTO provides a "Patent Public Search" tool for searching patents and patent application publications. The provided patent text confirms the status of US8064202B2 as "Active" and notes "Family has litigation" with a "US case filed in Delaware District Court".

Regarding the U.S. Court of Appeals for the Federal Circuit (CAFC) 2026 dockets, a direct search for "US8064202 CAFC 2026 dockets" did not immediately return specific dockets for 2026. The CAFC website provides information on case records and filings. For cases filed before March 1, 2012, case records are typically stored with the National Archives and Records Administration, although the Clerk's Office may maintain some documents on-site. Since US8064202 was granted in 2011, any appeal related to this patent would likely fall under these older records. To get precise 2026 docket information, one would generally need to perform a more targeted search within the court's systems (e.g., PACER) or contact the Clerk's Office directly, possibly incurring fees for records searches for documents not available through PACER.

Therefore, while the patent is active and has noted litigation in the Delaware District Court, there is no immediate authoritative information from the provided search results about specific CAFC 2026 dockets for US8064202.