Micron Consumer Products Group LLC

Micron Consumer Products Group LLC is a subsidiary of Micron Technology, Inc., a leading American multinational semiconductor company headquartered in Boise, Idaho. Micron Technology, Inc. was founded in 1978 and is publicly traded on Nasdaq under the ticker MU. As of 2025, its parent company reported 53,000 employees and revenue of US$37.4 billion. Micron Consumer Products Group LLC itself was established on January 22, 2020, with a principal address in San Jose, California.

Historically, Micron Consumer Products Group LLC served as the consumer-facing division, offering Crucial-branded DRAM, SSDs, and system solutions through various retail and e-tail channels. This included consumer products such as memory modules and solid-state drives. However, Micron Technology announced in December 2025 its decision to discontinue the Crucial brand and exit the consumer market by February 2026, to concentrate on higher-growth enterprise segments, including data centers and artificial intelligence solutions.

In terms of patent litigation, Micron Consumer Products Group LLC appears as a plaintiff in one tracked case before the Patent Trial and Appeal Board (PTAB). This posture suggests an active role in patent disputes, potentially challenging competitor patents or defending its own intellectual property. The parent company, Micron Technology, Inc., is a significant player in the semiconductor industry and is frequently involved in patent litigation, both as a defendant against assertions by other entities and as an enforcer of its own patents.

The sole tracked case for Micron Consumer Products Group LLC is Micron Technology, Inc. et al. v. Yangtze Memory Technologies Co Ltd, filed at the PTAB on January 7, 2025. This case is likely part of a broader ongoing patent dispute, as Yangtze Memory Technologies Co (YMTC) initiated a lawsuit in November 2023 against Micron Technology and its Consumer Products Group in a U.S. District Court, alleging infringement of eight of YMTC's patents related to 3D NAND technology.