US 7390740

Patent Overview: US 7,390,740 B2

Title: "Sloped vias in a substrate, spring-like contacts, and methods of making"

Patent number: US 7,390,740 B2

Inventors: James M. Wark; Syed S. Ahmad

Original/current assignee: Micron Technology, Inc.

Application number: US 10/933,847

Priority/filing date: 2004-09-02

Publication date (granted): 2008-06-24

Prior publication: US 2006/0046475 A1

Status (per listing): Expired – Lifetime; adjusted expiration 2025-04-05

Purpose and plain-language scope (based only on the supplied text): The patent concerns forming sloped vias in a substrate, spring-like contacts, and methods of making them. The listed prior-art keywords — substrate, forming, opening, access point, vias — indicate the disclosure addresses creating an opening or access point in a substrate and forming a via therein. The title indicates the vias are sloped rather than straight, and that spring-like contacts are also covered, along with fabrication methods.

Classifications (from the supplied listing): H05K 1/11 and 1/115 (via connections; lands around holes or via connections); H05K 2201/09836 (oblique hole, via or bump); H05K 3/00 groups covering etching by laser ablation, plasma etching, and multilayer circuit lamination; and various H10W groups relating to interconnections, through-semiconductor vias (including blind vias in manufacture), top-view via shapes, and package substrates/interposers.

What the excerpt does not establish: The supplied text is a bibliographic/classification abstract only. It does not include the claims, written description, drawings, or detailed embodiments, so the precise structural features, materials, dimensions, angles, or method steps are not established here. It also does not establish priority-date accuracy or legal status, which the listing itself describes as assumptions or non-legal conclusions. No litigation, ownership-transfer, validity, or prior-art conclusions are drawn.

Source: https://patents.google.com/patent/US7390740/en