Prior art

The USPTO provides several tools for searching patents, including Patent Public Search. I have reviewed the patent citations listed in US9629265B2 to identify the most relevant prior art.

Here's an analysis of the patent citations for US9629265:

1. JP2000174465A (Patent Literature 1)

• Full Citation: Japanese Patent Application Publication No. 2000-174465
• Publication/Filing Date: Publication Date: June 23, 2000; Priority Date: December 3, 1998
• Brief Description: This patent describes a mounting structure for an electronic device that includes multiple logic units (e.g., CPUs), power source units, and fan units. Each power source unit is positioned near a logic unit. The housing is partitioned into separate air passages for the logic units and power source units, allowing cooling air from the fan units to cool both concurrently.
• Potential Anticipation (35 U.S.C. § 102): JP2000174465A potentially anticipates elements of claims 1 and 4, particularly regarding the use of fans, electronic parts (CPUs), and power source units within a housing for cooling. However, US9629265B2 distinguishes itself by stating that its structure avoids the complex, partitioned air passages of JP2000174465A, which could increase device weight. The key difference lies in the specific arrangement of power source units not overlapping with CPUs in the airflow direction and being spaced apart in the width direction, which is not explicitly detailed in the description of JP2000174465A provided in US9629265B2.

2. US7839624B2 (Patent Literature 2)

• Full Citation: U.S. Pat. No. 7,839,624
• Publication/Filing Date: Publication Date: November 23, 2010; Priority Date: April 23, 2009
• Brief Description: This patent describes an industrial computer chassis structure that optimizes power supply to motherboards while reducing power loss. The chassis housing is partitioned into sections for storage, fans, motherboards, and power sources. A pair of vertically combined power sources is centrally located, with motherboards horizontally on either side. The fan section is situated between the storage and motherboard sections, interposing the power source section.
• Potential Anticipation (35 U.S.C. § 102): US7839624B2 could potentially anticipate the general concept of cooling electronic devices with fans and power sources within a partitioned housing. However, US9629265B2 differentiates itself by addressing the issue of one power source unit applying heat to another, which US7839624B2's vertical combination of power sources may exacerbate. The claims of US9629265B2 focus on power source units being spaced out in the width direction and not linearly aligned with the CPU in the cooling airflow, which is a different arrangement than described for US7839624B2.

3. JP2005011304A

• Full Citation: Japanese Patent Application Publication No. 2005-011304
• Publication/Filing Date: Publication Date: January 13, 2005; Priority Date: May 29, 2003
• Brief Description: The provided patent text only briefly lists this as a citation under "Patent Literature" and does not offer a detailed description of its contents. Without further information, it is difficult to determine its specific relevance or which claims it might anticipate.
• Potential Anticipation (35 U.S.C. § 102): Cannot be determined without a description of the patent's content.

4. JP2006099773A

• Full Citation: Japanese Patent Application Publication No. 2006-099773
• Publication/Filing Date: Publication Date: April 13, 2006; Priority Date: September 29, 2004
• Brief Description: Similar to JP2005011304A, the provided patent text only lists this as a citation without a detailed description.
• Potential Anticipation (35 U.S.C. § 102): Cannot be determined without a description of the patent's content.

5. US7382613B2

• Full Citation: U.S. Pat. No. 7,382,613
• Publication/Filing Date: Publication Date: June 3, 2008; Priority Date: May 21, 2004
• Brief Description: The provided patent text only lists this as a citation without a detailed description.
• Potential Anticipation (35 U.S.C. § 102): Cannot be determined without a description of the patent's content.

6. JP2008171386A

• Full Citation: Japanese Patent Application Publication No. 2008-171386
• Publication/Filing Date: Publication Date: July 24, 2008; Priority Date: December 13, 2006
• Brief Description: The provided patent text only lists this as a citation without a detailed description.
• Potential Anticipation (35 U.S.C. § 102): Cannot be determined without a description of the patent's content.

7. JP2008269193A

• Full Citation: Japanese Patent Application Publication No. 2008-269193
• Publication/Filing Date: Publication Date: November 6, 2008; Priority Date: April 19, 2007
• Brief Description: The provided patent text only lists this as a citation without a detailed description.
• Potential Anticipation (35 U.S.C. § 102): Cannot be determined without a description of the patent's content.

8. US20100000716A1

• Full Citation: U.S. Patent Application Publication No. 2010/0000716
• Publication/Filing Date: Publication Date: January 7, 2010; Priority Date: July 4, 2008
• Brief Description: The provided patent text only lists this as a citation without a detailed description.
• Potential Anticipation (35 U.S.C. § 102): Cannot be determined without a description of the patent's content.

9. US20140073234A1

• Full Citation: U.S. Patent Application Publication No. 2014/0073234
• Publication/Filing Date: Publication Date: March 13, 2014; Priority Date: September 11, 2012
• Brief Description: The provided patent text only lists this as a citation without a detailed description.
• Potential Anticipation (35 U.S.C. § 102): Cannot be determined without a description of the patent's content.

Based on the descriptions provided within US9629265B2, JP2000174465A and US7839624B2 are the most relevant prior art. US9629265B2 explicitly discusses their disadvantages and aims to overcome them, which strengthens their relevance as prior art for patentability analysis under 35 U.S.C. § 102. The key distinctions for US9629265B2 lie in the non-overlapping and spaced-out arrangement of the power source units relative to the CPUs in the airflow path, which is intended to improve cooling efficiency and reduce heat degradation.