Prior art — US Patent 10714890

Here is an analysis of the most relevant prior art for US Patent 10714890, based on the provided patent text and the current date of April 26, 2026.

US Patent 10714890: Transmitter optical subassembly arrangement with vertically-mounted monitor photodiodes

Most Relevant Prior Art Citations:

The provided patent text for US10714890 lists two patent citations. For each, the full citation, publication/filing dates, a brief description, and an assessment of potentially anticipated claims under 35 U.S.C. § 102 are provided. Note that a thorough anticipation analysis would require reviewing the full text and drawings of each cited prior art document, which is beyond the scope of this response. The descriptions and anticipation assessments below are based on the titles and general context of the cited patents as they relate to US10714890.

US20040163836A1
- Full Citation: Kumar Dev E, "Multi-layer ceramic feedthrough structure in a transmitter optical subassembly," U.S. Patent Application Publication 2004/0163836 A1, published August 26, 2004.
- Publication/Filing Date:
  - Priority Date: February 14, 2002
  - Publication Date: August 26, 2004
- Brief Description: This prior art describes a multi-layer ceramic feedthrough structure designed for use in a transmitter optical subassembly (TOSA). Feedthrough devices are critical components for providing electrical connectivity between internal optical components and external circuitry within a TOSA, especially in hermetically sealed environments. US10714890 extensively discusses the use of a feedthrough device to provide a vertical MPD mounting surface and conductive traces.
- Potential Anticipation (35 U.S.C. § 102):
  This reference potentially anticipates aspects of:
  - Claim 1 (and its dependent claims, as it introduces the feedthrough device concept): Specifically, the "base portion comprising a feedthrough device, the feedthrough device providing a vertical MPD mounting surface". While US20040163836A1 may not explicitly teach a vertical MPD mounting surface on the feedthrough, it establishes the use of a "feedthrough device" within a "transmitter optical subassembly" for electrical connectivity.
  - Claim 2 (and its dependent claims): Which states "wherein the feedthrough device is configured to at least partially be disposed in the cavity of the housing, and wherein a first end of the feedthrough device provides an electrical coupling region to electrically couple to an optical module substrate to receive a radio frequency (RF) driving signal to drive the first LD...". The concept of a feedthrough device providing electrical coupling for a TOSA is directly related to the title of US20040163836A1.
  - Claim 11 (and its dependent claims, being a method claim): The step of "mounting at least one MPD to a vertical MPD mounting surface provided by a feedthrough device" and "patterning a plurality of conductive traces on to one or more surfaces of the feedthrough device" and "inserting the feedthrough device into a cavity of the TOSA housing". The core concept of a feedthrough device with conductive traces in a TOSA is present.

US20180138657A1
- Full Citation: Furukawa Electric Co., Ltd., "Semiconductor laser module," U.S. Patent Application Publication 2018/0138657 A1, published May 17, 2018.
- Publication/Filing Date:
  - Priority Date: July 16, 2015
  - Publication Date: May 17, 2018
- Brief Description: This prior art describes a semiconductor laser module. While the title is broad, semiconductor laser modules are fundamental components of Transmitter Optical Subassemblies (TOSAs), which are the subject of US10714890. This reference likely details structural aspects, thermal management, or electrical connections within a laser module, potentially including laser diodes, submounts, and possibly monitor photodiodes, albeit not necessarily in the unique vertical arrangement claimed by US10714890.
- Potential Anticipation (35 U.S.C. § 102):
  This reference potentially anticipates aspects of:
  - Claim 1: The elements of "a laser diode (LD) mounting surface" and "at least a first LD disposed on the LD mounting surface, the first LD having a back-side emission surface for emitting a portion of optical power along a first optical path." A semiconductor laser module would inherently include these features.
  - Claim 4 (and its dependent claims): This claim details the inclusion of a "thermoelectric cooler (TEC) mounting section," a "thermoelectric cooler (TEC) arrangement," and an "LD submount disposed on the TEC arrangement." These are common components in semiconductor laser modules for thermal management.
  - Claim 7: The existence of "a second LD disposed on the LD mounting surface" and "the second LD being configured to emit an associated channel wavelength different from that of the first LD." Multi-channel laser modules are known, and this reference might disclose such an arrangement.
  - Claim 15 (and its dependent claims): The broad description of a "multi-channel transmitter optical subassembly (TOSA) arrangement coupled to the PCBA" and comprising basic LD elements.