Prior art

To identify the most relevant prior art for US patent 11081503, I will examine the "Cited By" and "Citations" sections of the patent itself. Prior art, as defined by 35 U.S.C. § 102, includes any publicly available information that predates the claimed invention and can impact its novelty and non-obviousness.

Here's an analysis of the citations listed in US patent 11081503:

Prior Art Cited by the Applicant/Examiner (Citations):

The following patents were cited during the prosecution of US11081503:

• US10373987B2

  • Full Citation: US10373987B2 - Array substrate and method of mounting integrated circuit using the same.
  • Publication/Filing Date: Priority Date: 2014-06-17; Publication Date: 2019-08-06.
  • Brief Description: This patent shares the same title and assignee (Samsung Display Co., Ltd.) as US11081503, indicating it is a related patent, likely a parent application or a divisional/continuation thereof. It generally describes an array substrate and method of mounting an integrated circuit, focusing on preventing misalignment due to substrate deformation.
  • Potential Anticipation: Given its close relation and shared inventive concept, US10373987B2 likely anticipates many of the core elements of the independent claims of US11081503, especially regarding the use of inclined pads or multiple sub-pad units to compensate for substrate deformation. Specific claims would need detailed comparison, but it would likely impact Claims 1, 2, 8, 9, and 10 of US11081503.

• US20170038630A1

  • Full Citation: US20170038630A1 - Display device.
  • Publication/Filing Date: Priority Date: 2014-03-14; Publication Date: 2017-02-09.
  • Brief Description: Assigned to Innolux Corporation, this publication describes a display device. Without access to the full text of this reference, a precise description of its relevance is limited, but the title suggests it pertains to the general field of display technology.
  • Potential Anticipation: To determine specific anticipation, a detailed claim-by-claim comparison would be necessary. However, if this reference discloses aspects of pad arrangements, integrated circuit mounting on flexible substrates, or methods to address misalignment in display devices, it could potentially anticipate claims relating to the array substrate structure or the mounting method, such as Claims 1, 5, 6, 7.

• US20080128699A1

  • Full Citation: US20080128699A1 - Thin film transistor substrate and fabricating method thereof.
  • Publication/Filing Date: Priority Date: 2006-12-04; Publication Date: 2008-06-05.
  • Brief Description: This patent publication focuses on thin film transistor (TFT) substrates and their fabrication. It likely details aspects of TFT array structures, including wiring and connection pads, which are fundamental components of the array substrate in US11081503.
  • Potential Anticipation: Depending on the specific pad shapes, arrangements, and any discussion of mitigating manufacturing deformations, this reference could potentially anticipate elements of the array substrate (Claim 1) or individual pad features (Claims 2, 8).

• JPH04352132A

  • Full Citation: JPH04352132A - Connecting terminal arrangement structure for electronic components, tape carrier package, and liquid crystal display device using the tape carrier package.
  • Publication/Filing Date: Priority Date: 1991-05-30; Publication Date: 1992-12-07.
  • Brief Description: This Japanese patent application describes a connecting terminal arrangement for electronic components, specifically in the context of tape carrier packages and LCD devices. This suggests it details structures for connecting integrated circuits to display substrates.
  • Potential Anticipation: This older reference could potentially anticipate broader concepts of pad arrangements and integrated circuit connection on display substrates. If it discusses angled pads or methods to improve connection reliability, it could impact Claim 1 and its dependent claims concerning pad shapes and electrical connections.

• JPH11112119A

  • Full Citation: JPH11112119A - Alignment of connecting pad.
  • Publication/Filing Date: Priority Date: 1997-05-21; Publication Date: 1999-04-23.
  • Brief Description: This Japanese patent application directly addresses the "alignment of connecting pads," which is a central problem US11081503 seeks to solve. It likely discloses methods or structures to improve alignment during the mounting of integrated circuits.
  • Potential Anticipation: This is a highly relevant reference. If it discloses mechanisms for compensating for misalignment, especially related to expansion/contraction or using non-rectangular pad shapes, it could potentially anticipate many claims of US11081503, particularly those related to the method of mounting (Claim 14, in original application, not available in the granted patent, but mentioned in the detailed description) and the specific pad structures (Claims 1, 2, 8, 9, 10).

• JP2000187452A

  • Full Citation: JP2000187452A - Electric circuit device.
  • Publication/Filing Date: Priority Date: 1998-12-22; Publication Date: 2000-07-04.
  • Brief Description: This Japanese patent application describes an "electric circuit device." Without further detail, its specific relevance is hard to ascertain, but it would be in the general field of electronic circuits.
  • Potential Anticipation: A general "electric circuit device" could potentially anticipate very broad aspects of the electronic device in Claim 1, but its impact on the specific features of inclined pads or misalignment correction would depend on its detailed disclosure.

• US6114754A

  • Full Citation: US6114754A - Tape automated bonding film.
  • Publication/Filing Date: Priority Date: 1997-11-27; Publication Date: 2000-09-05.
  • Brief Description: This US patent describes a "tape automated bonding film." TAB technology is a method for connecting integrated circuits to substrates.
  • Potential Anticipation: This reference could anticipate the general concept of connecting integrated circuits via bumps and pads (Claim 5). Its specific relevance to the inclined pad shapes or misalignment correction methods would need a deeper review of its content.

• US20030160929A1

  • Full Citation: US20030160929A1 - Electronic device, method of manufacturing the same, and electronic instrument.
  • Publication/Filing Date: Priority Date: 2002-02-28; Publication Date: 2003-08-28.
  • Brief Description: This US patent publication relates to an electronic device and its manufacturing method.
  • Potential Anticipation: Similar to JPH11112119A, if this reference discusses methods or structures to manage misalignment during manufacturing, particularly for flexible substrates or components with pads, it could anticipate various claims, including those related to the array substrate and mounting method (Claims 1, 2, 8, 9, 10).

• KR20070007633A

  • Full Citation: KR20070007633A - Tape carrier package and liquid crystal display including the same.
  • Publication/Filing Date: Priority Date: 2005-07-11; Publication Date: 2007-01-16.
  • Brief Description: This Korean patent application details a tape carrier package and a liquid crystal display incorporating it.
  • Potential Anticipation: This reference, being in the display technology field and mentioning tape carrier packages, could potentially anticipate elements related to the overall electronic device (Claim 1) or the interconnection between the integrated circuit and the array substrate (Claim 5).

• JP2007242942A

  • Full Citation: JP2007242942A - Electronic device and manufacturing method thereof.
  • Publication/Filing Date: Priority Date: 2006-03-09; Publication Date: 2007-09-20.
  • Brief Description: This Japanese patent application describes an electronic device and its manufacturing method.
  • Potential Anticipation: Depending on the details of the electronic device and its manufacturing method, particularly regarding connection structures and alignment processes, this could impact claims related to the array substrate or mounting method (Claims 1, 2, 8, 9, 10).

• KR20080086214A

  • Full Citation: KR20080086214A - Flat panel display.
  • Publication/Filing Date: Priority Date: 2007-03-22; Publication Date: 2008-09-25.
  • Brief Description: This Korean patent application describes a flat panel display.
  • Potential Anticipation: This reference's impact would depend on its specific disclosures regarding pad structures, IC mounting, and deformation compensation in flat panel displays. It could potentially anticipate the electronic device of Claim 1.

• JP2009288540A

  • Full Citation: JP2009288540A - Method of manufacturing organic el panel and organic el panel.
  • Publication/Filing Date: Priority Date: 2008-05-29; Publication Date: 2009-12-10.
  • Brief Description: This Japanese patent application focuses on manufacturing methods for organic EL (electroluminescent) panels. OLED technology is mentioned in US11081503 as an example of a display element.
  • Potential Anticipation: If this reference discusses issues related to flexible substrates, pad arrangements, or chip mounting in the context of OLED panel manufacturing, it could be highly relevant to claims concerning the array substrate (Claim 1) and the method of mounting (mentioned in description as key).

• KR20110119004A

  • Full Citation: KR20110119004A - Plasma Display Panel & Multi Plasma Display Panel.
  • Publication/Filing Date: Priority Date: 2010-04-26; Publication Date: 2011-11-02.
  • Brief Description: This Korean patent application relates to Plasma Display Panels (PDP).
  • Potential Anticipation: While US11081503 focuses on LCD/OLED, if PDP technology shares similar challenges in integrated circuit mounting and pad alignment, this reference could be tangentially relevant to general mounting methods, but less likely to anticipate the specific inclined pad solutions.

• JP2012058533A

  • Full Citation: JP2012058533A - Liquid-crystal display device.
  • Publication/Filing Date: Priority Date: 2010-09-09; Publication Date: 2012-03-22.
  • Brief Description: This Japanese patent application describes a liquid crystal display device.
  • Potential Anticipation: Similar to other display device references, its relevance depends on its specific disclosure of pad configurations and mounting techniques for integrated circuits in LCDs, potentially impacting Claim 1.

• KR20130053280A

  • Full Citation: KR20130053280A - Chip on glass type flexible organic light emitting diodes.
  • Publication/Filing Date: Priority Date: 2011-11-15; Publication Date: 2013-05-23.
  • Brief Description: This Korean patent application specifically mentions "Chip on glass type flexible organic light emitting diodes," directly addressing flexible substrates and COG mounting for OLEDs, which are key aspects of US11081503.
  • Potential Anticipation: This is a highly relevant reference due to its explicit mention of flexible OLEDs and Chip-on-Glass (COG) mounting, which are central themes of US11081503. If it discloses solutions to misalignment or specific pad geometries for flexible substrates, it could significantly impact Claims 1, 2, 8, 9, 10, and claims related to the mounting method.

• US20130188109A1

  • Full Citation: US20130188109A1 - Sub-pixel structure of thin film transistor liquid crystal display and liquid crystal display.
  • Publication/Filing Date: Priority Date: 2011-11-29; Publication Date: 2013-07-25.
  • Brief Description: This US patent publication describes sub-pixel structures in TFT LCDs.
  • Potential Anticipation: While focused on sub-pixel structure, if it discusses associated wiring, gate lines, or data lines that connect to external integrated circuits and their connection points, it could have some relevance to the array substrate of Claim 1, but less likely to the specific pad shapes for misalignment correction.

• CN104123902A

  • Full Citation: CN104123902A - Display panel, electronic device including the display panel, and bonding method thereof.
  • Publication/Filing Date: Priority Date: 2013-04-29; Publication Date: 2014-10-29.
  • Brief Description: This Chinese patent application covers a "display panel, electronic device including the display panel, and bonding method thereof." The bonding method aspect is particularly relevant.
  • Potential Anticipation: This reference, particularly its focus on "bonding method," could be highly relevant to the method claims of US11081503. If it discloses techniques for correcting misalignment during bonding, or uses specific pad geometries to facilitate this, it could anticipate a wide range of claims including the array substrate (Claim 1) and the mounting method (mentioned in description as key).

Most Relevant Prior Art:

Based on the titles and brief descriptions, the following prior art references appear to be the most relevant, as they directly address the core problems and solutions presented in US11081503:

1. US10373987B2: This is a direct family member with the same inventive concept, making it highly anticipatory of many claims.
2. JPH11112119A: Explicitly titled "Alignment of connecting pad," this reference directly tackles the problem of misalignment that US11081503 aims to solve.
3. KR20130053280A: "Chip on glass type flexible organic light emitting diodes" directly addresses flexible substrates and COG mounting for OLEDs, which are key application areas for US11081503.
4. CN104123902A: The focus on "bonding method" suggests it may disclose techniques for correcting misalignment or specific pad geometries for flexible substrates.

To confirm the exact scope of anticipation, a thorough claim-by-claim analysis against the full text of each of these most relevant prior art documents would be necessary.