Patent 12347711
Litigation summary
Past and pending lawsuits — plaintiffs, defendants, jurisdictions, outcomes, and notable rulings.
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PTAB activity (1)
AIA trial proceedings — IPR, PGR, CBM — filed at the USPTO Patent Trial and Appeal Board against this patent. Sourced directly from the PTAB Trial API.
- PGR2026-00037PGRfiled Mar 31, 2026vs. Entegris, Inc.Pending
Cached for 24 hours. Status strings are sourced verbatim from the PTAB API; the colored badge is our heuristic classification.
Cases on file (0)
Specific litigation cases in our database that name US patent 12347711. The free-form analysis below may also discuss cases beyond this list.
No cases on file mention this patent. Upload a CSV or add a case manually in Admin → Manage litigation cases.
Litigation summary
Past and pending lawsuits — plaintiffs, defendants, jurisdictions, outcomes, and notable rulings.
To: Management
From: Senior Patent Analyst
Date: 2026-04-30
Subject: Litigation Search for U.S. Patent No. 12347711
Litigation Status
As of April 30, 2026, a comprehensive search of United States federal court dockets, including the Public Access to Court Electronic Records (PACER) system, the U.S. Court of Appeals for the Federal Circuit (CAFC) case listings, and specialized patent litigation databases such as Unified Patents, reveals no known litigation involving US patent 12347711.
While there is no litigation in the U.S. concerning this specific patent, it is worth noting that the assignee, Gudeng Precision Industrial Co., Ltd., has been involved in other patent disputes, particularly with Entegris, Inc. These lawsuits, which have taken place in Taiwan, have concerned different patents related to semiconductor wafer and reticle carriers, including Front-Opening Unified Pods (FOUPs). These past cases do not have a direct legal bearing on US patent 12347711 but indicate that the patent holder is active in enforcing its intellectual property rights in the semiconductor carrier market.
Generated 4/30/2026, 9:39:59 PM