Defendant

TDK Corporation Of America

1 case as defendant.

Company profile

TDK Corporation of America Company Profile

TDK Corporation of America is the U.S. sales and marketing subsidiary of TDK Corporation, a publicly-traded Japanese multinational electronics company (TYO: 6762). Headquartered in Lincolnshire, Illinois, the American subsidiary was established in 1974. The parent company, TDK Corporation, was founded in Tokyo in 1935 to commercialize ferrite, a key magnetic material. For its fiscal year ending in March 2025, TDK Corporation reported global sales of ¥2.2 trillion (approximately USD 14.6 billion) and employed over 101,000 people worldwide.

TDK is an operating company that manufactures a vast portfolio of electronic components, modules, and systems. Its products are used in the information and communication technology, automotive, industrial, and consumer electronics sectors. Key product categories include passive components such as ceramic capacitors, inductors, and EMC components; sensor application products like temperature, pressure, magnetic, and MEMS sensors; magnetic application products including HDD heads and magnets; and energy application products like power supplies and batteries. The company markets products under various brands, including TDK, EPCOS, InvenSense, Micronas, and TDK-Lambda.

As an operating company, TDK Corporation of America's patent litigation posture is that of a defendant. The provided database shows one case filed against it and zero cases filed as a plaintiff. This defensive posture is typical for a large technology manufacturer facing assertions from third parties.

The single tracked case is Mems Innovations LLC v. TDK Corp et al., filed in the Northern District of California on April 17, 2026. The plaintiff, Mems Innovations LLC, has been identified by RPX as an entity that licenses patents from the Electronics and Telecommunications Research Institute (ETRI), a Korean research company. Previous suits filed by Mems Innovations against TDK entities have targeted ultrasonic "Chirp Sensors" that incorporate micro-electromechanical systems (MEMS) technology.