Derivative works

Defensive Disclosure and Prior Art Generation for US Patent 10,123,456

Publication Date: May 3, 2026
Reference Patent: US 10,123,456 B2
Subject: Derivative Methods and Apparatus for Additively Manufactured, Integrated Phase Change Material (PCM) Thermal Management Systems.
Disclaimer: This document is intended to enter the public domain as prior art. The disclosures herein are conceptual and provided to enable a person having ordinary skill in the art (POSA) to build upon the concepts described in US 10,123,456.

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I. Derivative Works Based on Material & Component Substitution

1.1. High-Temperature Polymer-Matrix Composite (PMC) Heat Sink

• Derivation Axis: Material & Component Substitution
• Enabling Description: This variation replaces the metallic (e.g., aluminum) structure of the heat sink and integral component with a high-temperature, thermally-conductive polymer composite. The additive manufacturing process used is Fused Filament Fabrication (FFF) or Selective Laser Sintering (SLS) with a carbon-fiber-reinforced Polyether Ether Ketone (PEEK) or similar high-performance thermoplastic. The carbon fibers are oriented during the printing process to maximize thermal conductivity along specific heat paths from the heat source to the PCM. The Phase Change Material used is a high-temperature hydrated salt (e.g., Sodium Sulfate Decahydrate, melting point ~32°C, but higher temp variants exist) or a metallic alloy with a low melting point, such as a Bismuth-Tin alloy (melting point ~138°C), selected to match the operational temperature of the PEEK composite. The fill and vent ports are sealed using a threaded PEEK plug with a high-temperature polymer O-ring, torqued to specification, instead of a metallic expansion plug.
• Diagram:

  graph TD
      subgraph FFF/SLS Additive Manufacturing Process
          A[Carbon-Fiber PEEK Filament/Powder] --> B{Print Head / Laser};
          B --> C{Monolithic Structure};
      end
      subgraph Monolithic Structure [PMC Heat Sink]
          C -- forms --> D[Integrated Structural Component];
          C -- forms --> E[Lower/Upper Shells];
          C -- forms --> F[Internal CF-PEEK Matrix];
      end
      G[Bismuth-Tin Alloy PCM] --> H{Fill Port};
      H -- inserted into --> F;
      I[Threaded PEEK Plug] --> H;
      I --> J[Seal];
  

1.2. Ceramic Matrix Composite (CMC) Heat Sink for Hypersonic Applications

• Derivation Axis: Material & Component Substitution
• Enabling Description: For ultra-high temperature environments such as hypersonic vehicle leading edges, the heat sink and integral structural component are manufactured from a Ceramic Matrix Composite like Carbon-fiber-reinforced Silicon Carbide (C/SiC). The additive manufacturing process is Binder Jetting followed by a Chemical Vapor Infiltration (CVI) process to densify the SiC matrix around the carbon fiber preform. The internal matrix is a triply periodic minimal surface (TPMS) gyroid structure to maximize surface area for a given volume. The PCM is a high-melting-point metallic alloy, such as a eutectic Silver-Copper alloy (melting point ~780°C), capable of absorbing immense thermal loads during atmospheric re-entry or sustained hypersonic flight. Sealing is achieved by Electron Beam Welding (EBW) a C/SiC cap over the fill ports after the PCM is introduced in a vacuum chamber.
• Diagram:

  sequenceDiagram
      participant CAD as CAD Model (Gyroid Matrix)
      participant BinderJet as Binder Jetting AM
      participant CVI as Chemical Vapor Infiltration
      participant PCMFill as Vacuum Chamber PCM Fill
      participant EBW as Electron Beam Welding
  
      CAD ->> BinderJet: Export 3D model of C/SiC preform
      BinderJet-->>CVI: Transfer printed preform
      CVI->>CVI: Densify with SiC matrix
      CVI-->>PCMFill: Transfer monolithic CMC heat sink
      PCMFill->>PCMFill: Insert Ag-Cu eutectic alloy PCM
      PCMFill-->>EBW: Transfer filled heat sink
      EBW->>EBW: Weld C/SiC cap onto fill port
      EBW-->>Note: Final hermetically sealed component
  

II. Derivative Works Based on Operational Parameter Expansion

2.1. MEMS-Scale Integrated PCM Heat Sink for On-Chip Hotspot Cooling

• Derivation Axis: Operational Parameter Expansion (Nanoscale)
• Enabling Description: This disclosure describes a heat sink monolithically integrated into the silicon or Gallium Nitride (GaN) substrate of a microprocessor or RF power amplifier. The manufacturing process is a combination of Deep Reactive-Ion Etching (DRIE) to create the cavities for the shells and internal matrix (consisting of nanoscale silicon pins) and Atomic Layer Deposition (ALD) to build up the upper shell and seal the structure. The PCM is a low-melting-point organic compound, such as eicosane (melting point ~36-38°C), chosen to absorb thermal spikes from processing cores or transistors. The volume of PCM is on the order of picoliters. The structure is built directly on the backside of the integrated circuit die, providing immediate thermal relief to localized hotspots.
• Diagram:

  graph LR
      A[Silicon Wafer] -- DRIE --> B(Etched Micro-Cavities);
      B -- PCM Deposition --> C(Fill with Eicosane PCM);
      C -- ALD --> D(Deposit Sealing Cap Layer);
      D -- integrated with --> E[Microprocessor Core];
      F[Thermal Hotspot] -- heat --> D;
      D -- transfers heat to --> C;
      C -- phase change --> G(Absorb & Store Heat);
  

2.2. Industrial-Scale Structural Thermal Mass for Buildings

• Derivation Axis: Operational Parameter Expansion (Industrial Scale)
• Enabling Description: This application integrates the PCM heat sink concept into large-scale structural steel or concrete beams for building construction. The additive manufacturing process is a large-format Wire Arc Additive Manufacturing (WAAM) for steel or a contour crafting method for concrete. The internal volume of a structural I-beam is printed with an internal matrix of plates, creating sealed chambers. These chambers are filled with a bio-based fatty acid PCM (e.g., coconut oil, melting point ~24°C) to act as a passive thermal regulator for the building, absorbing heat during the day and releasing it at night. This reduces HVAC loads. The beam itself is the heat sink and the building component. Fill ports are standard pipe fittings welded or cast in place and sealed with threaded caps.
• Diagram:

  classDiagram
      class StructuralBeam {
          +string material (Steel/Concrete)
          +dimensions dimensions
          +load_capacity
      }
      class IntegratedPCMReservoir {
          <<monolithic>>
          +pcm_material: Bio-Fatty-Acid
          +melting_point: 24C
          +volume
          +internal_matrix: Plate[]
      }
      class Building {
          +StructuralBeam[] beams
          +regulateTemperature()
      }
      Building "1" *-- "many" StructuralBeam
      StructuralBeam "1" -- "1" IntegratedPCMReservoir : contains
  

III. Derivative Works Based on Cross-Domain Application

3.1. AgTech: Thermal Regulation for Vertical Farm LED Grow Lights

• Derivation Axis: Cross-Domain Application (AgTech)
• Enabling Description: In vertical farming, LED lighting generates significant heat that can stress plants and increase cooling costs. This disclosure describes additively manufacturing the entire LED light fixture housing out of aluminum (via Selective Laser Melting) as a single piece. This housing is the "structural component" and is printed with an integrated lower shell, upper shell, and an internal matrix of pins directly behind the LED mounting plate. The PCM is a paraffin wax with a melting point of ~45-50°C. During the "lights-on" cycle, the PCM absorbs waste heat, stabilizing the LED junction temperature and improving efficiency and lifespan. During the "lights-off" cycle, the stored heat passively radiates away. This reduces the need for active fan or water cooling systems, creating a more robust and energy-efficient system.
• Diagram:

  stateDiagram-v2
      [*] --> LightsOff
      LightsOff: PCM is Solid
      LightsOff --> LightsOn : Timer Trigger
      LightsOn: LED generates heat
      state PCM_State {
          Solid --> Melting : Heat absorption > 50°C
          Melting --> Solid : Heat dissipation < 50°C
      }
      LightsOn --> LightsOff : Timer Trigger
  

3.2. High-Performance Computing (HPC): Passively Cooled Server Rack Chassis

• Derivation Axis: Cross-Domain Application (HPC)
• Enabling Description: The structural chassis of a server rack blade is additively manufactured as a single component. The side walls of the chassis, which typically serve only a structural purpose, are printed with an integrated PCM heat sink. The PCM is a non-flammable, dielectric engineered fluid with a phase change temperature of ~60°C. This integrated thermal capacitor absorbs peak thermal loads during high-utilization computing tasks, smoothing the overall thermal profile of the server blade. This allows the primary data center cooling system to be sized for the average thermal load rather than the peak load, resulting in significant energy savings. The internal matrix is a complex lattice structure designed via topological optimization to maximize heat transfer from the blade's processors to the PCM-filled chassis walls.
• Diagram:

  flowchart TD
      subgraph ServerBlade
          CPU[CPU/GPU] -- Heat --> ConductionPlate[Thermal Conduction Plate]
          ConductionPlate -- Heat --> ChassisWall[Monolithic AM Chassis Wall]
      end
      subgraph ChassisWall
          Matrix[Internal Lattice Matrix]
          PCM[Dielectric PCM @ 60°C]
      end
      ChassisWall -- contains --> Matrix
      Matrix -- contains --> PCM
      CPU -- Peak Load --> PCM_Absorb(PCM absorbs heat via phase change)
      CPU -- Idle --> PCM_Release(PCM releases heat to ambient air)
  

3.3. Downhole Drilling: MWD Electronics Module Survivability

• Derivation Axis: Cross-Domain Application (Oil & Gas)
• Enabling Description: The cylindrical pressure housing for Measurement-While-Drilling (MWD) electronics is additively manufactured from Inconel 718. The housing itself (the structural component) is printed with an integral, hermetically sealed cavity lining its inner wall. This cavity contains a high-temperature PCM (e.g., a eutectic salt mixture like LiF-NaF-KF, melting point >450°C) and an internal matrix of parallel plates. As the MWD tool is lowered into a borehole, ambient temperatures can exceed 200°C. The PCM absorbs the immense heat conducted through the housing, maintaining the internal electronics within their operational temperature limits (~150°C) for a longer duration, extending the mission time and preventing component failure.
• Diagram:

  graph TD
      A(External Borehole Environment @ >200°C) -- Heat --> B[AM Inconel 718 Pressure Housing];
      subgraph B
          C{PCM Cavity w/ Plate Matrix};
      end
      B -- Conduction --> C;
      C -- Heat --> D[Eutectic Salt PCM];
      D -- Melts --> E(Thermal Energy Stored);
      F[Internal MWD Electronics @ <150°C] -- Protected by --> B;
  

IV. Derivative Works Based on Integration with Emerging Tech

4.1. AI-Optimized Generative Design of Internal Matrix

• Derivation Axis: Integration with Emerging Tech (AI)
• Enabling Description: Instead of a simple pin or plate matrix, the internal geometry is designed by a generative AI algorithm. The AI model takes a thermal load map from a specific electronic component (e.g., a finite element analysis output) as input. Its objective function is to maximize the heat transfer rate into the PCM while minimizing mass and ensuring manufacturability via the chosen AM process. The resulting geometry is a non-uniform, organic, lattice-like structure with varying strut densities and thicknesses, precisely tailored to the thermal signature of the application. This "asymmetric thermal matrix" is then directly fed to the AM printer.
• Diagram:

  sequenceDiagram
      participant FEA as Finite Element Analysis
      participant GenAI as Generative AI Model
      participant AM as Additive Manufacturer
  
      FEA->>GenAI: Provide Thermal Load Map (Input)
      GenAI->>GenAI: Run Topological Optimization
      GenAI->>AM: Export Optimized 3D Lattice Geometry
      AM->>AM: Print monolithic heat sink with AI-designed matrix
  

4.2. IoT-Enabled Digital Twin with Embedded Sensing

• Derivation Axis: Integration with Emerging Tech (IoT)
• Enabling Description: During the additive manufacturing process, fiber optic sensors (for temperature and strain) and piezoelectric transducers (for pressure and acoustic monitoring of phase change) are embedded directly within the heat sink structure. These sensors are routed through internal micro-channels created during the build. The sensors stream real-time data to a cloud-based digital twin of the heat sink. This allows for predictive maintenance (e.g., detecting PCM degradation or micro-leaks) and performance optimization by tracking the exact state-of-charge of the thermal battery.
• Diagram:

  flowchart LR
      subgraph PhysicalAsset
          A[AM Heat Sink]
          B(Embedded Fiber Optic Sensor)
          C(Embedded Piezoelectric Sensor)
          A -- contains --> B
          A -- contains --> C
      end
      subgraph DigitalTwin
          D[3D Thermal Model]
          E[Performance Dashboard]
          F[Predictive Maintenance AI]
      end
      B -- Temp/Strain Data --> D
      C -- Pressure/Phase Data --> D
      D --> E
      D --> F
  

V. Derivative Works Based on "Inverse" or Failure Mode

5.1. Sacrificial Failure Point for Over-Pressure Venting

• Derivation Axis: The "Inverse" or Failure Mode
• Enabling Description: The internal matrix is designed with a specific, structurally weaker "sacrificial zone." This zone is additively manufactured with a lower density or thinner geometry than the rest of the matrix. If the PCM undergoes unexpected thermal expansion beyond its design limits, the resulting pressure will cause the sacrificial zone to controllably fracture. This fracture opens a channel to a secondary, empty containment volume also printed monolithically within the structural component. This prevents a catastrophic rupture of the primary heat sink shell and allows for a "fail-safe" release of pressure, containing the PCM leak within the overall component. The failure can be detected by embedded pressure sensors.
• Diagram:

  stateDiagram-v2
      state "Normal Operation" as Normal {
          [*] --> Pressurized
          Pressurized: Pressure < P_max
      }
      state "Failure Mode" as Failure {
          Venting: Sacrificial zone fractures
          Contained: PCM flows to secondary volume
      }
      Normal --> Failure : Pressure > P_max
      Failure --> [*]
  

VI. Combination Prior Art Scenarios with Open-Source Standards

1. Combination with OpenFOAM and STEP (ISO 10303): An enabling disclosure for a method of manufacturing a heat sink where the AI-generated internal matrix (Derivative 4.1) is exported as an open-standard STEP file. This file is then imported into the open-source Computational Fluid Dynamics (CFD) software, OpenFOAM, to run a thermal simulation and validate that the design meets performance requirements before committing to the expensive additive manufacturing process. The validated STEP file is the final manufacturing instruction. This combines the patent's core method with open-source design and validation tools.

2. Combination with MQTT and Prometheus: An enabling disclosure for an IoT-enabled heat sink (Derivative 4.2) where the embedded sensors publish their data (temperature, pressure, strain) using the lightweight, open-source MQTT protocol. An MQTT broker collects this data and exposes it to a Prometheus time-series database via an exporter. This allows system operators to use open-source monitoring and alerting tools like Prometheus and Grafana to track the health and performance of a fleet of these thermal management components in real time.

3. Combination with Linux (Yocto Project) and ROS: An enabling disclosure for a robotic application where the structural arm of a robot is the "structural component" with the integrated PCM heat sink (similar to Derivative 2.2). The robot runs a custom Linux distribution built with the Yocto Project. The embedded IoT sensors (Derivative 4.2) in the arm publish data to the Robot Operating System (ROS) message bus. A ROS node subscribes to this thermal data and adjusts the robot's operational parameters (e.g., slowing down motor movements) to prevent overheating, creating a thermally-aware, self-regulating robotic system based entirely on open-source software standards.